DE602004029561D1 - Mikrowellenplasmaverarbeitungsverfahren - Google Patents

Mikrowellenplasmaverarbeitungsverfahren

Info

Publication number
DE602004029561D1
DE602004029561D1 DE602004029561T DE602004029561T DE602004029561D1 DE 602004029561 D1 DE602004029561 D1 DE 602004029561D1 DE 602004029561 T DE602004029561 T DE 602004029561T DE 602004029561 T DE602004029561 T DE 602004029561T DE 602004029561 D1 DE602004029561 D1 DE 602004029561D1
Authority
DE
Germany
Prior art keywords
plasma processing
microwave plasma
parahydroxybenzoic acid
precipitating
isolating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004029561T
Other languages
English (en)
Inventor
Hideo Kurashima
Akira Kobayashi
Kouji Yamada
Tsunehisa Namiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Seikan Group Holdings Ltd
Original Assignee
Toyo Seikan Kaisha Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Seikan Kaisha Ltd filed Critical Toyo Seikan Kaisha Ltd
Publication of DE602004029561D1 publication Critical patent/DE602004029561D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32266—Means for controlling power transmitted to the plasma
    • H01J37/32284—Means for controlling or selecting resonance mode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Chemical Vapour Deposition (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Drying Of Semiconductors (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
  • Plasma Technology (AREA)
DE602004029561T 2003-04-16 2004-04-12 Mikrowellenplasmaverarbeitungsverfahren Expired - Lifetime DE602004029561D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003112134 2003-04-16
PCT/JP2004/005202 WO2004092443A1 (ja) 2003-04-16 2004-04-12 マイクロ波プラズマ処理方法

Publications (1)

Publication Number Publication Date
DE602004029561D1 true DE602004029561D1 (de) 2010-11-25

Family

ID=33296025

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004029561T Expired - Lifetime DE602004029561D1 (de) 2003-04-16 2004-04-12 Mikrowellenplasmaverarbeitungsverfahren

Country Status (8)

Country Link
US (1) US7170027B2 (de)
EP (1) EP1614770B1 (de)
JP (1) JP4752503B2 (de)
KR (1) KR101101026B1 (de)
CN (1) CN100447297C (de)
AT (1) ATE484607T1 (de)
DE (1) DE602004029561D1 (de)
WO (1) WO2004092443A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5000154B2 (ja) * 2006-02-28 2012-08-15 三菱重工食品包装機械株式会社 充填システム及び方法
EP2151395B1 (de) 2007-06-06 2016-12-07 Toyo Seikan Kaisha, Ltd. Flasche aus biologisch abbaubarem harz und herstellungsverfahren dafür
EP2332167A4 (de) * 2008-10-03 2012-06-20 Veeco Process Equipment Inc Gasphasen-epitaxiesystem
JP5210905B2 (ja) * 2009-01-30 2013-06-12 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP5234791B2 (ja) * 2009-02-19 2013-07-10 日本電信電話株式会社 プラズマ装置
KR101335187B1 (ko) * 2011-11-17 2013-11-29 한국기초과학지원연구원 미세조절이 가능한 스퍼터링 장치 및 이를 이용한 스퍼터링 방법
CN102794146B (zh) * 2012-08-17 2013-12-11 清华大学 一种用于制备纳米材料的微波等离子体反应装置
US9374853B2 (en) 2013-02-08 2016-06-21 Letourneau University Method for joining two dissimilar materials and a microwave system for accomplishing the same
JP6752117B2 (ja) * 2016-11-09 2020-09-09 東京エレクトロン株式会社 マイクロ波プラズマ源およびマイクロ波プラズマ処理装置
US11633710B2 (en) 2018-08-23 2023-04-25 Transform Materials Llc Systems and methods for processing gases
AU2019325589B2 (en) 2018-08-23 2023-08-31 Transform Materials Llc Systems and methods for processing gases

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4691662A (en) * 1983-02-28 1987-09-08 Michigan State University Dual plasma microwave apparatus and method for treating a surface
US4727293A (en) * 1984-08-16 1988-02-23 Board Of Trustees Operating Michigan State University Plasma generating apparatus using magnets and method
JP3020580B2 (ja) * 1990-09-28 2000-03-15 株式会社日立製作所 マイクロ波プラズマ処理装置
US5670224A (en) * 1992-11-13 1997-09-23 Energy Conversion Devices, Inc. Modified silicon oxide barrier coatings produced by microwave CVD deposition on polymeric substrates
TW264601B (de) * 1993-09-17 1995-12-01 Hitachi Seisakusyo Kk
EP1019943A1 (de) * 1997-09-30 2000-07-19 Tetra Laval Holdings & Finance S.A. Vorrichtung und verfahren zur behandlung der innenoberfläche eines kunststoffbehälters mit einer engen öffnung in einem plasma-unterstützten prozess
CA2304613A1 (en) * 1997-09-30 1999-04-08 Jacques Laurent Method and apparatus for treating the inside surface of plastic bottles in a plasma enhanced process
JP2001102309A (ja) * 1998-04-09 2001-04-13 Tokyo Electron Ltd ガス処理装置
JP4222707B2 (ja) * 2000-03-24 2009-02-12 東京エレクトロン株式会社 プラズマ処理装置及び方法、ガス供給リング及び誘電体
JP2002153830A (ja) 2000-11-17 2002-05-28 Hokkai Can Co Ltd プラスチック容器内面の清浄化方法
JP4595276B2 (ja) * 2000-12-25 2010-12-08 東洋製罐株式会社 マイクロ波プラズマ処理方法及び装置

Also Published As

Publication number Publication date
KR101101026B1 (ko) 2011-12-29
WO2004092443A1 (ja) 2004-10-28
EP1614770A1 (de) 2006-01-11
ATE484607T1 (de) 2010-10-15
US7170027B2 (en) 2007-01-30
EP1614770A4 (de) 2007-11-07
EP1614770B1 (de) 2010-10-13
CN100447297C (zh) 2008-12-31
JPWO2004092443A1 (ja) 2006-07-06
CN1777698A (zh) 2006-05-24
KR20060019513A (ko) 2006-03-03
JP4752503B2 (ja) 2011-08-17
US20070000879A1 (en) 2007-01-04

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