DE602005016887D1 - Poliersystem mit hochverzweigtem polymer - Google Patents

Poliersystem mit hochverzweigtem polymer

Info

Publication number
DE602005016887D1
DE602005016887D1 DE602005016887T DE602005016887T DE602005016887D1 DE 602005016887 D1 DE602005016887 D1 DE 602005016887D1 DE 602005016887 T DE602005016887 T DE 602005016887T DE 602005016887 T DE602005016887 T DE 602005016887T DE 602005016887 D1 DE602005016887 D1 DE 602005016887D1
Authority
DE
Germany
Prior art keywords
polishing system
branched polymer
high branched
polymer
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602005016887T
Other languages
German (de)
English (en)
Inventor
Kevin Moeggenborg
Fred Sun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of DE602005016887D1 publication Critical patent/DE602005016887D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE602005016887T 2004-01-09 2005-01-05 Poliersystem mit hochverzweigtem polymer Expired - Lifetime DE602005016887D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/755,154 US7255810B2 (en) 2004-01-09 2004-01-09 Polishing system comprising a highly branched polymer
PCT/US2005/000187 WO2005071031A1 (en) 2004-01-09 2005-01-05 Polishing system comprising a highly branched polymer

Publications (1)

Publication Number Publication Date
DE602005016887D1 true DE602005016887D1 (de) 2009-11-12

Family

ID=34739520

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005016887T Expired - Lifetime DE602005016887D1 (de) 2004-01-09 2005-01-05 Poliersystem mit hochverzweigtem polymer

Country Status (11)

Country Link
US (1) US7255810B2 (https=)
EP (1) EP1702015B1 (https=)
JP (1) JP5006048B2 (https=)
KR (1) KR101049981B1 (https=)
CN (1) CN1906260A (https=)
AT (1) ATE444342T1 (https=)
DE (1) DE602005016887D1 (https=)
IL (1) IL176312A (https=)
MY (1) MY142089A (https=)
TW (1) TWI268199B (https=)
WO (1) WO2005071031A1 (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7563383B2 (en) 2004-10-12 2009-07-21 Cabot Mircroelectronics Corporation CMP composition with a polymer additive for polishing noble metals
US20060090692A1 (en) * 2004-10-29 2006-05-04 Dominguez Juan E Generating nano-particles for chemical mechanical planarization
US20070077865A1 (en) * 2005-10-04 2007-04-05 Cabot Microelectronics Corporation Method for controlling polysilicon removal
JP5240478B2 (ja) * 2008-02-18 2013-07-17 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP5576409B2 (ja) 2009-03-13 2014-08-20 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティド ナノダイヤモンドを用いた化学機械平坦化
JP5563269B2 (ja) * 2009-10-09 2014-07-30 四日市合成株式会社 ガラスポリッシング加工用組成物
JP6101421B2 (ja) * 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド 銅または銅合金用エッチング液
EP2518120A1 (en) 2011-04-28 2012-10-31 Basf Se A chemical mechanical polishing (cmp) composition comprising a polymeric polyamine
US10407594B2 (en) 2011-03-22 2019-09-10 Basf Se Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine
JP5710353B2 (ja) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR20140034231A (ko) * 2011-05-24 2014-03-19 가부시키가이샤 구라레 화학 기계 연마용 부식 방지제, 화학 기계 연마용 슬러리, 및 화학 기계 연마 방법
SG11201509209VA (en) * 2013-05-15 2015-12-30 Basf Se Chemical-mechanical polishing compositions comprising polyethylene imine
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
US20150104940A1 (en) * 2013-10-11 2015-04-16 Air Products And Chemicals Inc. Barrier chemical mechanical planarization composition and method thereof
JP6435689B2 (ja) * 2014-07-25 2018-12-12 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP6947827B2 (ja) 2016-09-23 2021-10-13 サン−ゴバン セラミックス アンド プラスティクス，インコーポレイティドＳａｉｎｔ−Ｇｏｂａｉｎ Ｃｅｒａｍｉｃｓ Ａｎｄ Ｐｌａｓｔｉｃｓ， Ｉｎｃ． 化学的機械的平坦化スラリーおよびその形成方法
JP2018074048A (ja) * 2016-10-31 2018-05-10 花王株式会社 シリコンウェーハ用研磨液組成物
AU2019297408B2 (en) 2018-07-04 2024-12-19 Basf Se Iron chelators as activators in alkaline flotation circuits
KR20210142582A (ko) * 2019-03-22 2021-11-25 주식회사 다이셀 반도체 배선 연마용 조성물
KR102745114B1 (ko) * 2021-03-18 2024-12-19 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
KR20220130544A (ko) * 2021-03-18 2022-09-27 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법
KR102782549B1 (ko) * 2021-08-23 2025-03-14 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944836A (en) 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4789648A (en) 1985-10-28 1988-12-06 International Business Machines Corporation Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
US4671851A (en) 1985-10-28 1987-06-09 International Business Machines Corporation Method for removing protuberances at the surface of a semiconductor wafer using a chem-mech polishing technique
US4956313A (en) 1987-08-17 1990-09-11 International Business Machines Corporation Via-filling and planarization technique
US4910155A (en) 1988-10-28 1990-03-20 International Business Machines Corporation Wafer flood polishing
US5157876A (en) 1990-04-10 1992-10-27 Rockwell International Corporation Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing
US5137544A (en) 1990-04-10 1992-08-11 Rockwell International Corporation Stress-free chemo-mechanical polishing agent for II-VI compound semiconductor single crystals and method of polishing
US5244534A (en) 1992-01-24 1993-09-14 Micron Technology, Inc. Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs
US5209816A (en) 1992-06-04 1993-05-11 Micron Technology, Inc. Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing
US5225034A (en) 1992-06-04 1993-07-06 Micron Technology, Inc. Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
US5391258A (en) 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5340370A (en) 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing
JP3397501B2 (ja) 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5527423A (en) 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
US5741626A (en) 1996-04-15 1998-04-21 Motorola, Inc. Method for forming a dielectric tantalum nitride layer as an anti-reflective coating (ARC)
US5767014A (en) * 1996-10-28 1998-06-16 International Business Machines Corporation Integrated circuit and process for its manufacture
US6290736B1 (en) 1999-02-09 2001-09-18 Sharp Laboratories Of America, Inc. Chemically active slurry for the polishing of noble metals and method for same
ATE405618T1 (de) 1999-08-13 2008-09-15 Cabot Microelectronics Corp Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung
US6855266B1 (en) 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
AU6537000A (en) 1999-08-13 2001-03-13 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
US6379223B1 (en) 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6468589B2 (en) 2000-02-02 2002-10-22 Jsr Corporation Composition for film formation and insulating film
KR100738774B1 (ko) 2000-08-28 2007-07-12 제이에스알 가부시끼가이샤 화학 기계 연마 스토퍼막, 그의 제조 방법 및 화학 기계연마 방법
EP1197587B1 (en) 2000-10-13 2006-09-20 Shipley Co. L.L.C. Seed layer repair and electroplating bath
CN1255854C (zh) * 2001-01-16 2006-05-10 卡伯特微电子公司 含有草酸铵的抛光系统及方法
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
US6589100B2 (en) * 2001-09-24 2003-07-08 Cabot Microelectronics Corporation Rare earth salt/oxidizer-based CMP method

Also Published As

Publication number Publication date
CN1906260A (zh) 2007-01-31
ATE444342T1 (de) 2009-10-15
JP5006048B2 (ja) 2012-08-22
TW200531787A (en) 2005-10-01
EP1702015A1 (en) 2006-09-20
KR101049981B1 (ko) 2011-07-19
IL176312A0 (en) 2006-10-05
US20050150598A1 (en) 2005-07-14
WO2005071031A1 (en) 2005-08-04
IL176312A (en) 2010-11-30
EP1702015B1 (en) 2009-09-30
US7255810B2 (en) 2007-08-14
TWI268199B (en) 2006-12-11
KR20060121292A (ko) 2006-11-28
MY142089A (en) 2010-09-15
JP2007519783A (ja) 2007-07-19

Similar Documents

Publication Publication Date Title
DE602005016887D1 (de) Poliersystem mit hochverzweigtem polymer
ATE382076T1 (de) Mit positiv geladenen polyelektrolyten behandelte anionische schleifmittelteilchen für das chemomechanische polieren
WO2001031580A3 (en) Methods and devices for identifying patterns in biological systems
TW200501277A (en) Nanofiber surfaces for use in enhanced surface area applications
TW200704477A (en) Polishing pad comprising magnetically sensitive particles and method for the use thereof
ATE355933T1 (de) Schleifartikel zur modifizierung einer halbleiterscheibe
WO2008079326A3 (en) Methods for using and identifying modulators of delta-like 4
ATE311958T1 (de) Artikel mit flixiertem schleifmittel zum verändern einer halbleiterscheibe
DE60304181D1 (de) Cmp systeme und verfahren zur verwendung von aminoenthaltenden polymerisaten
DE50105338D1 (de) Neuartige polymerbindersysteme mit ionischen flüssigkeiten
ATE516791T1 (de) Massagevorrichtung mit verformbaren armen
DE60111570D1 (de) Isoindolin-1-on als glukokinaseaktivatoren
ATE236622T1 (de) Blockcopolymere
MY143215A (en) Multifocal lenses for pre-presbyopic individuals
PL369096A1 (en) Absorbent wound dressing containing a hydrogel layer
ATE320457T1 (de) Polyurethanlösungen mit alkoxysilanstruktureinheiten
ATE529010T1 (de) System zur individualisierung eines schuhes
AU2003242942A1 (en) Polishing composition containing conducting polymer
MEP11808A (en) Cross-linkable base layer for interlinings applied in a double-dot method
DK1567641T3 (da) Proaerolysin indeholdende proteaseaktiveringssekvenser og fremgangsmåder til anvendelse til behandling af prostatacancer.
ATE318678T1 (de) Abrasives produkt
WO2001031579A3 (en) Methods and devices for identifying patterns in biological patterns
TW200624527A (en) A cmp composition with a polymer additive for polishing noble metals
WO2002059822A3 (en) Methods of identifying patterns in biological systems and uses thereof
IL179441A (en) Method of measuring the activity of egln enzyme and of identifying an agent that modulates activity of said enzyme

Legal Events

Date Code Title Description
8364 No opposition during term of opposition