DE602004020013D1 - Verfahren und Vorrichtung zur Auswertung von Markierungsergebnissen - Google Patents

Verfahren und Vorrichtung zur Auswertung von Markierungsergebnissen

Info

Publication number
DE602004020013D1
DE602004020013D1 DE602004020013T DE602004020013T DE602004020013D1 DE 602004020013 D1 DE602004020013 D1 DE 602004020013D1 DE 602004020013 T DE602004020013 T DE 602004020013T DE 602004020013 T DE602004020013 T DE 602004020013T DE 602004020013 D1 DE602004020013 D1 DE 602004020013D1
Authority
DE
Germany
Prior art keywords
infrared sensor
laser beam
infrared
scan line
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004020013T
Other languages
English (en)
Inventor
Haruhiko Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of DE602004020013D1 publication Critical patent/DE602004020013D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
DE602004020013T 2003-05-19 2004-05-17 Verfahren und Vorrichtung zur Auswertung von Markierungsergebnissen Expired - Lifetime DE602004020013D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003140693A JP2004337958A (ja) 2003-05-19 2003-05-19 マーキング判定方法及びマーキング判定装置

Publications (1)

Publication Number Publication Date
DE602004020013D1 true DE602004020013D1 (de) 2009-04-30

Family

ID=33095389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004020013T Expired - Lifetime DE602004020013D1 (de) 2003-05-19 2004-05-17 Verfahren und Vorrichtung zur Auswertung von Markierungsergebnissen

Country Status (6)

Country Link
US (1) US7126124B2 (de)
EP (1) EP1479472B1 (de)
JP (1) JP2004337958A (de)
CN (1) CN1326708C (de)
AT (1) ATE425836T1 (de)
DE (1) DE602004020013D1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008028376A1 (de) * 2008-06-13 2009-12-17 Krones Ag Vorrichtung und Verfahren zum Kennzeichnen von Kunststoffbehältnissen
US8604380B2 (en) * 2010-08-19 2013-12-10 Electro Scientific Industries, Inc. Method and apparatus for optimally laser marking articles
WO2012072795A2 (en) * 2010-12-03 2012-06-07 ALERE TECHNOLOGIES GmbH Transformation of material into an optically modulating state via laser radiation
EP2527156A1 (de) 2011-05-25 2012-11-28 RLS Merilna Tehnika D.O.O. Vorrichtung und Verfahren zum Schreiben eines Musters in ein Substrat
TWI558578B (zh) * 2011-09-28 2016-11-21 伊雷克托科學工業股份有限公司 用於最佳化地雷射標記物品之方法和設備
JP6875427B2 (ja) * 2019-01-15 2021-05-26 ファナック株式会社 駆動機の駆動状態を伝送するデータ伝送機構を備える装置
GB201901066D0 (en) * 2019-01-25 2019-03-13 Nicoventures Trading Ltd Aerosol generating apparatus, aerosol generating article and method of determining data associated with an aerosol generating article

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1372753A (en) 1971-01-11 1974-11-06 Honeywell Inc Apparatus for processing a workpiece with a laser beam
JPS53127342U (de) 1977-03-18 1978-10-09
JPS5950434B2 (ja) 1981-01-27 1984-12-08 株式会社堀場製作所 Ｃｏ↓２レ−ザ−加工装置
JPS5927791A (ja) 1982-08-06 1984-02-14 Hitachi Ltd 複合材料穴あけ方法
JPS5997788A (ja) 1982-11-26 1984-06-05 Matsushita Electric Ind Co Ltd レ−ザ−加工機
JPS59163089A (ja) 1983-03-09 1984-09-14 Toshiba Corp レ−ザ加工の過燃焼防止装置
JPS60108061A (ja) 1983-11-18 1985-06-13 松下電器産業株式会社 レ−ザ−治療装置
JPS6277195A (ja) 1985-09-30 1987-04-09 Mitsubishi Electric Corp エネルギビ−ムによる加工状態判別方法および判別装置
JPS63190115A (ja) 1986-09-20 1988-08-05 Mitsubishi Electric Corp エネルギビ−ム焼入の制御装置
JPS6487713A (en) 1987-09-29 1989-03-31 Toshiba Corp Laser control equipment
JPH04272122A (ja) 1991-02-28 1992-09-28 Nissan Motor Co Ltd レーザ加工装置
DE4241663C2 (de) * 1992-12-04 1997-05-28 Borus Spezialverfahren Verfahren zur Kennzeichnung und Erkennung eines Gegenstands
US6024020A (en) * 1996-08-21 2000-02-15 Agfa Corporation Fluorescence dot area meter for measuring the halftone dot area on a printing plate
JP3860879B2 (ja) 1997-05-09 2006-12-20 大日本印刷株式会社 レーザ加工状態検出方法及びレーザ加工システム
US6768504B2 (en) * 2001-03-31 2004-07-27 Videojet Technologies Inc. Device and method for monitoring a laser-marking device
JP2003136259A (ja) * 2001-10-25 2003-05-14 Sunx Ltd レーザマーキング装置及びその印字制御方法
US6876377B2 (en) 2001-11-07 2005-04-05 Fuji Photo Film Co., Ltd. Photosensitive material and laser marking method

Also Published As

Publication number Publication date
ATE425836T1 (de) 2009-04-15
US7126124B2 (en) 2006-10-24
EP1479472A1 (de) 2004-11-24
CN1550345A (zh) 2004-12-01
US20040232341A1 (en) 2004-11-25
CN1326708C (zh) 2007-07-18
EP1479472B1 (de) 2009-03-18
JP2004337958A (ja) 2004-12-02

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Legal Events

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8364 No opposition during term of opposition