DE602005011745D1 - Herstellungsverfahren für keramische Dickschichtelementgruppen - Google Patents

Herstellungsverfahren für keramische Dickschichtelementgruppen

Info

Publication number
DE602005011745D1
DE602005011745D1 DE602005011745T DE602005011745T DE602005011745D1 DE 602005011745 D1 DE602005011745 D1 DE 602005011745D1 DE 602005011745 T DE602005011745 T DE 602005011745T DE 602005011745 T DE602005011745 T DE 602005011745T DE 602005011745 D1 DE602005011745 D1 DE 602005011745D1
Authority
DE
Germany
Prior art keywords
thick
production method
element groups
ceramic element
film ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005011745T
Other languages
English (en)
Inventor
Stephen D White
Baomin Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palo Alto Research Center Inc
Original Assignee
Palo Alto Research Center Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Palo Alto Research Center Inc filed Critical Palo Alto Research Center Inc
Publication of DE602005011745D1 publication Critical patent/DE602005011745D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Laminated Bodies (AREA)
DE602005011745T 2004-12-20 2005-12-19 Herstellungsverfahren für keramische Dickschichtelementgruppen Active DE602005011745D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/017,325 US7070669B1 (en) 2004-12-20 2004-12-20 Method for forming ceramic thick film element arrays

Publications (1)

Publication Number Publication Date
DE602005011745D1 true DE602005011745D1 (de) 2009-01-29

Family

ID=35874499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005011745T Active DE602005011745D1 (de) 2004-12-20 2005-12-19 Herstellungsverfahren für keramische Dickschichtelementgruppen

Country Status (4)

Country Link
US (1) US7070669B1 (de)
EP (1) EP1672711B1 (de)
JP (1) JP5313431B2 (de)
DE (1) DE602005011745D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7467928B2 (en) * 2002-12-12 2008-12-23 Board Of Trustees Of The University Of Arkansas Microfluidic device utilizing magnetohydrodynamics and method for fabrication thereof
US7401403B2 (en) * 2004-12-20 2008-07-22 Palo Alto Research Center Incorporated Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios
US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
US8623737B2 (en) * 2006-03-31 2014-01-07 Intel Corporation Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
KR100856326B1 (ko) * 2006-07-19 2008-09-03 삼성전기주식회사 레이저 리프트 오프를 이용한 유전체 박막을 갖는 박막 커패시터 내장된 인쇄회로기판 제조방법, 및 이로부터 제조된 박막 커패시터 내장된 인쇄회로기판
US7992287B2 (en) * 2007-11-06 2011-08-09 Xerox Corporation System for thinning a transducer with improved thickness uniformity
JP5399970B2 (ja) * 2010-03-31 2014-01-29 パナソニック株式会社 強誘電体デバイスの製造方法
CN104981889B (zh) * 2013-03-14 2017-03-08 富士电机株式会社 半导体器件的制造方法
EP3671159B1 (de) * 2018-12-21 2022-12-21 Exentis Knowledge GmbH Körper hergestellt durch additives herstellungsverfahren und verfahren zur herstellung des körpers
EP3671160A1 (de) 2018-12-21 2020-06-24 Exentis Knowledge GmbH Formkörper sowie verfahren zur herstellung eines formkörpers
JP2021163799A (ja) * 2020-03-31 2021-10-11 三菱重工業株式会社 誘電体膜の製造方法
WO2023084678A1 (ja) * 2021-11-11 2023-05-19 株式会社芝浦電子 サーミスタ焼結体およびサーミスタ焼結体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4345967A (en) * 1980-03-04 1982-08-24 Cook Melvin S Method of producing thin single-crystal sheets
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
JP3642110B2 (ja) * 1996-06-11 2005-04-27 松下電器産業株式会社 電子部品の製造方法
US6071795A (en) * 1998-01-23 2000-06-06 The Regents Of The University Of California Separation of thin films from transparent substrates by selective optical processing
JP2001085715A (ja) * 1999-09-09 2001-03-30 Canon Inc 半導体層の分離方法および太陽電池の製造方法
US6335263B1 (en) * 2000-03-22 2002-01-01 The Regents Of The University Of California Method of forming a low temperature metal bond for use in the transfer of bulk and thin film materials
JP2002134806A (ja) * 2000-10-19 2002-05-10 Canon Inc 圧電膜型アクチュエータおよび液体噴射ヘッドとその製造方法
JP4387623B2 (ja) * 2000-12-04 2009-12-16 キヤノン株式会社 圧電素子の製造方法
JP2004111939A (ja) * 2002-08-29 2004-04-08 Ngk Insulators Ltd 積層型圧電素子及びその製造方法
US6964201B2 (en) 2003-02-25 2005-11-15 Palo Alto Research Center Incorporated Large dimension, flexible piezoelectric ceramic tapes

Also Published As

Publication number Publication date
EP1672711A2 (de) 2006-06-21
EP1672711A3 (de) 2007-02-07
JP2006179911A (ja) 2006-07-06
US20060130956A1 (en) 2006-06-22
US7070669B1 (en) 2006-07-04
EP1672711B1 (de) 2008-12-17
JP5313431B2 (ja) 2013-10-09

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Legal Events

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