DE602004021841D1 - Verfahren zur erzeugung eines jetting-programms - Google Patents
Verfahren zur erzeugung eines jetting-programmsInfo
- Publication number
- DE602004021841D1 DE602004021841D1 DE602004021841T DE602004021841T DE602004021841D1 DE 602004021841 D1 DE602004021841 D1 DE 602004021841D1 DE 602004021841 T DE602004021841 T DE 602004021841T DE 602004021841 T DE602004021841 T DE 602004021841T DE 602004021841 D1 DE602004021841 D1 DE 602004021841D1
- Authority
- DE
- Germany
- Prior art keywords
- deposit
- data
- pattern
- component
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/34—Director, elements to supervisory
- G05B2219/34342—Matching closest patterns stored in database with actual components
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45235—Dispensing adhesive, solder paste, for pcb
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Record Information Processing For Printing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cold Cathode And The Manufacture (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Stored Programmes (AREA)
- Manufacturing Of Electric Cables (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0302985A SE0302985D0 (sv) | 2003-11-13 | 2003-11-13 | A method for generating a jetting program |
PCT/SE2004/001668 WO2005048678A2 (en) | 2003-11-13 | 2004-11-15 | A method for generating a jetting program |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004021841D1 true DE602004021841D1 (de) | 2009-08-13 |
Family
ID=29707896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004021841T Active DE602004021841D1 (de) | 2003-11-13 | 2004-11-15 | Verfahren zur erzeugung eines jetting-programms |
Country Status (7)
Country | Link |
---|---|
US (1) | US7912569B2 (de) |
EP (1) | EP1682957B1 (de) |
JP (1) | JP4564965B2 (de) |
AT (1) | ATE435445T1 (de) |
DE (1) | DE602004021841D1 (de) |
SE (1) | SE0302985D0 (de) |
WO (1) | WO2005048678A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE0202247D0 (sv) * | 2002-07-18 | 2002-07-18 | Mydata Automation Ab | Jetting device and method at a jetting device |
CN101356425B (zh) | 2005-11-14 | 2011-01-26 | 麦德塔自动化股份有限公司 | 喷射装置和改善喷射装置性能的方法 |
TWI554857B (zh) * | 2011-05-23 | 2016-10-21 | 精工愛普生股份有限公司 | 資料產生方法 |
JP6133658B2 (ja) * | 2013-03-29 | 2017-05-24 | 株式会社タムラ製作所 | 位置設定装置、位置設定方法および位置設定プログラム |
KR20210114789A (ko) * | 2020-03-11 | 2021-09-24 | 동우 화인켐 주식회사 | 터치 센서 모듈 및 이를 포함하는 화상 표시 장치 |
CN113242652B (zh) * | 2021-05-20 | 2022-04-01 | 上海望友信息科技有限公司 | 一种喷涂图形生成方法、系统、电子设备及存储介质 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04367001A (ja) * | 1991-06-14 | 1992-12-18 | Fuji Electric Co Ltd | データ設定装置 |
WO1993009654A1 (en) * | 1991-11-07 | 1993-05-13 | Omron Corporation | Automatic soldering apparatus, teaching apparatus thereof and teaching method thereof, soldering inspection apparatus and its inspection method, and automatic soldering correction apparatus and its correction method |
US5320250A (en) * | 1991-12-02 | 1994-06-14 | Asymptotic Technologies, Inc. | Method for rapid dispensing of minute quantities of viscous material |
US5465879A (en) * | 1994-01-27 | 1995-11-14 | Asymptotic Technologies, Inc. | Disposable nozzle assembly for high speed viscous material droplet dispenser |
JP3397879B2 (ja) * | 1994-03-30 | 2003-04-21 | 三洋電機株式会社 | 塗布装置 |
US5564007A (en) * | 1994-06-03 | 1996-10-08 | Motorola Inc. | Method for configuring an automated dispense machine |
US5938102A (en) * | 1995-09-25 | 1999-08-17 | Muntz; Eric Phillip | High speed jet soldering system |
JPH09260823A (ja) * | 1996-03-27 | 1997-10-03 | Matsushita Electric Ind Co Ltd | 電子部品接着材料の塗布方法及び塗布装置 |
US6317513B2 (en) * | 1996-12-19 | 2001-11-13 | Cognex Corporation | Method and apparatus for inspecting solder paste using geometric constraints |
JP4151151B2 (ja) * | 1999-04-06 | 2008-09-17 | 松下電器産業株式会社 | ダイボンディング用のペースト塗布装置およびペースト塗布方法 |
DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
CN1211178C (zh) * | 2000-05-04 | 2005-07-20 | 德克萨斯仪器股份有限公司 | 减少集成电路焊接机焊接程序误差的系统与方法 |
JP2001320159A (ja) | 2000-05-11 | 2001-11-16 | Yamaha Motor Co Ltd | 電子部品の実装方法および表面実装機 |
SE0101503D0 (sv) * | 2001-04-27 | 2001-04-27 | Mydata Automation Ab | Method device and use of the device |
US6744046B2 (en) * | 2001-05-24 | 2004-06-01 | New Objective, Inc. | Method and apparatus for feedback controlled electrospray |
JP2003140178A (ja) * | 2001-10-31 | 2003-05-14 | Seiko Epson Corp | 電気光学装置の製造方法、電気光学装置、電子機器、およびインクジェット式機能性液体吐出装置 |
-
2003
- 2003-11-13 SE SE0302985A patent/SE0302985D0/xx unknown
-
2004
- 2004-11-15 WO PCT/SE2004/001668 patent/WO2005048678A2/en active Application Filing
- 2004-11-15 DE DE602004021841T patent/DE602004021841D1/de active Active
- 2004-11-15 US US10/578,885 patent/US7912569B2/en active Active
- 2004-11-15 EP EP04800331A patent/EP1682957B1/de active Active
- 2004-11-15 JP JP2006539438A patent/JP4564965B2/ja active Active
- 2004-11-15 AT AT04800331T patent/ATE435445T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20070146404A1 (en) | 2007-06-28 |
EP1682957B1 (de) | 2009-07-01 |
JP2007513500A (ja) | 2007-05-24 |
US7912569B2 (en) | 2011-03-22 |
EP1682957A2 (de) | 2006-07-26 |
JP4564965B2 (ja) | 2010-10-20 |
SE0302985D0 (sv) | 2003-11-13 |
ATE435445T1 (de) | 2009-07-15 |
WO2005048678A2 (en) | 2005-05-26 |
WO2005048678A3 (en) | 2006-01-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |