TW200505795A - Copper compound and method for producing copper thin film using the same - Google Patents
Copper compound and method for producing copper thin film using the sameInfo
- Publication number
- TW200505795A TW200505795A TW093119405A TW93119405A TW200505795A TW 200505795 A TW200505795 A TW 200505795A TW 093119405 A TW093119405 A TW 093119405A TW 93119405 A TW93119405 A TW 93119405A TW 200505795 A TW200505795 A TW 200505795A
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- copper
- ch2x2
- producing
- copper compound
- Prior art date
Links
- 239000005749 Copper compound Substances 0.000 title abstract 4
- 150000001880 copper compounds Chemical class 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000010409 thin film Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 101100006370 Arabidopsis thaliana CHX2 gene Proteins 0.000 abstract 3
- 238000000354 decomposition reaction Methods 0.000 abstract 1
- 239000002904 solvent Chemical group 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/08—Copper compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003270570 | 2003-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200505795A true TW200505795A (en) | 2005-02-16 |
| TWI298312B TWI298312B (zh) | 2008-07-01 |
Family
ID=33448034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093119405A TW200505795A (en) | 2003-07-03 | 2004-06-30 | Copper compound and method for producing copper thin film using the same |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20050003086A1 (zh) |
| EP (2) | EP1662020B1 (zh) |
| JP (1) | JP2009102432A (zh) |
| KR (1) | KR100681797B1 (zh) |
| CN (1) | CN1578594B (zh) |
| DE (2) | DE602004018068D1 (zh) |
| TW (1) | TW200505795A (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1862562A1 (en) * | 2006-05-31 | 2007-12-05 | Mec Company Ltd. | Method for manufacturing substrate, and vapor deposition apparatus used for the same |
| JP4364252B2 (ja) * | 2007-04-02 | 2009-11-11 | メック株式会社 | 基板の製造方法及びこれに用いる銅表面処理剤 |
| US7633164B2 (en) * | 2007-04-10 | 2009-12-15 | Tohoku University | Liquid crystal display device and manufacturing method therefor |
| JP2009167522A (ja) * | 2007-12-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 銅膜の形成方法 |
| US20090298952A1 (en) * | 2008-05-07 | 2009-12-03 | Brimmer Karen S | Platable soluble dyes |
| KR101376913B1 (ko) * | 2011-12-27 | 2014-03-20 | 삼성전기주식회사 | 구리 유기금속, 구리 유기금속 제조방법 및 구리 페이스트 |
| CN104471108B (zh) | 2012-07-09 | 2020-05-05 | 四国化成工业株式会社 | 铜覆膜形成剂及铜覆膜的形成方法 |
| US10685359B2 (en) * | 2017-05-05 | 2020-06-16 | Servicenow, Inc. | Identifying clusters for service management operations |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2976183A (en) * | 1958-08-27 | 1961-03-21 | Du Pont | Process for the treatment of cellulosic materials to prevent deterioration and decay |
| JPS5544064B2 (zh) * | 1971-10-18 | 1980-11-10 | ||
| DE4234711A1 (de) * | 1992-10-15 | 1994-05-05 | Basf Ag | Verfahren zur Herstellung von Metallphthalocyaninen durch Umsetzen von ortho-Dinitrilen mit Metallkomplexen |
| JP4362173B2 (ja) * | 1998-08-10 | 2009-11-11 | アルバックマテリアル株式会社 | Ｃｕ超微粒子独立分散液 |
| US6214259B1 (en) * | 1998-08-10 | 2001-04-10 | Vacuum Metallurgical Co., Ltd. | Dispersion containing Cu ultrafine particles individually dispersed therein |
| EP1461345B1 (en) * | 2001-12-12 | 2006-05-31 | E.I. Du Pont De Nemours And Company | Copper deposition using copper formate complexes |
-
2004
- 2004-06-29 EP EP06004367A patent/EP1662020B1/en not_active Expired - Fee Related
- 2004-06-29 DE DE602004018068T patent/DE602004018068D1/de not_active Expired - Lifetime
- 2004-06-29 DE DE602004013800T patent/DE602004013800D1/de not_active Expired - Fee Related
- 2004-06-29 EP EP04015238A patent/EP1496061B1/en not_active Expired - Fee Related
- 2004-06-30 TW TW093119405A patent/TW200505795A/zh unknown
- 2004-06-30 US US10/881,276 patent/US20050003086A1/en not_active Abandoned
- 2004-07-03 KR KR1020040051779A patent/KR100681797B1/ko not_active IP Right Cessation
- 2004-07-05 CN CN2004100620937A patent/CN1578594B/zh not_active Expired - Fee Related
-
2009
- 2009-02-09 JP JP2009027030A patent/JP2009102432A/ja active Pending
- 2009-10-13 US US12/578,182 patent/US20100029969A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1496061B1 (en) | 2008-12-03 |
| CN1578594B (zh) | 2010-04-28 |
| JP2009102432A (ja) | 2009-05-14 |
| EP1662020B1 (en) | 2008-05-14 |
| US20100029969A1 (en) | 2010-02-04 |
| KR100681797B1 (ko) | 2007-02-12 |
| US20050003086A1 (en) | 2005-01-06 |
| KR20050004140A (ko) | 2005-01-12 |
| EP1496061A2 (en) | 2005-01-12 |
| DE602004018068D1 (de) | 2009-01-15 |
| CN1578594A (zh) | 2005-02-09 |
| TWI298312B (zh) | 2008-07-01 |
| EP1662020A1 (en) | 2006-05-31 |
| EP1496061A3 (en) | 2005-01-26 |
| DE602004013800D1 (de) | 2008-06-26 |
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