DE602004025136D1 - BESCHICHTUNGEN AUS M(n+1)AX(n)-MATERIAL FÜR ELEKTRISCHE KONTAKTELEMENTE - Google Patents
BESCHICHTUNGEN AUS M(n+1)AX(n)-MATERIAL FÜR ELEKTRISCHE KONTAKTELEMENTEInfo
- Publication number
- DE602004025136D1 DE602004025136D1 DE200460025136 DE602004025136T DE602004025136D1 DE 602004025136 D1 DE602004025136 D1 DE 602004025136D1 DE 200460025136 DE200460025136 DE 200460025136 DE 602004025136 T DE602004025136 T DE 602004025136T DE 602004025136 D1 DE602004025136 D1 DE 602004025136D1
- Authority
- DE
- Germany
- Prior art keywords
- contact
- coatings
- materials
- electrical contact
- contact elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/26—Pin or blade contacts for sliding co-operation on one side only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Contacts (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51142403P | 2003-10-16 | 2003-10-16 | |
US51143003P | 2003-10-16 | 2003-10-16 | |
PCT/IB2004/003390 WO2005038985A2 (en) | 2003-10-16 | 2004-10-18 | COATINGS OF Mn+1AXn MATERIAL FOR ELECTRICAL CONTACT ELEMENTS |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004025136D1 true DE602004025136D1 (de) | 2010-03-04 |
Family
ID=34467990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200460025136 Active DE602004025136D1 (de) | 2003-10-16 | 2004-10-18 | BESCHICHTUNGEN AUS M(n+1)AX(n)-MATERIAL FÜR ELEKTRISCHE KONTAKTELEMENTE |
Country Status (6)
Country | Link |
---|---|
US (1) | US7786393B2 (de) |
EP (1) | EP1685626B1 (de) |
CN (1) | CN1868096B (de) |
AT (1) | ATE455379T1 (de) |
DE (1) | DE602004025136D1 (de) |
WO (1) | WO2005038985A2 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE0402865L (sv) * | 2004-11-04 | 2006-05-05 | Sandvik Intellectual Property | Belagd produkt och framställningsmetod för denna |
SE0402904L (sv) * | 2004-11-26 | 2006-05-27 | Sandvik Intellectual Property | Belagd produkt och produktionsmetod för denna |
WO2006115451A1 (en) * | 2005-04-25 | 2006-11-02 | Impact Coatings Ab | Smart card and smart card reader |
EP1934995B1 (de) * | 2005-07-15 | 2014-04-02 | Impact Coatings AB (Publ.) | Kontaktelement und kontaktanordnung |
FR2901721B1 (fr) * | 2006-05-30 | 2008-08-22 | Commissariat Energie Atomique | Poudres de phase max et procede de fabrication des dites poudres |
US20080131686A1 (en) * | 2006-12-05 | 2008-06-05 | United Technologies Corporation | Environmentally friendly wear resistant carbide coating |
DE102007029683B4 (de) * | 2007-06-27 | 2011-07-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Verfahren zur Messung von Zustandsgrößen an mechanischen Komponenten |
KR100878872B1 (ko) * | 2007-09-03 | 2009-01-15 | 성균관대학교산학협력단 | 나노결정 전도성 탄소층을 게이트 전극으로 포함하여 이루어진 유기 박막 트랜지스터, 이의 제조방법 및 이를 포함하여 이루어진 유기 반도체 소자 |
SE531749C2 (sv) * | 2007-09-17 | 2009-07-28 | Seco Tools Ab | Metod att utfälla slitstarka skikt på hårdmetall med bågförångning och katod med Ti3SiC2 som huvudbeståndsdel |
EP2223315B1 (de) * | 2007-12-20 | 2016-10-05 | Impact Coatings AB | Leitfähiges element für umfangreiche ströme |
CN102017254A (zh) * | 2008-02-27 | 2011-04-13 | 因派科特涂料公司 | 具有涂层的电极、其制造方法和材料的用途 |
DE102009023191A1 (de) * | 2009-05-29 | 2010-12-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gehäuse mit einer Beschichtung |
JP5544778B2 (ja) * | 2009-08-05 | 2014-07-09 | トヨタ自動車株式会社 | オーミック電極およびその製造方法 |
WO2011123553A2 (en) * | 2010-04-02 | 2011-10-06 | Visa International Service Association | Crack embossing using diamond technology |
DE102011082593A1 (de) * | 2011-09-13 | 2013-03-28 | Siemens Aktiengesellschaft | Schaltkontakt, Schalter und Relais und deren Herstellung |
CN103204694B (zh) * | 2013-04-03 | 2014-04-02 | 哈尔滨工业大学 | 一种采用Zr/Ni复合中间层扩散连接TiAl基合金和Ti3AlC2陶瓷的方法 |
EP2838166B1 (de) | 2013-08-16 | 2019-09-25 | Schleifring GmbH | Schleifringanordnung und Komponenten davon |
TWI539164B (zh) | 2013-11-22 | 2016-06-21 | 財團法人工業技術研究院 | 塗佈探針及其製作方法 |
EP2944624A1 (de) * | 2014-05-14 | 2015-11-18 | Haldor Topsøe A/S | MAX-Phasenmaterialien frei von den Elementen Al und Si |
FR3032449B1 (fr) * | 2015-02-09 | 2017-01-27 | Office Nat D'etudes Et De Rech Aerospatiales (Onera) | Materiaux en cermet et procede de fabrication de tels materiaux |
US10199788B1 (en) | 2015-05-28 | 2019-02-05 | National Technology & Engineering Solutions Of Sandia, Llc | Monolithic MAX phase ternary alloys for sliding electrical contacts |
DE102016216428A1 (de) | 2016-08-31 | 2018-03-01 | Federal-Mogul Burscheid Gmbh | Gleitelement mit MAX-Phasen-Beschichtung |
US20200211590A1 (en) * | 2016-09-06 | 2020-07-02 | Universität Duisburg-Essen | Heat assisted magnetic recording media with optimized heat sink layer |
CN110541150B (zh) * | 2019-08-22 | 2024-05-03 | 沈阳科友真空技术有限公司 | 一种干簧管继电器触点用多层膜结构及其制备方法 |
CN110911705A (zh) * | 2019-11-20 | 2020-03-24 | 上海大学 | 燃料电池复合材料双极板上的Ti3SiC2涂层的制备方法 |
DE102019135459A1 (de) * | 2019-12-20 | 2021-06-24 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Vorrichtung zur Unterbrechung eines elektrischen Kreises |
US11728270B2 (en) | 2020-07-27 | 2023-08-15 | Samsung Electronics Co., Ltd. | Semiconductor interconnect, electrode for semiconductor device, and method of preparing multielement compound thin film |
CN114069360A (zh) * | 2021-11-23 | 2022-02-18 | 江苏科技大学 | 轻型、高电导滑环及制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2188250Y (zh) * | 1993-12-09 | 1995-01-25 | 中南工学院 | 弹性夹片经强化的电源插座 |
JPH10134869A (ja) * | 1996-10-30 | 1998-05-22 | Yazaki Corp | 端子材料および端子 |
KR100385946B1 (ko) * | 1999-12-08 | 2003-06-02 | 삼성전자주식회사 | 원자층 증착법을 이용한 금속층 형성방법 및 그 금속층을장벽금속층, 커패시터의 상부전극, 또는 하부전극으로구비한 반도체 소자 |
SE519921C2 (sv) * | 1999-05-06 | 2003-04-29 | Sandvik Ab | PVD-belagt skärverktyg och metod för dess framställning |
SE9904350D0 (sv) * | 1999-11-30 | 1999-11-30 | Abb Ab | A contact element and a contact arrangement |
US6544674B2 (en) * | 2000-08-28 | 2003-04-08 | Boston Microsystems, Inc. | Stable electrical contact for silicon carbide devices |
CN1261602C (zh) * | 2001-03-29 | 2006-06-28 | 西安建筑科技大学 | 一种Cu-C电刷材料及其制造工艺 |
CN100439554C (zh) * | 2001-11-30 | 2008-12-03 | Abb股份有限公司 | 式Mn+1AXn化合物的合成方法,该化合物的膜及其用途 |
US6747291B1 (en) * | 2003-01-10 | 2004-06-08 | The United States Of America As Represented By The Secretary Of The Air Force | Ohmic contacts on p-type silicon carbide using carbon films |
-
2004
- 2004-10-18 DE DE200460025136 patent/DE602004025136D1/de active Active
- 2004-10-18 AT AT04769655T patent/ATE455379T1/de not_active IP Right Cessation
- 2004-10-18 EP EP20040769655 patent/EP1685626B1/de not_active Not-in-force
- 2004-10-18 CN CN2004800304868A patent/CN1868096B/zh not_active Expired - Fee Related
- 2004-10-18 US US10/576,183 patent/US7786393B2/en active Active
- 2004-10-18 WO PCT/IB2004/003390 patent/WO2005038985A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP1685626B1 (de) | 2010-01-13 |
WO2005038985A3 (en) | 2005-06-16 |
WO2005038985B1 (en) | 2005-07-28 |
ATE455379T1 (de) | 2010-01-15 |
CN1868096B (zh) | 2010-10-13 |
CN1868096A (zh) | 2006-11-22 |
EP1685626A2 (de) | 2006-08-02 |
US20070111031A1 (en) | 2007-05-17 |
WO2005038985A2 (en) | 2005-04-28 |
US7786393B2 (en) | 2010-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |