DE602004013800D1 - Verfahren zur Herstellung einer dünnen Kupferschicht - Google Patents

Verfahren zur Herstellung einer dünnen Kupferschicht

Info

Publication number
DE602004013800D1
DE602004013800D1 DE602004013800T DE602004013800T DE602004013800D1 DE 602004013800 D1 DE602004013800 D1 DE 602004013800D1 DE 602004013800 T DE602004013800 T DE 602004013800T DE 602004013800 T DE602004013800 T DE 602004013800T DE 602004013800 D1 DE602004013800 D1 DE 602004013800D1
Authority
DE
Germany
Prior art keywords
producing
copper layer
thin copper
thin
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602004013800T
Other languages
English (en)
Inventor
Minoru Otani
Jun Hisada
Toyoki Mawatari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Publication of DE602004013800D1 publication Critical patent/DE602004013800D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
    • C07F1/08—Copper compounds
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
DE602004013800T 2003-07-03 2004-06-29 Verfahren zur Herstellung einer dünnen Kupferschicht Expired - Fee Related DE602004013800D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003270570 2003-07-03

Publications (1)

Publication Number Publication Date
DE602004013800D1 true DE602004013800D1 (de) 2008-06-26

Family

ID=33448034

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602004013800T Expired - Fee Related DE602004013800D1 (de) 2003-07-03 2004-06-29 Verfahren zur Herstellung einer dünnen Kupferschicht
DE602004018068T Active DE602004018068D1 (de) 2003-07-03 2004-06-29 Kupferverbindung und Verfahren zur Herstellung einer dünnen Kupferschicht damit

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE602004018068T Active DE602004018068D1 (de) 2003-07-03 2004-06-29 Kupferverbindung und Verfahren zur Herstellung einer dünnen Kupferschicht damit

Country Status (7)

Country Link
US (2) US20050003086A1 (de)
EP (2) EP1662020B1 (de)
JP (1) JP2009102432A (de)
KR (1) KR100681797B1 (de)
CN (1) CN1578594B (de)
DE (2) DE602004013800D1 (de)
TW (1) TW200505795A (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1862562A1 (de) * 2006-05-31 2007-12-05 Mec Company Ltd. Verfahren zur Herstellung eines Substrats und dafür verwendete Dampfabscheidungsvorrichtung
JP4364252B2 (ja) * 2007-04-02 2009-11-11 メック株式会社 基板の製造方法及びこれに用いる銅表面処理剤
US7633164B2 (en) * 2007-04-10 2009-12-15 Tohoku University Liquid crystal display device and manufacturing method therefor
JP2009167522A (ja) * 2007-12-21 2009-07-30 Shinko Electric Ind Co Ltd 銅膜の形成方法
US20090298952A1 (en) * 2008-05-07 2009-12-03 Brimmer Karen S Platable soluble dyes
KR101376913B1 (ko) * 2011-12-27 2014-03-20 삼성전기주식회사 구리 유기금속, 구리 유기금속 제조방법 및 구리 페이스트
IN2015DN00149A (de) 2012-07-09 2015-06-12 Shikoku Chem
US10685359B2 (en) * 2017-05-05 2020-06-16 Servicenow, Inc. Identifying clusters for service management operations

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2976183A (en) * 1958-08-27 1961-03-21 Du Pont Process for the treatment of cellulosic materials to prevent deterioration and decay
JPS5544064B2 (de) * 1971-10-18 1980-11-10
DE4234711A1 (de) * 1992-10-15 1994-05-05 Basf Ag Verfahren zur Herstellung von Metallphthalocyaninen durch Umsetzen von ortho-Dinitrilen mit Metallkomplexen
JP4362173B2 (ja) * 1998-08-10 2009-11-11 アルバックマテリアル株式会社 Ｃｕ超微粒子独立分散液
EP0980097B1 (de) * 1998-08-10 2013-01-09 Ulvac, Inc. Dispersion bestehend aus hochfeinen dispersierten Kupferteilchen
IL162005A0 (en) * 2001-12-12 2005-11-20 Du Pont Copper deposition using copper formate complexes

Also Published As

Publication number Publication date
CN1578594B (zh) 2010-04-28
CN1578594A (zh) 2005-02-09
EP1662020A1 (de) 2006-05-31
EP1496061A3 (de) 2005-01-26
US20050003086A1 (en) 2005-01-06
KR100681797B1 (ko) 2007-02-12
TWI298312B (de) 2008-07-01
EP1496061A2 (de) 2005-01-12
TW200505795A (en) 2005-02-16
JP2009102432A (ja) 2009-05-14
EP1662020B1 (de) 2008-05-14
EP1496061B1 (de) 2008-12-03
US20100029969A1 (en) 2010-02-04
KR20050004140A (ko) 2005-01-12
DE602004018068D1 (de) 2009-01-15

Similar Documents

Publication Publication Date Title
DE502005001733D1 (de) Verfahren zur herstellung einer molybdän-legierung
DE602005027235D1 (de) Verfahren zur herstellung einer fotomaske
DE602005002661D1 (de) Verfahren zur Herstellung einer leitfähigen Diamantelektrode
DE602005024742D1 (de) Verfahren zur Herstellung einer unpolaren einkristtrid-Halbleiter
DE502004004097D1 (de) Schichtstruktur und verfahren zur herstellung einer schichtstruktur
DE602004004483D1 (de) Verfahren zur Herstellung einer Doppeldamaszen-Metallverbindung
DE60307157D1 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE60321883D1 (de) Verfahren zur Herstellung einer Vorrichtung
DE602005027821D1 (de) Verfahren zur herstellung einer keramikplatte
DE60215762D1 (de) Verfahren zur Herstellung einer Mehrfachlodplatte
DE602005003082D1 (de) Verfahren zur Herstellung einer Vorrichtung
DE502005005281D1 (de) Verfahren zur herstellung einer nockenwelle
DE602005007398D1 (de) Verfahren zur Herstellung einer Mikrolinse
DE60327616D1 (de) Verfahren zur herstellung einer wabenstruktur
DE60323051D1 (de) Verfahren zur Herstellung einer Vorrichtung
DE602004021697D1 (de) Verfahren zur herstellung einer wabenstruktur
DE502005006608D1 (de) Verfahren zur herstellung einer steckverbindung
DE60300839D1 (de) Verfahren zur Herstellung einer Büchse
DE60215484D1 (de) Verfahren zur herstellung einer flanschverbindung
DE50306958D1 (de) Verfahren zur herstellung einer bondverbindung
DE502004012455D1 (de) Verfahren zur Herstellung einer Lötstoppbarriere
DE502004005650D1 (de) Verfahren zur herstellung einer gleitfläche
DE60318784D1 (de) Verfahren zur Herstellung einer Polybenzazol-Folie
DE602005013468D1 (de) Verfahren zur Herstellung einer MOSFET
DE602004013800D1 (de) Verfahren zur Herstellung einer dünnen Kupferschicht

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee