DE602004023668D1 - Positiv arbeitende Resistzusammensetzung - Google Patents
Positiv arbeitende ResistzusammensetzungInfo
- Publication number
- DE602004023668D1 DE602004023668D1 DE602004023668T DE602004023668T DE602004023668D1 DE 602004023668 D1 DE602004023668 D1 DE 602004023668D1 DE 602004023668 T DE602004023668 T DE 602004023668T DE 602004023668 T DE602004023668 T DE 602004023668T DE 602004023668 D1 DE602004023668 D1 DE 602004023668D1
- Authority
- DE
- Germany
- Prior art keywords
- resist composition
- positive resist
- acid
- apositive
- solubility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002253 acid Substances 0.000 abstract 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003096390 | 2003-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004023668D1 true DE602004023668D1 (de) | 2009-12-03 |
Family
ID=32844646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004023668T Expired - Lifetime DE602004023668D1 (de) | 2003-03-31 | 2004-03-30 | Positiv arbeitende Resistzusammensetzung |
Country Status (5)
Country | Link |
---|---|
US (1) | US7232640B1 (de) |
EP (1) | EP1465010B1 (de) |
KR (1) | KR101057347B1 (de) |
AT (1) | ATE446530T1 (de) |
DE (1) | DE602004023668D1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4190538B2 (ja) * | 2003-12-22 | 2008-12-03 | ライオン株式会社 | ハイパーブランチポリマー、ハイパーブランチポリマーの製造方法、およびレジスト組成物 |
US20050221222A1 (en) * | 2004-03-22 | 2005-10-06 | Canon Kabushiki Kaisha | Photosensitive resin composition, resist pattern forming method, substrate processing method, and device manufacturing method |
KR101400824B1 (ko) * | 2006-09-25 | 2014-05-29 | 후지필름 가부시키가이샤 | 레지스트 조성물, 이 레지스트 조성물에 사용되는 수지, 이수지의 합성에 사용되는 화합물, 및 상기 레지스트조성물을 사용한 패턴형성방법 |
US8039194B2 (en) | 2008-01-08 | 2011-10-18 | Internatinal Business Machines Corporation | Photoacid generators for extreme ultraviolet lithography |
JP5639772B2 (ja) * | 2010-03-10 | 2014-12-10 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、並びに、それを用いたレジスト膜及びパターン形成方法 |
JP5793489B2 (ja) * | 2011-11-30 | 2015-10-14 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、それを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法 |
KR102432661B1 (ko) * | 2015-07-07 | 2022-08-17 | 삼성전자주식회사 | 극자외선용 포토레지스트 조성물 및 이를 이용하는 포토레지스트 패턴의 형성 방법 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3817012A1 (de) | 1988-05-19 | 1989-11-30 | Basf Ag | Positiv und negativ arbeitende strahlungsempfindliche gemische sowie verfahren zur herstellung von reliefmustern |
DE4007924A1 (de) * | 1990-03-13 | 1991-09-19 | Basf Ag | Strahlungsempfindliches gemisch |
US5899504A (en) * | 1995-01-23 | 1999-05-04 | Laser Substrates, Inc. | Multi-part non-impact printer airbill form |
US5573277B2 (en) * | 1994-03-04 | 2000-04-25 | Glenn Petkovsek | Mailpiece and/or shipping item for special mailing and a method for assembling a mailpiece and/or shipping item requiring special services |
US5558971A (en) * | 1994-09-02 | 1996-09-24 | Wako Pure Chemical Industries, Ltd. | Resist material |
US5860904A (en) * | 1995-03-06 | 1999-01-19 | Petkovsek; Glenn | Special service mailpiece having an integral document section and a method for forming same |
US5643669A (en) * | 1996-02-08 | 1997-07-01 | Minnesota Mining And Manufacturing Company | Curable water-based coating compositions and cured products thereof |
JP3587325B2 (ja) * | 1996-03-08 | 2004-11-10 | 富士写真フイルム株式会社 | ポジ型感光性組成物 |
US5862978A (en) * | 1997-12-18 | 1999-01-26 | Moore U.S.A. Inc. | Certified mailer envelope assembly |
JP4161358B2 (ja) * | 1998-12-22 | 2008-10-08 | Jsr株式会社 | 感放射線性樹脂組成物 |
US6179202B1 (en) * | 1999-08-04 | 2001-01-30 | Moore North America, Inc. | Single side imaged special services mailer |
JP3963624B2 (ja) * | 1999-12-22 | 2007-08-22 | 富士フイルム株式会社 | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP4190138B2 (ja) * | 2000-08-02 | 2008-12-03 | 富士フイルム株式会社 | ポジ型フォトレジスト組成物 |
JP3992993B2 (ja) | 2001-02-21 | 2007-10-17 | 富士フイルム株式会社 | ポジ型電子線、x線又はeuv用レジスト組成物 |
JP2004519734A (ja) * | 2001-04-04 | 2004-07-02 | アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド | ケイ素含有アセタール保護ポリマーおよびそのフォトレジスト組成物 |
JP3894001B2 (ja) * | 2001-09-06 | 2007-03-14 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
JP4025102B2 (ja) * | 2002-03-18 | 2007-12-19 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
-
2004
- 2004-03-30 DE DE602004023668T patent/DE602004023668D1/de not_active Expired - Lifetime
- 2004-03-30 AT AT04007650T patent/ATE446530T1/de not_active IP Right Cessation
- 2004-03-30 EP EP04007650A patent/EP1465010B1/de not_active Expired - Lifetime
- 2004-03-30 US US10/812,092 patent/US7232640B1/en not_active Expired - Lifetime
- 2004-03-31 KR KR1020040021880A patent/KR101057347B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
ATE446530T1 (de) | 2009-11-15 |
US20070128547A1 (en) | 2007-06-07 |
KR20040086793A (ko) | 2004-10-12 |
KR101057347B1 (ko) | 2011-08-17 |
US7232640B1 (en) | 2007-06-19 |
EP1465010B1 (de) | 2009-10-21 |
EP1465010A1 (de) | 2004-10-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |