DE602004026862D1 - Herstellung von silicium-mikrophonen - Google Patents

Herstellung von silicium-mikrophonen

Info

Publication number
DE602004026862D1
DE602004026862D1 DE602004026862T DE602004026862T DE602004026862D1 DE 602004026862 D1 DE602004026862 D1 DE 602004026862D1 DE 602004026862 T DE602004026862 T DE 602004026862T DE 602004026862 T DE602004026862 T DE 602004026862T DE 602004026862 D1 DE602004026862 D1 DE 602004026862D1
Authority
DE
Germany
Prior art keywords
wafer
layer
major surface
silicon
heavily doped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004026862T
Other languages
English (en)
Inventor
Kitt-Wai Kok
Kok Meng Ong
Kathirgamasundaram Sooriakumar
Bryan Keith Patmon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensfab Pte Ltd
Original Assignee
Sensfab Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensfab Pte Ltd filed Critical Sensfab Pte Ltd
Publication of DE602004026862D1 publication Critical patent/DE602004026862D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2205/00—Details of stereophonic arrangements covered by H04R5/00 but not provided for in any of its subgroups
    • H04R2205/041—Adaptation of stereophonic signal reproduction for the hearing impaired
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
DE602004026862T 2003-05-26 2004-05-26 Herstellung von silicium-mikrophonen Expired - Fee Related DE602004026862D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200302854 2003-05-26
PCT/SG2004/000152 WO2004105428A1 (en) 2003-05-26 2004-05-26 Fabrication of silicon microphones

Publications (1)

Publication Number Publication Date
DE602004026862D1 true DE602004026862D1 (de) 2010-06-10

Family

ID=33476166

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004026862T Expired - Fee Related DE602004026862D1 (de) 2003-05-26 2004-05-26 Herstellung von silicium-mikrophonen

Country Status (9)

Country Link
US (1) US20070065968A1 (de)
EP (1) EP1632105B1 (de)
JP (1) JP2007504782A (de)
KR (1) KR20060034223A (de)
CN (1) CN1813489A (de)
AT (1) ATE466456T1 (de)
DE (1) DE602004026862D1 (de)
MY (1) MY136475A (de)
WO (1) WO2004105428A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG121923A1 (en) * 2004-10-18 2006-05-26 Sensfab Pte Ltd Silicon microphone
KR100599124B1 (ko) * 2005-02-14 2006-07-12 삼성전자주식회사 부유 구조체 제조방법
SG127754A1 (en) * 2005-05-16 2006-12-29 Sensfab Pte Ltd Silicon microphone
JP2010506532A (ja) * 2006-10-11 2010-02-25 メムス テクノロジー ビーエイチディー 極低圧力センサーおよびその製造方法
US8165323B2 (en) 2006-11-28 2012-04-24 Zhou Tiansheng Monolithic capacitive transducer
US20090001499A1 (en) * 2007-06-27 2009-01-01 Honeywell International Inc. Thick active layer for mems device using wafer dissolve process
KR101178989B1 (ko) * 2007-10-30 2012-08-31 아즈빌주식회사 압력 센서 및 그 제조 방법
WO2010139050A1 (en) 2009-06-01 2010-12-09 Tiansheng Zhou Mems micromirror and micromirror array
US8304846B2 (en) * 2009-12-31 2012-11-06 Texas Instruments Incorporated Silicon microphone with integrated back side cavity
US8617960B2 (en) * 2009-12-31 2013-12-31 Texas Instruments Incorporated Silicon microphone transducer
US8316718B2 (en) * 2010-08-23 2012-11-27 Freescale Semiconductor, Inc. MEMS pressure sensor device and method of fabricating same
US9036231B2 (en) 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
CN102740203A (zh) * 2011-04-06 2012-10-17 美律实业股份有限公司 结合式微机电麦克风及其制造方法
US8455288B2 (en) * 2011-09-14 2013-06-04 Analog Devices, Inc. Method for etching material longitudinally spaced from etch mask
CN102611975B (zh) * 2012-01-20 2014-04-23 缪建民 一种采用共晶键合与soi硅片的mems硅麦克风及其制备方法
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US9439017B2 (en) * 2014-02-10 2016-09-06 Infineon Technologies Ag Method for manufacturing a plurality of microphone structures, microphone and mobile device
WO2018204455A1 (en) 2017-05-02 2018-11-08 Medtronic Vascular Inc. Assemblies and methods for sterilizing a wet stored prosthetic heart valve
CN110603205B (zh) * 2017-05-02 2022-08-09 美敦力瓦斯科尔勒公司 用于干组织假体心脏瓣膜的包装
WO2021134688A1 (zh) * 2019-12-31 2021-07-08 瑞声声学科技(深圳)有限公司 一种制作mems驱动器的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US106828A (en) * 1870-08-30 Improved fluting- and sad-iron
US4975390A (en) * 1986-12-18 1990-12-04 Nippondenso Co. Ltd. Method of fabricating a semiconductor pressure sensor
JP2681207B2 (ja) * 1989-02-01 1997-11-26 株式会社 オーディオテクニカ 静電型電気音響変換器の振動板
FR2697675B1 (fr) 1992-11-05 1995-01-06 Suisse Electronique Microtech Procédé de fabrication de transducteurs capacitifs intégrés.
US5573679A (en) * 1995-06-19 1996-11-12 Alberta Microelectronic Centre Fabrication of a surface micromachined capacitive microphone using a dry-etch process
US5627112A (en) * 1995-11-13 1997-05-06 Rockwell International Corporation Method of making suspended microstructures
AU2923397A (en) * 1996-04-18 1997-11-07 California Institute Of Technology Thin film electret microphone
JPH11108783A (ja) * 1997-10-06 1999-04-23 Omron Corp 静電容量型圧力センサ及びその固定構造
DE59907268D1 (de) * 1998-08-11 2003-11-13 Infineon Technologies Ag Verfahren zur Herstellung eines Mikromechanischen Sensors
US6847090B2 (en) * 2001-01-24 2005-01-25 Knowles Electronics, Llc Silicon capacitive microphone
US7298856B2 (en) * 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
JP2003078981A (ja) * 2001-09-05 2003-03-14 Nippon Hoso Kyokai <Nhk> マイクロホン実装回路基板および該基板を搭載する音声処理装置
US6958255B2 (en) * 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
US20050187204A1 (en) * 2002-08-08 2005-08-25 Sankyo Company, Limited Medicinal composition for lowering blood lipid level

Also Published As

Publication number Publication date
EP1632105B1 (de) 2010-04-28
ATE466456T1 (de) 2010-05-15
EP1632105A4 (de) 2008-09-17
MY136475A (en) 2008-10-31
KR20060034223A (ko) 2006-04-21
EP1632105A1 (de) 2006-03-08
JP2007504782A (ja) 2007-03-01
US20070065968A1 (en) 2007-03-22
WO2004105428A1 (en) 2004-12-02
CN1813489A (zh) 2006-08-02

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee