DE602005000512D1 - Verfahren und vorrichtung zum montieren von bauelementen - Google Patents

Verfahren und vorrichtung zum montieren von bauelementen

Info

Publication number
DE602005000512D1
DE602005000512D1 DE602005000512T DE602005000512T DE602005000512D1 DE 602005000512 D1 DE602005000512 D1 DE 602005000512D1 DE 602005000512 T DE602005000512 T DE 602005000512T DE 602005000512 T DE602005000512 T DE 602005000512T DE 602005000512 D1 DE602005000512 D1 DE 602005000512D1
Authority
DE
Germany
Prior art keywords
mounting components
mounting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005000512T
Other languages
English (en)
Other versions
DE602005000512T2 (de
Inventor
Osamu Okuda
Takeyuki Kawase
Kazuyuki Yoshidomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE602005000512D1 publication Critical patent/DE602005000512D1/de
Application granted granted Critical
Publication of DE602005000512T2 publication Critical patent/DE602005000512T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE602005000512T 2004-06-03 2005-06-02 Verfahren und vorrichtung zum montieren von bauelementen Expired - Fee Related DE602005000512T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004165976A JP4128156B2 (ja) 2004-06-03 2004-06-03 部品実装方法及び装置
JP2004165976 2004-06-03
PCT/JP2005/010530 WO2005120147A1 (en) 2004-06-03 2005-06-02 Component mounting method and apparatus

Publications (2)

Publication Number Publication Date
DE602005000512D1 true DE602005000512D1 (de) 2007-03-15
DE602005000512T2 DE602005000512T2 (de) 2008-01-31

Family

ID=35063237

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005000512T Expired - Fee Related DE602005000512T2 (de) 2004-06-03 2005-06-02 Verfahren und vorrichtung zum montieren von bauelementen

Country Status (6)

Country Link
US (1) US20080250636A1 (de)
EP (1) EP1671525B1 (de)
JP (1) JP4128156B2 (de)
CN (1) CN100589688C (de)
DE (1) DE602005000512T2 (de)
WO (1) WO2005120147A1 (de)

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CN101209007A (zh) * 2005-06-27 2008-06-25 松下电器产业株式会社 贴装条件确定方法
JP4860366B2 (ja) * 2006-06-21 2012-01-25 Ｊｕｋｉ株式会社 表面実装装置
WO2009123382A1 (en) * 2008-04-01 2009-10-08 Ads Technologies Co., Ltd. Apparatus for adjusting the degree of freedom using sensor in assembling optical device
CN101755229B (zh) * 2007-10-17 2011-11-09 Ads技术株式会社 在光学装置组装期间使用传感器调节自由度的设备
JP4993614B2 (ja) * 2008-02-29 2012-08-08 東京エレクトロン株式会社 搬送手段のティーチング方法、記憶媒体及び基板処理装置
JP5301329B2 (ja) * 2008-03-31 2013-09-25 Ｊｕｋｉ株式会社 電子部品の実装方法
JP5344145B2 (ja) * 2008-12-25 2013-11-20 澁谷工業株式会社 ボンディング装置における電子部品と基板の位置合わせ方法
CN102342197B (zh) * 2010-03-29 2015-04-01 松下电器产业株式会社 元件安装装置
CN101840572A (zh) * 2010-04-13 2010-09-22 河海大学常州校区 一种基于区域分割的qfp元件位置误差视觉检测方法
JP5597050B2 (ja) * 2010-07-15 2014-10-01 富士機械製造株式会社 基板停止位置制御方法および装置、ならびに基板装着位置制御方法
CN102622046A (zh) * 2011-01-31 2012-08-01 株式会社东芝 便携式计算机的扩展坞
CN102186310B (zh) * 2011-05-05 2013-04-10 深圳创维数字技术股份有限公司 一种定位方法及装置
JP6014315B2 (ja) * 2011-09-30 2016-10-25 ヤマハ発動機株式会社 電子部品装着装置の測定方法
JP5873320B2 (ja) * 2011-12-16 2016-03-01 ヤマハ発動機株式会社 部品実装装置
JP5995307B2 (ja) * 2012-03-27 2016-09-21 Ｊｕｋｉオートメーションシステムズ株式会社 認識装置、認識方法、プログラム及び基板の製造方法
JP5918622B2 (ja) 2012-05-11 2016-05-18 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
JP5852505B2 (ja) 2012-05-14 2016-02-03 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
CN106217038A (zh) 2012-06-28 2016-12-14 环球仪器公司 灵活的装配机械、系统及方法
JP6159124B2 (ja) * 2013-04-04 2017-07-05 ヤマハ発動機株式会社 部品実装装置
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
KR102139402B1 (ko) 2014-02-07 2020-07-29 유니버셜 인스트루먼츠 코퍼레이션 펌프와 모터를 구비한 픽앤드플레이스 헤드
JP6407826B2 (ja) * 2015-09-03 2018-10-17 ファナック株式会社 座標系設定方法、座標系設定装置、及び座標系設定装置を備えたロボットシステム
JP6606982B2 (ja) * 2015-11-04 2019-11-20 セイコーエプソン株式会社 ドット記録装置、検査装置、検査方法
WO2018109828A1 (ja) * 2016-12-13 2018-06-21 株式会社Ｆｕｊｉ 作業ロボットの目的位置補正方法
KR102374227B1 (ko) * 2017-08-28 2022-03-15 가부시키가이샤 신가와 대상물에 대하여 이동체를 직선 이동시키는 장치 및 방법
US10589423B2 (en) * 2018-06-18 2020-03-17 Shambhu Nath Roy Robot vision super visor for hybrid homing, positioning and workspace UFO detection enabling industrial robot use for consumer applications
KR102432607B1 (ko) * 2018-07-25 2022-08-16 야마하하쓰도키 가부시키가이샤 표면 실장기
JP7112274B2 (ja) * 2018-07-25 2022-08-03 芝浦メカトロニクス株式会社 実装装置、及び実装装置に用いられる校正基板
CN113785671B (zh) * 2019-05-28 2023-03-07 株式会社富士 基准标记分配方法、基准标记分配设备、安装方法和安装系统
WO2021030973A1 (en) * 2019-08-16 2021-02-25 Abb Schweiz Ag Method and apparatus for determining object location
DE102020115598B3 (de) * 2020-06-12 2021-08-26 Asm Assembly Systems Gmbh & Co. Kg Verfahren und Bestückmaschine zum Bestücken von Bauelementeträgern basierend auf einem Rekalibrieren der Bestückmaschine im realen Bestückbetrieb, Computerprogramm zum Steuern einer Bestückmaschine
CN112330744B (zh) * 2020-11-09 2024-07-12 上海原能细胞生物低温设备有限公司 样本位置确定方法、装置、计算机设备和存储介质
CN113050702B (zh) * 2021-06-02 2021-08-31 中科长光精拓智能装备(苏州)有限公司 柔性载体位置校正装置及方法

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JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
US4812666A (en) * 1987-09-17 1989-03-14 Universal Instruments Corporation Position feedback enhancement over a limited repositioning area for a moveable member
US4980971A (en) * 1989-12-14 1991-01-01 At&T Bell Laboratories Method and apparatus for chip placement
JP3746127B2 (ja) * 1997-01-20 2006-02-15 Ｊｕｋｉ株式会社 部品搭載装置
JP3523480B2 (ja) * 1998-01-27 2004-04-26 株式会社日立ハイテクインスツルメンツ カメラ位置の補正装置
JPH11274799A (ja) * 1998-03-19 1999-10-08 Sanyo Electric Co Ltd 電子部品装着装置
US6591219B1 (en) * 1999-08-18 2003-07-08 Fuji Machine Mfg. Co., Ltd. Method and apparatus for correcting electric-component-mount position
JP4485667B2 (ja) * 2000-08-21 2010-06-23 パナソニック株式会社 部品実装装置のオフセット測定用基板及び部品実装装置のオフセット測定方法
WO2004052072A1 (ja) * 2002-12-02 2004-06-17 Matsushita Electric Industrial Co., Ltd. 部品実装装置及び方法

Also Published As

Publication number Publication date
DE602005000512T2 (de) 2008-01-31
WO2005120147A1 (en) 2005-12-15
JP4128156B2 (ja) 2008-07-30
CN100589688C (zh) 2010-02-10
JP2005347555A (ja) 2005-12-15
EP1671525A1 (de) 2006-06-21
US20080250636A1 (en) 2008-10-16
EP1671525B1 (de) 2007-01-24
CN1860837A (zh) 2006-11-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee