DE602004005210D1 - Verfahren zur herstellung von mustern mit geneigten flanken mittels fotolithographie - Google Patents

Verfahren zur herstellung von mustern mit geneigten flanken mittels fotolithographie

Info

Publication number
DE602004005210D1
DE602004005210D1 DE602004005210T DE602004005210T DE602004005210D1 DE 602004005210 D1 DE602004005210 D1 DE 602004005210D1 DE 602004005210 T DE602004005210 T DE 602004005210T DE 602004005210 T DE602004005210 T DE 602004005210T DE 602004005210 D1 DE602004005210 D1 DE 602004005210D1
Authority
DE
Germany
Prior art keywords
flanks
photolithography
approved
producing patterns
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004005210T
Other languages
English (en)
Other versions
DE602004005210T2 (de
Inventor
Marc Rabarot
Mathieu Kipp
Christophe Kopp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mimotec SA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602004005210D1 publication Critical patent/DE602004005210D1/de
Application granted granted Critical
Publication of DE602004005210T2 publication Critical patent/DE602004005210T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00103Structures having a predefined profile, e.g. sloped or rounded grooves
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0156Lithographic techniques
    • B81C2201/0159Lithographic techniques not provided for in B81C2201/0157
DE602004005210T 2003-08-07 2004-08-05 Verfahren zur herstellung von mustern mit geneigten flanken mittels fotolithographie Active DE602004005210T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0350410 2003-08-07
FR0350410A FR2858694B1 (fr) 2003-08-07 2003-08-07 Procede de realisation de motifs a flancs inclines par photolithographie
PCT/FR2004/050377 WO2005017623A2 (fr) 2003-08-07 2004-08-05 Procede de realisation de motifs a flancs inclines par photolithographie

Publications (2)

Publication Number Publication Date
DE602004005210D1 true DE602004005210D1 (de) 2007-04-19
DE602004005210T2 DE602004005210T2 (de) 2007-11-22

Family

ID=34073135

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004005210T Active DE602004005210T2 (de) 2003-08-07 2004-08-05 Verfahren zur herstellung von mustern mit geneigten flanken mittels fotolithographie

Country Status (6)

Country Link
US (1) US20070003839A1 (de)
EP (1) EP1652009B1 (de)
JP (1) JP2007501951A (de)
DE (1) DE602004005210T2 (de)
FR (1) FR2858694B1 (de)
WO (1) WO2005017623A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4911682B2 (ja) * 2006-07-20 2012-04-04 富士フイルム株式会社 露光装置
EP2060950A4 (de) * 2006-08-18 2014-06-25 Toppan Printing Co Ltd Verfahren zum herstellen einer orginalplatte, verfahren zum herstellen eines mikronadel-patch, mikronadel-patch und belichtungsvorrichtung
JP4984736B2 (ja) * 2006-08-18 2012-07-25 凸版印刷株式会社 露光装置及び方法
JP5070764B2 (ja) * 2006-08-18 2012-11-14 凸版印刷株式会社 マイクロニードルのパッチの製造方法
JP2009151257A (ja) * 2007-12-24 2009-07-09 Ind Technol Res Inst 傾斜露光リソグラフシステム
JP5194925B2 (ja) * 2008-03-25 2013-05-08 オムロン株式会社 レジスト露光方法
TW201015230A (en) * 2008-10-03 2010-04-16 Univ Nat Chiao Tung Immersion inclined lithography apparatus and tank thereof
US8871433B2 (en) 2009-10-14 2014-10-28 Kyoto University Method for producing microstructure
US8367307B2 (en) * 2010-02-05 2013-02-05 GM Global Technology Operations LLC Solution to optical constraint on microtruss processing
CN102566290B (zh) * 2010-12-22 2014-06-18 上海微电子装备有限公司 投影式斜坡曝光光刻机装置与方法
CN102540748B (zh) * 2010-12-22 2014-11-12 上海微电子装备有限公司 投影式斜坡曝光光刻机装置与方法
JP5798351B2 (ja) * 2011-03-28 2015-10-21 セイコーインスツル株式会社 電鋳型
CN103034047B (zh) * 2011-09-29 2014-10-29 上海微电子装备有限公司 一种提高分辨率的光刻工艺
KR102160695B1 (ko) * 2013-05-10 2020-09-29 삼성디스플레이 주식회사 마스크
US20160149122A1 (en) * 2013-06-14 2016-05-26 The Trustees Of Dartmouth College Methods For Fabricating Magnetic Devices And Associated Systems And Devices
DE102015202121B4 (de) 2015-02-06 2017-09-14 Infineon Technologies Ag SiC-basierte Supersperrschicht-Halbleitervorrichtungen und Verfahren zur Herstellung dieser
CN104635435A (zh) * 2015-02-10 2015-05-20 合肥工业大学 一种用于加工交叉网状微结构的光学组件
DE102016110523B4 (de) * 2016-06-08 2023-04-06 Infineon Technologies Ag Verarbeiten einer Leistungshalbleitervorrichtung
FR3052880B1 (fr) * 2016-06-21 2019-01-25 H.E.F. Systeme et methode de realisation d'un masque optique pour micro-texturation de surface, installation et methode de micro-texturation de surface
CN107463063A (zh) * 2017-08-02 2017-12-12 深圳市华星光电技术有限公司 紫外光固化掩膜板及其制作方法和固化方法
US11644757B2 (en) * 2019-12-19 2023-05-09 Intel Corporation Method to achieve tilted patterning with a through resist thickness using projection optics
US11754919B2 (en) 2020-11-30 2023-09-12 Applied Materials, Inc. Lithography method to form structures with slanted angle
JPWO2022181418A1 (de) * 2021-02-26 2022-09-01
CN117795426A (zh) * 2021-08-02 2024-03-29 劳力士有限公司 钟表部件的制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2411926A1 (de) * 1974-03-13 1975-09-25 Ibm Deutschland Vorrichtung zum belichten lichtempfindlicher schichten durch masken
JPS57200042A (en) * 1981-06-02 1982-12-08 Hoya Corp Exposure method for chemically machinable photosensitive glass
DE3842354A1 (de) * 1988-12-16 1990-06-21 Kernforschungsz Karlsruhe Verfahren zur lithographischen herstellung von galvanisch abformbaren mikrostrukturen mit dreieckigem oder trapezfoermigem querschnitt
US4912022A (en) * 1988-12-27 1990-03-27 Motorola, Inc. Method for sloping the profile of an opening in resist
DE19652463C2 (de) * 1996-12-17 1999-02-25 Univ Schiller Jena Verfahren und Vorrichtung zur Herstellung dreidimensionaler Mikrostrukturen beliebiger Form
JPH11327154A (ja) * 1998-05-13 1999-11-26 Mitsubishi Electric Corp 立体形状マイクロ部品の製造方法

Also Published As

Publication number Publication date
FR2858694A1 (fr) 2005-02-11
FR2858694B1 (fr) 2006-08-18
WO2005017623A2 (fr) 2005-02-24
WO2005017623A3 (fr) 2005-10-06
DE602004005210T2 (de) 2007-11-22
US20070003839A1 (en) 2007-01-04
JP2007501951A (ja) 2007-02-01
EP1652009A2 (de) 2006-05-03
EP1652009B1 (de) 2007-03-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MIMOTEC S.A., SION, CH

8328 Change in the person/name/address of the agent

Representative=s name: RACKETTE PARTNERSCHAFT PATENTANWAELTE, 79098 FREIB