DE60139958D1 - Infrarotsensor - Google Patents

Infrarotsensor

Info

Publication number
DE60139958D1
DE60139958D1 DE60139958T DE60139958T DE60139958D1 DE 60139958 D1 DE60139958 D1 DE 60139958D1 DE 60139958 T DE60139958 T DE 60139958T DE 60139958 T DE60139958 T DE 60139958T DE 60139958 D1 DE60139958 D1 DE 60139958D1
Authority
DE
Germany
Prior art keywords
infrared sensor
infrared
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60139958T
Other languages
English (en)
Inventor
Katsumi Shibayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Application granted granted Critical
Publication of DE60139958D1 publication Critical patent/DE60139958D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
DE60139958T 2001-04-10 2001-04-10 Infrarotsensor Expired - Lifetime DE60139958D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/003077 WO2002084235A1 (fr) 2001-04-10 2001-04-10 Capteur infrarouge

Publications (1)

Publication Number Publication Date
DE60139958D1 true DE60139958D1 (de) 2009-10-29

Family

ID=29727309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60139958T Expired - Lifetime DE60139958D1 (de) 2001-04-10 2001-04-10 Infrarotsensor

Country Status (8)

Country Link
US (1) US7282712B2 (de)
EP (1) EP1378733B1 (de)
JP (1) JP4009046B2 (de)
KR (1) KR100794067B1 (de)
CN (2) CN100462697C (de)
DE (1) DE60139958D1 (de)
TW (1) TWI248513B (de)
WO (1) WO2002084235A1 (de)

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JP4009046B2 (ja) * 2001-04-10 2007-11-14 浜松ホトニクス株式会社 赤外線センサ
DE10144343A1 (de) * 2001-09-10 2003-03-27 Perkinelmer Optoelectronics Sensor zum berührugslosen Messen einer Temperatur
DE10144873A1 (de) * 2001-09-12 2003-03-27 Bosch Gmbh Robert Mikromechanischer Wärmeleitfähigkeitssensor mit poröser Abdeckung
JP4496751B2 (ja) * 2003-10-09 2010-07-07 日本電気株式会社 熱型赤外線固体撮像素子及びその製造方法
JP2005241457A (ja) 2004-02-26 2005-09-08 Hamamatsu Photonics Kk 赤外線センサ及びその製造方法
JP2005283435A (ja) * 2004-03-30 2005-10-13 Japan Aviation Electronics Industry Ltd 赤外線センサ
DE102004028032B4 (de) * 2004-06-09 2008-04-17 Perkinelmer Optoelectronics Gmbh & Co.Kg Sensorelement
DE102004030418A1 (de) * 2004-06-24 2006-01-19 Robert Bosch Gmbh Mikrostrukturierter Infrarot-Sensor und ein Verfahren zu seiner Herstellung
JP2006071601A (ja) * 2004-09-06 2006-03-16 Denso Corp 赤外線センサ、赤外線式ガス検出器、及び赤外線光源
JP5102436B2 (ja) * 2005-01-21 2012-12-19 日本セラミック株式会社 サーモパイルアレイの製造方法
US7785002B2 (en) * 2006-12-05 2010-08-31 Delphi Technologies, Inc. P-N junction based thermal detector
DE102007038726B4 (de) * 2007-08-16 2009-07-09 Universität Bremen Dünnschicht-Thermoelement-Anordnung, thermoelektrischer Sensor, Thermogenerator und Verfahren zur Herstellung der Dünnschicht-Thermoelement-Anordnung
JP2009174917A (ja) * 2008-01-22 2009-08-06 Oki Semiconductor Co Ltd 赤外線検出素子、及び赤外線検出素子の製造方法
DE102008006245A1 (de) * 2008-01-25 2009-07-30 Nirlus Engineering Ag Verfahren zur nichtinvasiven, optischen Bestimmung der Temperatur eines Mediums
US8267526B2 (en) 2008-06-17 2012-09-18 The Invention Science Fund I, Llc Methods associated with receiving and transmitting information related to projection
US8723787B2 (en) 2008-06-17 2014-05-13 The Invention Science Fund I, Llc Methods and systems related to an image capture projection surface
US8262236B2 (en) 2008-06-17 2012-09-11 The Invention Science Fund I, Llc Systems and methods for transmitting information associated with change of a projection surface
US8308304B2 (en) 2008-06-17 2012-11-13 The Invention Science Fund I, Llc Systems associated with receiving and transmitting information related to projection
US8955984B2 (en) 2008-06-17 2015-02-17 The Invention Science Fund I, Llc Projection associated methods and systems
US8608321B2 (en) 2008-06-17 2013-12-17 The Invention Science Fund I, Llc Systems and methods for projecting in response to conformation
US8384005B2 (en) 2008-06-17 2013-02-26 The Invention Science Fund I, Llc Systems and methods for selectively projecting information in response to at least one specified motion associated with pressure applied to at least one projection surface
US8430515B2 (en) 2008-06-17 2013-04-30 The Invention Science Fund I, Llc Systems and methods for projecting
US8641203B2 (en) 2008-06-17 2014-02-04 The Invention Science Fund I, Llc Methods and systems for receiving and transmitting signals between server and projector apparatuses
US20090310038A1 (en) 2008-06-17 2009-12-17 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Projection in response to position
US8944608B2 (en) 2008-06-17 2015-02-03 The Invention Science Fund I, Llc Systems and methods associated with projecting in response to conformation
US8733952B2 (en) 2008-06-17 2014-05-27 The Invention Science Fund I, Llc Methods and systems for coordinated use of two or more user responsive projectors
US8936367B2 (en) 2008-06-17 2015-01-20 The Invention Science Fund I, Llc Systems and methods associated with projecting in response to conformation
US20090309826A1 (en) 2008-06-17 2009-12-17 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Systems and devices
KR101008260B1 (ko) * 2008-06-27 2011-01-13 (주)엔아이디에스 적외선 센서 및 그 제조방법
DE102008041131B4 (de) * 2008-08-08 2020-07-30 Robert Bosch Gmbh Thermopile-Sensor zur Detektion von Infrarot-Strahlung
EP2339305A4 (de) * 2008-09-25 2012-07-25 Panasonic Corp Infrarotsensor
US8304851B2 (en) 2010-03-30 2012-11-06 Texas Instruments Incorporated Semiconductor thermocouple and sensor
JP2013524541A (ja) * 2010-04-14 2013-06-17 エクセリタス カナダ,インコーポレイテッド 積層サーモパイル
JP5558189B2 (ja) * 2010-04-26 2014-07-23 浜松ホトニクス株式会社 赤外線センサ及びその製造方法
DE112011101444T5 (de) * 2010-04-26 2013-04-11 HME Co. Ltd. Temperatursensoreinrichtung und Strahlungsthermometer, der diese Vorrichtung verwendet, Herstellungsverfahren für Temperatursensorvorrichtungen, Mehrlagen-Dünnfilm-Thermosäule, die einen Fotoresistfilm und ein Strahlungsthermometer unter Benutzung dieser Thermosäule verwendet, sowie Herstellungsverfahren einer mehrlagigen Dünnfilm-Thermosäule
US8441093B2 (en) * 2011-04-15 2013-05-14 Excelitas Technologies Singapore Pte. Ltd. Shared membrane thermopile sensor array
TWI452272B (zh) * 2011-05-24 2014-09-11 Univ Nat Kaohsiung Applied Sci Thermopile sensing element
GB201112430D0 (en) * 2011-07-20 2011-08-31 Melexis Tessenderlo Nv IR sensor design
CN102322961B (zh) * 2011-07-27 2017-02-22 中国科学院上海微系统与信息技术研究所 一种具有高占空比的微机械热电堆红外探测器及制作方法
US9784577B2 (en) * 2012-03-16 2017-10-10 Lg Innotek Co., Ltd. Measuring distance from object by using size of pattern projected onto object
US9219185B2 (en) 2013-12-19 2015-12-22 Excelitas Technologies Singapore Pte. Ltd CMOS integrated method for the fabrication of thermopile pixel with umbrella absorber on semiconductor substrate
US9373772B2 (en) 2014-01-15 2016-06-21 Excelitas Technologies Singapore Pte. Ltd. CMOS integrated method for the release of thermopile pixel on a substrate by using anisotropic and isotropic etching
US9324760B2 (en) * 2014-01-21 2016-04-26 Excelitas Technologies Singapore Pte. Ltd CMOS integrated method for fabrication of thermopile pixel on semiconductor substrate with buried insulation regions
JP6467172B2 (ja) * 2014-09-16 2019-02-06 ヤマハファインテック株式会社 接触燃焼式ガスセンサ
TWI569427B (zh) * 2014-10-22 2017-02-01 精材科技股份有限公司 半導體封裝件及其製法
CN104501983B (zh) * 2015-01-08 2017-03-22 上海新微技术研发中心有限公司 一种褶皱膜温度传感器及其制作方法
JP6467254B2 (ja) * 2015-03-16 2019-02-06 ヤマハファインテック株式会社 赤外線センサ
US10203252B2 (en) 2016-12-29 2019-02-12 Industrial Technology Research Institute Microelectromechanical apparatus having a measuring range selector
WO2020077354A1 (en) 2018-10-12 2020-04-16 Amphenol Thermometrics, Inc. Ndir sensor, sampling method and system for breath analysis
US11480479B2 (en) * 2019-02-04 2022-10-25 The Board Of Trustees Of The University Of Illinois Microscale thermocouple probe for intracellular temperature measurements
JP7258800B2 (ja) * 2020-03-02 2023-04-17 Mmiセミコンダクター株式会社 サーモパイル型センサ
RU2752728C1 (ru) * 2021-01-18 2021-07-30 Федеральное государственное казенное учреждение "12 Центральный научно-исследовательский институт" Министерства обороны Российской Федерации Устройство для измерения энергетических параметров светового излучения

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JP2663612B2 (ja) 1989-02-09 1997-10-15 日産自動車株式会社 赤外線センサ
JPH0377031A (ja) * 1989-08-18 1991-04-02 Anritsu Corp 輻射波検出素子
JPH0760120B2 (ja) 1989-09-30 1995-06-28 アンリツ株式会社 光パワーセンサ
US5059543A (en) * 1990-09-21 1991-10-22 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Method of manufacturing thermopile infrared detector
US5100479A (en) * 1990-09-21 1992-03-31 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Thermopile infrared detector with semiconductor supporting rim
KR100205384B1 (ko) 1997-03-14 1999-07-01 구자홍 적외선 센서 및 그의 온도 보상방법
DE19710946A1 (de) * 1997-03-15 1998-09-24 Braun Ag Thermopile-Sensor und Strahlungsthermometer mit einem Thermopile-Sensor
KR100239494B1 (ko) * 1998-02-28 2000-01-15 구자홍 써모파일 센서 및 그 제조방법
JPH11258055A (ja) 1998-03-12 1999-09-24 Omron Corp サーモパイル型温度センサ
DE60044383D1 (de) * 1999-03-24 2010-06-24 Ishizuka Electronics Corp Thermosäulenartiger Infrarotsensor und Vorrichtung zu seiner Herstellung
JP3399399B2 (ja) * 1999-04-14 2003-04-21 株式会社村田製作所 赤外線センサ及びその製造方法
DE19932308C2 (de) * 1999-07-10 2001-10-25 Bosch Gmbh Robert Sensor, insbesondere Thermosensor
US6300554B1 (en) * 1999-09-09 2001-10-09 Metrodyne Microsystem Corp. Method of fabricating thermoelectric sensor and thermoelectric sensor device
JP3388207B2 (ja) * 1999-09-10 2003-03-17 全磊微機電股▲ふん▼有限公司 熱電式センサデバイスおよびその製造方法
DE10033589A1 (de) * 2000-07-11 2002-01-31 Bosch Gmbh Robert Mikrostrukturierter Thermosensor
JP4009046B2 (ja) * 2001-04-10 2007-11-14 浜松ホトニクス株式会社 赤外線センサ

Also Published As

Publication number Publication date
KR100794067B1 (ko) 2008-01-10
KR20030091979A (ko) 2003-12-03
US7282712B2 (en) 2007-10-16
US20030205670A1 (en) 2003-11-06
CN1488070A (zh) 2004-04-07
CN1758035A (zh) 2006-04-12
CN100462697C (zh) 2009-02-18
EP1378733A4 (de) 2007-03-21
EP1378733B1 (de) 2009-09-16
WO2002084235A1 (fr) 2002-10-24
JP2001201397A (ja) 2001-07-27
TWI248513B (en) 2006-02-01
JP4009046B2 (ja) 2007-11-14
EP1378733A1 (de) 2004-01-07
CN1236292C (zh) 2006-01-11

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