DE602005015064D1 - Verfahren und System zur vertikalen optischen Kopplung auf einem Halbleitersubstrat - Google Patents

Verfahren und System zur vertikalen optischen Kopplung auf einem Halbleitersubstrat

Info

Publication number
DE602005015064D1
DE602005015064D1 DE602005015064T DE602005015064T DE602005015064D1 DE 602005015064 D1 DE602005015064 D1 DE 602005015064D1 DE 602005015064 T DE602005015064 T DE 602005015064T DE 602005015064 T DE602005015064 T DE 602005015064T DE 602005015064 D1 DE602005015064 D1 DE 602005015064D1
Authority
DE
Germany
Prior art keywords
semiconductor substrate
optical coupling
vertical optical
vertical
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005015064T
Other languages
English (en)
Inventor
Ming Fang
Larry R Tullos
Hai Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
STMicroelectronics lnc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics lnc USA filed Critical STMicroelectronics lnc USA
Publication of DE602005015064D1 publication Critical patent/DE602005015064D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE602005015064T 2004-09-30 2005-09-26 Verfahren und System zur vertikalen optischen Kopplung auf einem Halbleitersubstrat Expired - Fee Related DE602005015064D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/955,891 US7389013B2 (en) 2004-09-30 2004-09-30 Method and system for vertical optical coupling on semiconductor substrate

Publications (1)

Publication Number Publication Date
DE602005015064D1 true DE602005015064D1 (de) 2009-08-06

Family

ID=35462433

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005015064T Expired - Fee Related DE602005015064D1 (de) 2004-09-30 2005-09-26 Verfahren und System zur vertikalen optischen Kopplung auf einem Halbleitersubstrat

Country Status (3)

Country Link
US (1) US7389013B2 (de)
EP (1) EP1643280B1 (de)
DE (1) DE602005015064D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101251028B1 (ko) * 2008-04-26 2013-04-04 광주과학기술원 광배선 구조물 및 그 제조방법
US9151917B2 (en) 2008-09-30 2015-10-06 Ytel Photonics Inc. Optical interconnection apparatus and method
KR100975051B1 (ko) * 2008-09-30 2010-08-11 주식회사 와이텔포토닉스 광 연결 장치 및 방법
US20110026882A1 (en) * 2009-07-31 2011-02-03 International Business Machines Corporation Lensed optical connector with passive alignment features
KR101509872B1 (ko) * 2009-11-05 2015-04-06 엘지이노텍 주식회사 광 인쇄회로기판 및 그 제조방법
TWI446036B (zh) 2010-05-24 2014-07-21 Univ Nat Central 光學傳輸模組
US9024408B2 (en) * 2010-12-29 2015-05-05 Stmicroelectronics, Inc. Double side wafer process, method and device
CN102854567B (zh) * 2011-07-01 2016-08-31 鸿富锦精密工业（深圳）有限公司 光纤耦合连接器组件及光纤耦合连接器
US9472695B2 (en) * 2012-04-18 2016-10-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-coupler and method of manufacturing the same
US20130308906A1 (en) * 2012-05-21 2013-11-21 LaXense, Inc. System and method for dense coupling between optical devices and an optical fiber array
US9664858B2 (en) * 2012-12-20 2017-05-30 Intel Corporation Optical photonic circuit coupling
EP3345029A1 (de) * 2015-09-04 2018-07-11 CCS Technology, Inc. Faserkoppler zur kopplung von mindestens einer optischen faser
WO2017044534A1 (en) * 2015-09-11 2017-03-16 Ccs Technology, Inc. Optical coupler for coupling light in/out of an optical receiving/emitting structure
JP6981370B2 (ja) * 2018-06-08 2021-12-15 日本電信電話株式会社 受光装置およびその製造方法
JP7301508B2 (ja) * 2018-08-08 2023-07-03 キヤノン株式会社 接合レンズ、およびそれを有する光学系、および光学機器、および接合レンズの製造方法
US11035752B1 (en) * 2020-02-10 2021-06-15 Psiquantum, Corp. Active alignment of optical die to optical substrates
US11768338B2 (en) * 2021-05-27 2023-09-26 Taiwan Semiconductor Manufacturing Company, Ltd. Optical interconnect structure, package structure and fabricating method thereof

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163953A (en) * 1977-07-07 1979-08-07 Northern Telecom Limited Double heterostructure laser for direct coupling to an optical fiber
JPS60225808A (ja) * 1984-04-25 1985-11-11 Hitachi Ltd 光素子
US4989934A (en) * 1987-11-13 1991-02-05 Kopin Corporation Monolithic integrated transceiver of III-V devices on silicon
JPH0786578B2 (ja) * 1988-06-06 1995-09-20 日本電信電話株式会社 光結合回路
EP0658784A3 (de) * 1991-02-08 1995-08-23 Siemens Ag Optoelektronisches Bauelement zum Ein- und Auskoppeln von Strahlung.
FR2685098B1 (fr) * 1991-12-12 1995-02-10 Andre Schiltz Procede de montage et de couplage optique sur un substrat et substrat equipe d'une fibre optique.
DE4416563C1 (de) * 1994-05-11 1995-07-20 Ant Nachrichtentech Anordnung zur Ankopplung von optoelektronischen Komponenten und Lichtwellenleitern aneinander
JPH0964325A (ja) * 1995-08-23 1997-03-07 Sony Corp 固体撮像素子とその製造方法
US6096998A (en) * 1996-09-17 2000-08-01 Micron Technology, Inc. Method and apparatus for performing thermal reflow operations under high gravity conditions
JP3571909B2 (ja) * 1998-03-19 2004-09-29 キヤノン株式会社 固体撮像装置及びその製造方法
US6115521A (en) * 1998-05-07 2000-09-05 Trw Inc. Fiber/waveguide-mirror-lens alignment device
US6328482B1 (en) * 1998-06-08 2001-12-11 Benjamin Bin Jian Multilayer optical fiber coupler
US6307243B1 (en) * 1999-07-19 2001-10-23 Micron Technology, Inc. Microlens array with improved fill factor
JP2001188107A (ja) * 1999-12-28 2001-07-10 Seiko Epson Corp マイクロレンズ基板の製造方法、マイクロレンズ基板、液晶パネル用対向基板、液晶パネルおよび投射型表示装置
US6932516B2 (en) * 2000-07-19 2005-08-23 Canon Kabushiki Kaisha Surface optical device apparatus, method of fabricating the same, and apparatus using the same
US6626585B1 (en) * 2000-11-16 2003-09-30 Optical Communication Products, Inc. Subassembly for passively aligning an optical fiber with a VCSEL and method of manufacturing the same
AUPR174200A0 (en) * 2000-11-28 2000-12-21 Redfern Integrated Optics Pty Ltd Method and apparatus for attaching an optical fibre to an optical device
US6650823B1 (en) * 2000-12-19 2003-11-18 Intel Corporation Method of creating a photonic via using fiber optic
US6618537B2 (en) * 2002-01-14 2003-09-09 Applied Wdm, Inc. Optical waveguide structures and methods of fabrication
JP2003215388A (ja) * 2002-01-25 2003-07-30 Hitachi Metals Ltd レンズ付き光ファイバー組立体とその製造方法
JP3768901B2 (ja) * 2002-02-28 2006-04-19 松下電器産業株式会社 立体光導波路の製造方法
JP3800135B2 (ja) * 2002-06-18 2006-07-26 セイコーエプソン株式会社 光通信モジュール、光通信モジュールの製造方法および電子機器
US7041528B2 (en) * 2002-07-16 2006-05-09 Analog Devices, Inc. Method for forming a micro-mechanical component in a semiconductor wafer, and a semiconductor wafer comprising a micro-mechanical component formed therein
US6963061B2 (en) * 2002-08-15 2005-11-08 Motorola, Inc. Orthogonal coupled transceiver
TW563264B (en) * 2002-10-11 2003-11-21 Highlink Technology Corp Base of optoelectronic device
JP3896951B2 (ja) * 2002-11-13 2007-03-22 松下電器産業株式会社 光通信用送受光モジュール
JP4249474B2 (ja) * 2002-12-06 2009-04-02 セイコーエプソン株式会社 波長多重チップ間光インターコネクション回路
FR2848677B1 (fr) * 2002-12-17 2005-04-15 Trixell Sas Detecteur de rayonnement x a l'etat solide
JP2004246279A (ja) * 2003-02-17 2004-09-02 Seiko Epson Corp 光モジュール及びその製造方法、光通信装置、光電気混載集積回路、回路基板、電子機器
US6953925B2 (en) * 2003-04-28 2005-10-11 Stmicroelectronics, Inc. Microlens integration
US20050045927A1 (en) * 2003-09-03 2005-03-03 Jin Li Microlenses for imaging devices
US7114906B1 (en) 2004-10-27 2006-10-03 Chuck Baumgarner Hydraulic pallet jack

Also Published As

Publication number Publication date
EP1643280A1 (de) 2006-04-05
US20060067607A1 (en) 2006-03-30
EP1643280B1 (de) 2009-06-24
US7389013B2 (en) 2008-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee