DE602004010591D1 - Heissschmelzklebstoffzusammensetzung - Google Patents
HeissschmelzklebstoffzusammensetzungInfo
- Publication number
- DE602004010591D1 DE602004010591D1 DE602004010591T DE602004010591T DE602004010591D1 DE 602004010591 D1 DE602004010591 D1 DE 602004010591D1 DE 602004010591 T DE602004010591 T DE 602004010591T DE 602004010591 T DE602004010591 T DE 602004010591T DE 602004010591 D1 DE602004010591 D1 DE 602004010591D1
- Authority
- DE
- Germany
- Prior art keywords
- hot melt
- melt adhesive
- adhesive composition
- grams
- minutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
- C09J193/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
- C08L91/06—Waxes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2493/00—Presence of natural resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US680276 | 2003-10-07 | ||
US10/680,276 US7166662B2 (en) | 2003-10-07 | 2003-10-07 | Hot melt adhesive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004010591D1 true DE602004010591D1 (de) | 2008-01-24 |
DE602004010591T2 DE602004010591T2 (de) | 2008-12-11 |
Family
ID=34314100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004010591T Active DE602004010591T2 (de) | 2003-10-07 | 2004-10-06 | Heissschmelzklebstoffzusammensetzung |
Country Status (9)
Country | Link |
---|---|
US (1) | US7166662B2 (de) |
EP (2) | EP1522566B1 (de) |
JP (1) | JP2005133084A (de) |
KR (1) | KR101214557B1 (de) |
CN (1) | CN100558839C (de) |
AT (1) | ATE380854T1 (de) |
AU (1) | AU2004218621A1 (de) |
DE (1) | DE602004010591T2 (de) |
ES (1) | ES2298661T3 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7847011B2 (en) * | 2005-08-04 | 2010-12-07 | Avery Dennison Corporation | Intermediate softening point resin-based hot melt PSAs |
US8225963B2 (en) * | 2005-10-06 | 2012-07-24 | Henkel Ag & Co. Kgaa | Integrated low application temperature hot melt adhesive processing system |
US7767760B2 (en) * | 2005-12-30 | 2010-08-03 | E.I. Du Pont De Nemours And Company | Hot melt adhesive composition |
US8362125B2 (en) * | 2007-04-03 | 2013-01-29 | Henkel Ag & Co. Kgaa | Hot melt adhesive |
BRPI0703309A2 (pt) * | 2007-07-24 | 2009-03-10 | 3M Innovative Properties Co | adesivo termofusÍvel |
CN101705062B (zh) * | 2009-09-23 | 2011-07-13 | 江苏达胜热缩材料有限公司 | 60度防腐热熔胶 |
CN102834450B (zh) | 2010-04-13 | 2015-04-08 | 埃克森美孚化学专利公司 | 粘合剂组合物和方法 |
CN101935503B (zh) * | 2010-07-28 | 2011-10-26 | 杭州师范大学 | 一种导热型乙烯-醋酸乙烯共聚物热熔胶及其制备方法 |
JP6023399B2 (ja) * | 2010-12-27 | 2016-11-09 | ヘンケルジャパン株式会社 | ホットメルト接着剤 |
US20140166148A1 (en) * | 2012-12-10 | 2014-06-19 | Buergofol GmbH | Multilayer Film |
US10494551B2 (en) | 2013-03-12 | 2019-12-03 | Henkel IP & Holding GmbH | Adhesive compostions with wide service temperature window and use thereof |
CN103509488B (zh) * | 2013-09-06 | 2016-05-18 | 繁昌县倍思生产力促进中心有限公司 | 一种高速卷烟搭口热熔胶 |
KR101540524B1 (ko) * | 2013-12-24 | 2015-07-31 | 신재호 | 핫멜트 접착제 및 이를 이용한 핫멜트 벽지 |
ES2457940B1 (es) | 2014-02-18 | 2014-10-02 | Forest Chemical Group S.A. | Adhesivo de fusión en caliente |
CN106062117B (zh) | 2014-02-21 | 2018-01-05 | 株式会社Moresco | 热熔粘合剂 |
JP6821647B2 (ja) | 2015-03-26 | 2021-01-27 | アリゾナ ケミカル カンパニー エルエルシーArizona Chemical Company, Llc | ロジンエステルおよびエチレンポリマーを含有する組成物 |
KR101888143B1 (ko) * | 2016-11-21 | 2018-08-13 | 애경화학 주식회사 | 엠보싱 형상 유지 및 재작업이 용이한 아크릴계 점착제 및 이를 이용한 엠보싱 점착시트 |
CN107523231B (zh) * | 2017-08-30 | 2018-12-21 | 胡敏生 | 低温热裱膜及其制备方法和应用 |
CN111748296A (zh) * | 2020-07-16 | 2020-10-09 | 惠州艺都文化用品有限公司 | 一种用于基材表面的热覆合膜 |
CN112852345B (zh) * | 2021-01-07 | 2022-07-22 | 上海晨光文具股份有限公司 | 一种笔芯封蜡及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4956207A (en) * | 1988-11-14 | 1990-09-11 | National Starch And Chemical Investment Holding Corporation | Bonding method employing sprayable hot melt adhesives for case and carton sealing |
WO1993018108A1 (en) * | 1992-03-13 | 1993-09-16 | Allied-Signal Inc. | Hot melt adhesive compositions comprising low molecular weight ethylene copolymers |
US5382615A (en) * | 1993-10-01 | 1995-01-17 | Eastman Chemical Company | Modified polyethylene based hot-melt adhesives for use in packaging |
US5670566A (en) * | 1995-01-06 | 1997-09-23 | National Starch And Chemical Investment Holding Corporation | Cool-applied hot melt adhesive composition |
US5500472A (en) * | 1995-02-17 | 1996-03-19 | National Starch And Chemical Investment Holding Corporation | Low application temperature hot melt adhesive |
US5763516A (en) | 1996-04-24 | 1998-06-09 | H.B. Fuller Licensing & Financing, Inc. | Polyethylene based hot-melt adhesive |
JPH10102019A (ja) * | 1996-09-26 | 1998-04-21 | Sekisui Chem Co Ltd | ホットメルト接着剤組成物及びポリオレフィン材料の接着方法 |
US6117945A (en) | 1998-02-04 | 2000-09-12 | National Starch And Chemical Investment Holding Corporation | Low application temperature hot melt adhesive |
JPH11323305A (ja) * | 1998-05-08 | 1999-11-26 | Daicel Chem Ind Ltd | 水溶性ホットメルト接着剤 |
JPH11323279A (ja) | 1998-05-08 | 1999-11-26 | Nippon Seiro Kk | ホットメルト接着剤用ワックスとホットメルト接着剤 組成物 |
US7019060B1 (en) | 1999-11-12 | 2006-03-28 | National Starch And Chemical Investment Holding Corporation | Low application temperature hot melt adhesive |
JP2002003804A (ja) * | 2000-06-19 | 2002-01-09 | Nippon Nsc Ltd | ホットメルト接着剤 |
US6593407B2 (en) * | 2001-02-06 | 2003-07-15 | National Starch And Chemical Investment Holding Corporation | Hot melt adhesive composition |
US6794443B2 (en) * | 2003-02-14 | 2004-09-21 | National Starch And Chemical Investment Holding Corporation | Hot melt adhesive composition |
-
2003
- 2003-10-07 US US10/680,276 patent/US7166662B2/en active Active
-
2004
- 2004-09-30 CN CNB2004100921347A patent/CN100558839C/zh not_active Expired - Fee Related
- 2004-10-04 KR KR1020040078690A patent/KR101214557B1/ko not_active IP Right Cessation
- 2004-10-05 AU AU2004218621A patent/AU2004218621A1/en not_active Abandoned
- 2004-10-06 DE DE602004010591T patent/DE602004010591T2/de active Active
- 2004-10-06 EP EP04023796A patent/EP1522566B1/de not_active Not-in-force
- 2004-10-06 AT AT04023796T patent/ATE380854T1/de not_active IP Right Cessation
- 2004-10-06 ES ES04023796T patent/ES2298661T3/es active Active
- 2004-10-06 EP EP06007700A patent/EP1679354A1/de not_active Withdrawn
- 2004-10-06 JP JP2004293329A patent/JP2005133084A/ja not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
EP1522566A3 (de) | 2005-04-27 |
EP1522566B1 (de) | 2007-12-12 |
JP2005133084A (ja) | 2005-05-26 |
EP1522566A2 (de) | 2005-04-13 |
CN100558839C (zh) | 2009-11-11 |
US20050075431A1 (en) | 2005-04-07 |
CN1626604A (zh) | 2005-06-15 |
KR101214557B1 (ko) | 2012-12-24 |
ES2298661T3 (es) | 2008-05-16 |
US7166662B2 (en) | 2007-01-23 |
ATE380854T1 (de) | 2007-12-15 |
DE602004010591T2 (de) | 2008-12-11 |
EP1679354A1 (de) | 2006-07-12 |
AU2004218621A1 (en) | 2005-04-21 |
KR20050033808A (ko) | 2005-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE |