DE60137995D1 - Lichtemittierende Vorrichtungen - Google Patents

Lichtemittierende Vorrichtungen

Info

Publication number
DE60137995D1
DE60137995D1 DE60137995T DE60137995T DE60137995D1 DE 60137995 D1 DE60137995 D1 DE 60137995D1 DE 60137995 T DE60137995 T DE 60137995T DE 60137995 T DE60137995 T DE 60137995T DE 60137995 D1 DE60137995 D1 DE 60137995D1
Authority
DE
Germany
Prior art keywords
light
emitting devices
emitting
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60137995T
Other languages
English (en)
Inventor
Kee Yean Ng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies General IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies General IP Singapore Pte Ltd filed Critical Avago Technologies General IP Singapore Pte Ltd
Application granted granted Critical
Publication of DE60137995D1 publication Critical patent/DE60137995D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
DE60137995T 2000-08-09 2001-08-08 Lichtemittierende Vorrichtungen Expired - Fee Related DE60137995D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20003619 2000-08-09

Publications (1)

Publication Number Publication Date
DE60137995D1 true DE60137995D1 (de) 2009-04-30

Family

ID=19749469

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60137995T Expired - Fee Related DE60137995D1 (de) 2000-08-09 2001-08-08 Lichtemittierende Vorrichtungen

Country Status (3)

Country Link
US (1) US7129638B2 (de)
EP (1) EP1179858B1 (de)
DE (1) DE60137995D1 (de)

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US7928455B2 (en) * 2002-07-15 2011-04-19 Epistar Corporation Semiconductor light-emitting device and method for forming the same
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
JP3910517B2 (ja) * 2002-10-07 2007-04-25 シャープ株式会社 Ｌｅｄデバイス
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US7423296B2 (en) * 2003-02-26 2008-09-09 Avago Technologies Ecbu Ip Pte Ltd Apparatus for producing a spectrally-shifted light output from a light emitting device utilizing thin-film luminescent layers
JP2004265979A (ja) * 2003-02-28 2004-09-24 Noritsu Koki Co Ltd 発光ダイオード光源ユニット
US7397177B2 (en) * 2003-09-25 2008-07-08 Matsushita Electric Industrial Co., Ltd. LED lamp and method for manufacturing the same
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
JP2008503087A (ja) * 2004-06-18 2008-01-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 改善された光放射率プロファイルを備えるｌｅｄ
WO2006097876A1 (en) * 2005-03-14 2006-09-21 Koninklijke Philips Electronics N.V. Phosphor in polycrystalline ceramic structure and a light-emitting element comprising same
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US7309151B2 (en) * 2005-04-11 2007-12-18 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emitting panel
US8669572B2 (en) * 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
KR20060132298A (ko) * 2005-06-17 2006-12-21 삼성전기주식회사 발광소자 패키지
DE102005030324B4 (de) * 2005-06-29 2013-04-04 Lextar Electronics Corp. Lichtemittierende Dioden-Baugruppenanordnung, Kaltkathoden-Fluoreszenzlampe und photolumineszentes Material davon
KR100592508B1 (ko) * 2005-07-15 2006-06-26 한국광기술원 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지
KR101200400B1 (ko) * 2005-12-01 2012-11-16 삼성전자주식회사 백색 발광 다이오드
US8004002B2 (en) * 2006-01-04 2011-08-23 Rohm Co., Ltd. Thin-light emitting diode lamp, and method of manufacturing the same
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
EP1848042A1 (de) * 2006-04-21 2007-10-24 LEXEDIS Lighting GmbH LED-Gehäuse mit Montagebasis
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US20070269915A1 (en) * 2006-05-16 2007-11-22 Ak Wing Leong LED devices incorporating moisture-resistant seals and having ceramic substrates
JP4211804B2 (ja) * 2006-05-19 2009-01-21 セイコーエプソン株式会社 デバイス、膜形成方法及びデバイスの製造方法
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
TWI418054B (zh) 2006-08-08 2013-12-01 Lg Electronics Inc 發光裝置封裝與製造此封裝之方法
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8053799B2 (en) * 2006-09-29 2011-11-08 Seoul Semiconductor Co., Ltd. LED package
CN101595571B (zh) * 2006-12-15 2011-05-04 皇家飞利浦电子股份有限公司 具有二向色表面的发光系统
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7851990B2 (en) * 2007-09-06 2010-12-14 He Shan Lide Electronic Enterprise Company Ltd. Method for generating low color temperature light and light emitting device adopting the same
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
TWI401820B (zh) * 2007-11-07 2013-07-11 Ind Tech Res Inst 發光元件及其製作方法
US8946987B2 (en) 2007-11-07 2015-02-03 Industrial Technology Research Institute Light emitting device and fabricating method thereof
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
JP5458910B2 (ja) * 2009-02-24 2014-04-02 日亜化学工業株式会社 発光装置
CN101499446B (zh) * 2009-02-26 2013-10-16 光宝电子(广州)有限公司 导线架料片、封装结构以及发光二极管封装结构
KR101114794B1 (ko) 2009-10-26 2012-03-09 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
JP5455720B2 (ja) * 2010-03-12 2014-03-26 パナソニック株式会社 光半導体パッケージおよび光半導体装置
US8450770B2 (en) * 2010-05-11 2013-05-28 Advanced Semiconductor Engineering, Inc. Light emitting package structure
EP2492979A4 (de) * 2010-12-27 2012-11-28 Panasonic Corp Lichtemittierende vorrichtung und lampe
JP4926303B1 (ja) * 2010-12-27 2012-05-09 パナソニック株式会社 発光装置およびランプ
WO2012095931A1 (ja) * 2011-01-14 2012-07-19 パナソニック株式会社 ランプ及び照明装置
US9508904B2 (en) * 2011-01-31 2016-11-29 Cree, Inc. Structures and substrates for mounting optical elements and methods and devices for providing the same background
US8450175B2 (en) 2011-02-22 2013-05-28 Micron Technology, Inc. Methods of forming a vertical transistor and at least a conductive line electrically coupled therewith
WO2012147608A1 (ja) * 2011-04-26 2012-11-01 日亜化学工業株式会社 発光装置の製造方法及び発光装置
KR101798884B1 (ko) * 2011-05-18 2017-11-17 삼성전자주식회사 발광소자 어셈블리 및 이를 포함하는 전조등
JP2014036083A (ja) * 2012-08-08 2014-02-24 Toshiba Corp 半導体発光装置
TW201440255A (zh) * 2013-04-03 2014-10-16 Hung Ta Trading Co Ltd 製作白光發光元件之方法
JP6812657B2 (ja) * 2015-07-13 2021-01-13 豊田合成株式会社 発光装置の製造方法
WO2017047950A1 (ko) * 2015-09-15 2017-03-23 서울반도체주식회사 발광 디바이스, 발광 디바이스의 색좌표 측정 장치 및 색좌표 보정 방법
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Also Published As

Publication number Publication date
US7129638B2 (en) 2006-10-31
EP1179858B1 (de) 2009-03-18
US20020021085A1 (en) 2002-02-21
EP1179858A3 (de) 2003-07-30
EP1179858A2 (de) 2002-02-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee