DE602004004429D1 - Integrierte optische Anordnung - Google Patents
Integrierte optische AnordnungInfo
- Publication number
- DE602004004429D1 DE602004004429D1 DE602004004429T DE602004004429T DE602004004429D1 DE 602004004429 D1 DE602004004429 D1 DE 602004004429D1 DE 602004004429 T DE602004004429 T DE 602004004429T DE 602004004429 T DE602004004429 T DE 602004004429T DE 602004004429 D1 DE602004004429 D1 DE 602004004429D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated optical
- optical arrangement
- arrangement
- integrated
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/121—Protecting the head, e.g. against dust or impact with the record carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Optical Head (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003106155 | 2003-04-10 | ||
JP2003106155A JP2004311860A (ja) | 2003-04-10 | 2003-04-10 | 光集積型装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004004429D1 true DE602004004429D1 (de) | 2007-03-15 |
DE602004004429T2 DE602004004429T2 (de) | 2007-08-23 |
Family
ID=32866760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004004429T Expired - Fee Related DE602004004429T2 (de) | 2003-04-10 | 2004-04-08 | Integrierte optische Anordnung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7214997B2 (de) |
EP (1) | EP1467359B1 (de) |
JP (1) | JP2004311860A (de) |
CN (1) | CN1249697C (de) |
DE (1) | DE602004004429T2 (de) |
TW (1) | TWI261245B (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006032454A (ja) * | 2004-07-13 | 2006-02-02 | Nichia Chem Ind Ltd | 半導体レーザパッケージおよび半導体レーザパッケージの製造方法 |
DE102004057454B4 (de) * | 2004-11-25 | 2009-10-22 | Jenoptik Laserdiode Gmbh | Diodenlasermodul und Verfahren zu dessen Herstellung |
JP2006324409A (ja) * | 2005-05-18 | 2006-11-30 | Sharp Corp | 半導体レーザ装置およびそれを備えた光ピックアップ装置 |
JP2006338785A (ja) * | 2005-06-02 | 2006-12-14 | Sony Corp | 受発光集積装置及び光ディスク装置 |
US7715456B2 (en) * | 2005-10-27 | 2010-05-11 | Limo Patentverwaltung Gmbh & Co. Kg | Semiconductor laser device |
US8573465B2 (en) | 2008-02-14 | 2013-11-05 | Ethicon Endo-Surgery, Inc. | Robotically-controlled surgical end effector system with rotary actuated closure systems |
US8254212B2 (en) * | 2009-06-25 | 2012-08-28 | Seagate Technology Llc | Integrated heat assisted magnetic recording device |
KR101286636B1 (ko) * | 2010-11-04 | 2013-07-22 | 도시바삼성스토리지테크놀러지코리아 주식회사 | 효과적인 열 전달 구조를 가지는 전자 장치 및 이를 적용하는 멀티미디어 재생 장치 |
US9099391B2 (en) * | 2013-03-14 | 2015-08-04 | Infineon Technologies Austria Ag | Semiconductor package with top-side insulation layer |
JP6197606B2 (ja) * | 2013-11-25 | 2017-09-20 | 株式会社リコー | 化合物半導体発光デバイスの製造方法及びこの製造方法によって製造された化合物半導体発光デバイス |
US9901342B2 (en) | 2015-03-06 | 2018-02-27 | Ethicon Endo-Surgery, Llc | Signal and power communication system positioned on a rotatable shaft |
WO2018030486A1 (ja) * | 2016-08-10 | 2018-02-15 | 京セラ株式会社 | 電気素子搭載用パッケージ、アレイ型パッケージおよび電気装置 |
TWI658609B (zh) * | 2017-11-07 | 2019-05-01 | 欣新開發有限公司 | 表面黏著型雷射二極體及其製程 |
US20230134378A1 (en) * | 2020-01-21 | 2023-05-04 | Tdk Corporation | Integrated optical device, integrated optical module, and method for manufacturing integrated optical device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1258906A (en) | 1985-04-22 | 1989-08-29 | Hiroshi Oinoue | Semiconductor laser apparatus for optical head |
DE69314705T2 (de) | 1992-07-01 | 1998-04-09 | Koninkl Philips Electronics Nv | Optoelektronische Einrichtung und Verfahren zur Herstellung dieser Einrichtung |
JPH1069674A (ja) | 1996-08-27 | 1998-03-10 | Sony Corp | 光学ピックアップ装置 |
JP2001126306A (ja) | 1999-10-29 | 2001-05-11 | Olympus Optical Co Ltd | 光磁気ピックアップ |
JP2001189517A (ja) | 1999-12-28 | 2001-07-10 | Pioneer Electronic Corp | ハイブリッド光モジュール |
US6937405B2 (en) | 2000-03-03 | 2005-08-30 | Ricoh Company, Ltd. | Optical pickup projecting two laser beams from apparently approximated light-emitting points |
US6924429B2 (en) * | 2001-08-17 | 2005-08-02 | Citizen Watch Co., Ltd. | Electronic device and production method therefor |
-
2003
- 2003-04-10 JP JP2003106155A patent/JP2004311860A/ja active Pending
-
2004
- 2004-04-06 US US10/817,841 patent/US7214997B2/en not_active Expired - Fee Related
- 2004-04-07 TW TW093109627A patent/TWI261245B/zh not_active IP Right Cessation
- 2004-04-08 DE DE602004004429T patent/DE602004004429T2/de not_active Expired - Fee Related
- 2004-04-08 EP EP04290931A patent/EP1467359B1/de not_active Expired - Fee Related
- 2004-04-09 CN CNB2004100337454A patent/CN1249697C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2004311860A (ja) | 2004-11-04 |
TWI261245B (en) | 2006-09-01 |
CN1249697C (zh) | 2006-04-05 |
TW200428379A (en) | 2004-12-16 |
US20040202212A1 (en) | 2004-10-14 |
CN1538411A (zh) | 2004-10-20 |
EP1467359B1 (de) | 2007-01-24 |
DE602004004429T2 (de) | 2007-08-23 |
US7214997B2 (en) | 2007-05-08 |
EP1467359A1 (de) | 2004-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |