DE602004002972D1 - Elektronisches Fahrzeugsteuergerät - Google Patents

Elektronisches Fahrzeugsteuergerät

Info

Publication number
DE602004002972D1
DE602004002972D1 DE602004002972T DE602004002972T DE602004002972D1 DE 602004002972 D1 DE602004002972 D1 DE 602004002972D1 DE 602004002972 T DE602004002972 T DE 602004002972T DE 602004002972 T DE602004002972 T DE 602004002972T DE 602004002972 D1 DE602004002972 D1 DE 602004002972D1
Authority
DE
Germany
Prior art keywords
control unit
vehicle control
electronic vehicle
electronic
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004002972T
Other languages
English (en)
Other versions
DE602004002972T2 (de
Inventor
Keiichi Kato
Tamotsu Morishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE602004002972D1 publication Critical patent/DE602004002972D1/de
Application granted granted Critical
Publication of DE602004002972T2 publication Critical patent/DE602004002972T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239Electronic boxes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754Connector integrally incorporated in the PCB or in housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10174Diode
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Or Junction Boxes (AREA)
  • Dc-Dc Converters (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE602004002972T 2003-02-17 2004-02-17 Elektronisches Fahrzeugsteuergerät Expired - Lifetime DE602004002972T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003038842 2003-02-17
JP2003038842 2003-02-17
JP2004008541 2004-01-15
JP2004008541A JP4385771B2 (ja) 2003-02-17 2004-01-15 車載用電子制御装置

Publications (2)

Publication Number Publication Date
DE602004002972D1 true DE602004002972D1 (de) 2006-12-14
DE602004002972T2 DE602004002972T2 (de) 2007-07-12

Family

ID=32684300

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004002972T Expired - Lifetime DE602004002972T2 (de) 2003-02-17 2004-02-17 Elektronisches Fahrzeugsteuergerät

Country Status (4)

Country Link
US (1) US20040159461A1 (de)
EP (1) EP1447280B1 (de)
JP (1) JP4385771B2 (de)
DE (1) DE602004002972T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202005001161U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Drahtgeschriebene Leiterplatte oder Platine mit Leiterdrähten mit rechteckigem oder quadratischem Querschnitt
DE102017222592A1 (de) * 2017-12-13 2019-06-13 Mahle International Gmbh Bestückte Platine für ein elektrisches Bordnetz eines Kraftfahrzeugs
US20220393590A1 (en) * 2021-06-04 2022-12-08 Hamilton Sundstrand Corporation Compact circuit devices using ceramic-copper layers based packaging

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170330A (en) * 1989-08-03 1992-12-08 Robert Bosch Gmbh Circuit board structure for at least two different component types
JPH0729746A (ja) * 1993-07-09 1995-01-31 Mitsubishi Electric Corp 内燃機関用点火コイル装置
JP2979930B2 (ja) * 1993-10-28 1999-11-22 富士電機株式会社 電力用半導体装置のパッケージ
US5726862A (en) * 1996-02-02 1998-03-10 Motorola, Inc. Electrical component having formed leads
DE19617656A1 (de) * 1996-05-03 1997-11-06 Siegfried Schaal Metallveredel Abschirm-Formteil für elektronische Bauelemente
US5803604A (en) * 1996-09-30 1998-09-08 Exergen Corporation Thermocouple transmitter
JP3675607B2 (ja) * 1997-05-12 2005-07-27 アルプス電気株式会社 電子機器の放熱構造
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US20030210524A1 (en) * 2002-03-13 2003-11-13 Henry Berg Computer assembly for facilitating heat dissipation

Also Published As

Publication number Publication date
JP4385771B2 (ja) 2009-12-16
EP1447280A2 (de) 2004-08-18
EP1447280A3 (de) 2005-08-10
US20040159461A1 (en) 2004-08-19
JP2004274032A (ja) 2004-09-30
EP1447280B1 (de) 2006-11-02
DE602004002972T2 (de) 2007-07-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)