DE602005009786D1 - Laser Bearbeitungsvorrichtung und -verfahren mit Bildaufnahme und -verarbeitungsmittel - Google Patents

Laser Bearbeitungsvorrichtung und -verfahren mit Bildaufnahme und -verarbeitungsmittel

Info

Publication number
DE602005009786D1
DE602005009786D1 DE602005009786T DE602005009786T DE602005009786D1 DE 602005009786 D1 DE602005009786 D1 DE 602005009786D1 DE 602005009786 T DE602005009786 T DE 602005009786T DE 602005009786 T DE602005009786 T DE 602005009786T DE 602005009786 D1 DE602005009786 D1 DE 602005009786D1
Authority
DE
Germany
Prior art keywords
image capture
processing apparatus
processing means
laser processing
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005009786T
Other languages
English (en)
Inventor
Daisuke Katsuta
Mineo Nomoto
Kazushi Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of DE602005009786D1 publication Critical patent/DE602005009786D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE602005009786T 2004-11-12 2005-11-14 Laser Bearbeitungsvorrichtung und -verfahren mit Bildaufnahme und -verarbeitungsmittel Expired - Fee Related DE602005009786D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004328642A JP2006136923A (ja) 2004-11-12 2004-11-12 レーザ加工機及びレーザ加工方法

Publications (1)

Publication Number Publication Date
DE602005009786D1 true DE602005009786D1 (de) 2008-10-30

Family

ID=35788419

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005009786T Expired - Fee Related DE602005009786D1 (de) 2004-11-12 2005-11-14 Laser Bearbeitungsvorrichtung und -verfahren mit Bildaufnahme und -verarbeitungsmittel

Country Status (6)

Country Link
US (1) US20060102608A1 (de)
EP (1) EP1666185B1 (de)
JP (1) JP2006136923A (de)
KR (1) KR20060052609A (de)
CN (1) CN1772428A (de)
DE (1) DE602005009786D1 (de)

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EP1666084A1 (de) 2004-12-01 2006-06-07 Societe de Conseils de Recherches et d'Applications Scientifiques (S.C.R.A.S) SAS Injektionsvorrichtung für einem pharmazeutischen Wirkstoff
US7945087B2 (en) * 2006-06-26 2011-05-17 Orbotech Ltd. Alignment of printed circuit board targets
JP5266236B2 (ja) 2006-10-20 2013-08-21 エフ・イ−・アイ・カンパニー サンプル抽出および取り扱いのための方法および装置
JP5959139B2 (ja) 2006-10-20 2016-08-02 エフ・イ−・アイ・カンパニー Ｓ／ｔｅｍのサンプルを分析する方法
JP4391545B2 (ja) * 2007-03-30 2009-12-24 日立ビアメカニクス株式会社 ワーク加工機
JP4986880B2 (ja) * 2008-02-19 2012-07-25 株式会社 ナノ マイクロマシンやマイクロフライスマシンの工具長補正方法
DE102008011808B4 (de) * 2008-02-29 2012-11-15 Zwiesel Kristallglas Aktiengesellschaft Verfahren und Vorrichtung zum Entfernen der Glasformnähte mit Polieren der Nahtstellen sowie dadurch bearbeitetes Glasprodukt
JP5641835B2 (ja) * 2010-09-10 2014-12-17 株式会社ディスコ 分割方法
EP2564975B1 (de) * 2011-09-05 2014-12-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mit mehreren Lasern und individuell justierbaren Deflektionsmitteln
EP2564972B1 (de) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Markierungsvorrichtung mith mehreren Lasern, Deflektionmitteln und Telescopikmitteln für jeden Laserstrahl
EP2755826B1 (de) * 2011-09-16 2019-05-01 Tri-Star Technologies Laserkapselkennzeichnungssystem und -verfahren
DE102011113756B4 (de) * 2011-09-18 2020-12-31 Mag Ias Gmbh Verfahren und Vorrichtung zur Fertigbearbeitung von Werkstücken
CN103858063B (zh) * 2011-12-14 2016-07-06 松下知识产权经营株式会社 超精密复合加工装置的加工用数据的制作方法及超精密复合加工装置
CN103781590B (zh) * 2011-12-14 2016-07-06 松下知识产权经营株式会社 超精密复合加工装置中的加工机构的判断方法及超精密复合加工装置
US10613513B2 (en) 2013-02-11 2020-04-07 The Aerospace Corporation Systems and methods for modifying material substrates
US10838406B2 (en) * 2013-02-11 2020-11-17 The Aerospace Corporation Systems and methods for the patterning of material substrates
JP6299111B2 (ja) * 2013-08-28 2018-03-28 オムロン株式会社 レーザ加工装置
DE102013019156A1 (de) * 2013-11-14 2015-05-21 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Erzeugen dynamischer Scannerfiguren zum Bearbeiten eines Werkstücks
JP5952875B2 (ja) * 2014-09-30 2016-07-13 株式会社片岡製作所 レーザ加工機、レーザ加工機のワーク歪補正方法
CN104527053A (zh) * 2014-11-05 2015-04-22 讯创(天津)电子有限公司 三维金属化天线电缆的激光多点自动焊封方法及装置
CN104439726B (zh) * 2014-11-19 2017-01-25 苏州德龙激光股份有限公司 激光实时纠偏装置及其纠偏方法
DE102016001768B4 (de) 2015-02-23 2020-06-18 Fanuc Corporation Laserbearbeitungssystem mit zeitangepasster Abgabebefehlsschaltung
JP6570921B2 (ja) * 2015-03-16 2019-09-04 ビアメカニクス株式会社 レーザ穴あけ加工条件の設定方法及びレーザ加工機
CN105414747B (zh) * 2015-12-01 2017-06-23 武汉凌云光电科技有限责任公司 一种高效的机器视觉辅助激光加工方法
US10242842B2 (en) * 2016-03-25 2019-03-26 Hitachi High-Tech Science Corporation Method for cross-section processing and observation and apparatus therefor
CN105867297B (zh) * 2016-03-30 2018-10-23 维嘉数控科技（苏州）有限公司 机械平台的坐标补偿方法及装置
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
US10145672B2 (en) * 2017-01-24 2018-12-04 Lithoptek LLC Detection of position, orientation and scale of work pieces using retroreflective surfaces
JP2019098355A (ja) * 2017-11-30 2019-06-24 日東電工株式会社 長尺フィルムのレーザ加工方法
CN108161217B (zh) * 2018-02-11 2024-02-13 广州新可激光设备有限公司 一种让位型同轴影像激光打标机及其打标方法
EP3842188A4 (de) * 2018-08-24 2022-06-08 The University of Tokyo Roboterassistenzvorrichtung und roboterassistenzsystem
CN109702321A (zh) * 2018-12-05 2019-05-03 上海砺晟光电技术有限公司 基于结构光的激光切割头防撞预警系统及方法
EP3797916A1 (de) * 2019-09-27 2021-03-31 Grob-Werke GmbH & Co. KG Vorrichtung und verfahren zum verschweissen von leiterenden eines bauteils einer elektrischen maschine
CN110995986B (zh) * 2019-11-21 2021-08-31 深圳市德沃先进自动化有限公司 一种飞拍方法、系统以及芯片键合方法、系统
KR20220039966A (ko) * 2020-09-22 2022-03-30 삼성디스플레이 주식회사 빔 교정부를 포함하는 레이저 장치 및 이를 이용한 레이저 조사 방법
LV15634B (lv) * 2020-11-11 2023-02-20 Weedbot, Sia Tehnoloģija un iekārta lāzera pozicionēšanai
CN112238294B (zh) * 2020-12-18 2021-04-02 钧迪智能装备科技(苏州)有限公司 一种光处理工件的光处理及加工方法
CN112722820B (zh) * 2020-12-18 2023-02-10 钧迪智能装备科技(苏州)有限公司 一种光处理工件的定位、光处理及加工方法
CN112570920A (zh) * 2020-12-23 2021-03-30 武汉艾特艾迪汽车科技有限公司 一种芯片引脚焊接方法、设备及存储介质
CN112775025B (zh) * 2020-12-28 2022-11-18 广东利扬芯片测试股份有限公司 条状芯片智能打点系统及方法
CN113449393B (zh) * 2021-06-25 2024-03-29 西安市群健航空精密制造有限公司 一种阵列孔加工方法
CN114260577B (zh) * 2021-12-03 2024-01-05 重庆海尔制冷电器有限公司 冰箱激光打码系统及其控制方法
CN114248003B (zh) * 2021-12-31 2024-01-16 普聚智能系统（苏州）有限公司 一种微零件激光加工的工艺方法
CN115285697A (zh) * 2022-08-01 2022-11-04 深圳市灵动通科技有限公司 一种智能卡生产设备的工作方法及其设备
CN116100154B (zh) * 2022-12-29 2023-08-11 深圳大学 一种多芯光纤串联并联集成微结构阵列的飞秒激光制备方法

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JP3756723B2 (ja) * 1999-07-27 2006-03-15 松下電工株式会社 プリント配線板の加工方法
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JP2005230886A (ja) * 2004-02-20 2005-09-02 Hitachi Via Mechanics Ltd Ｎｃ制御のレーザ加工機

Also Published As

Publication number Publication date
JP2006136923A (ja) 2006-06-01
EP1666185A1 (de) 2006-06-07
CN1772428A (zh) 2006-05-17
KR20060052609A (ko) 2006-05-19
EP1666185B1 (de) 2008-09-17
US20060102608A1 (en) 2006-05-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee