DE60134774D1 - Lichtaushärtbare und hitzehärtbare harzzusammensetzung - Google Patents

Lichtaushärtbare und hitzehärtbare harzzusammensetzung

Info

Publication number
DE60134774D1
DE60134774D1 DE60134774T DE60134774T DE60134774D1 DE 60134774 D1 DE60134774 D1 DE 60134774D1 DE 60134774 T DE60134774 T DE 60134774T DE 60134774 T DE60134774 T DE 60134774T DE 60134774 D1 DE60134774 D1 DE 60134774D1
Authority
DE
Germany
Prior art keywords
group
resin composition
heat
resistant resin
light curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60134774T
Other languages
English (en)
Inventor
Tadatomi Nishikubo
Atsushi Kameyama
Masaki Sasaki
Masatoshi Kusama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanagawa University
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Kanagawa University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd, Kanagawa University filed Critical Taiyo Ink Mfg Co Ltd
Application granted granted Critical
Publication of DE60134774D1 publication Critical patent/DE60134774D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/061—Polyesters; Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/331—Polymers modified by chemical after-treatment with organic compounds containing oxygen
    • C08G65/332—Polymers modified by chemical after-treatment with organic compounds containing oxygen containing carboxyl groups, or halides, or esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Graft Or Block Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Indole Compounds (AREA)
DE60134774T 2000-12-04 2001-11-27 Lichtaushärtbare und hitzehärtbare harzzusammensetzung Expired - Fee Related DE60134774D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000368536A JP4382978B2 (ja) 2000-12-04 2000-12-04 光硬化性・熱硬化性樹脂組成物
PCT/JP2001/010329 WO2002046840A1 (fr) 2000-12-04 2001-11-27 Composition de resine photodurcissable et thermodurcissable

Publications (1)

Publication Number Publication Date
DE60134774D1 true DE60134774D1 (de) 2008-08-21

Family

ID=18838748

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60134774T Expired - Fee Related DE60134774D1 (de) 2000-12-04 2001-11-27 Lichtaushärtbare und hitzehärtbare harzzusammensetzung

Country Status (9)

Country Link
US (1) US6867282B2 (de)
EP (1) EP1341039B1 (de)
JP (1) JP4382978B2 (de)
KR (1) KR100830019B1 (de)
CN (1) CN1217233C (de)
AT (1) ATE400838T1 (de)
DE (1) DE60134774D1 (de)
TW (1) TWI278497B (de)
WO (1) WO2002046840A1 (de)

Families Citing this family (38)

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JP5016768B2 (ja) * 2000-03-29 2012-09-05 学校法人神奈川大学 活性エネルギー線硬化性樹脂、その製造方法及び光硬化性・熱硬化性樹脂組成物
WO2002064662A1 (fr) * 2001-02-15 2002-08-22 Kanagawa University Compose de polyester insature, resine durcissable aux radiations actiniques, procedes de production de ces derniers et composition durcissable
CN100401189C (zh) * 2001-10-22 2008-07-09 太阳油墨制造株式会社 光固化性·热固化性树脂组合物
EP1661930A4 (de) * 2003-08-12 2010-09-29 Mitsui Chemicals Inc Photohärtbare zusammensetzung und dichtungsmittel für flachbildschirm damit
EP1698644B1 (de) * 2003-11-21 2013-02-27 DIC Corporation Fluorhaltige photohärtende zusammensetzung
JPWO2006004158A1 (ja) * 2004-07-07 2008-04-24 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物とそれを用いたドライフィルム、及びその硬化物
KR100842168B1 (ko) * 2005-01-21 2008-06-30 주식회사 엘지화학 감광성 수지 조성물 및 이를 이용한 액정 표시 장치
JP4621036B2 (ja) * 2005-02-08 2011-01-26 太陽ホールディングス株式会社 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー
TW200710570A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure
JP4470835B2 (ja) 2005-08-08 2010-06-02 ソニー株式会社 液体吐出型記録ヘッド及び液体吐出装置
US7935471B2 (en) * 2005-10-20 2011-05-03 Hewlett-Packard Development Company, L.P. NIR/IR curable coatings for light directed imaging
JP5256645B2 (ja) * 2006-05-31 2013-08-07 三菱化学株式会社 保護膜用熱硬化性組成物、硬化物、及び液晶表示装置
WO2008068996A1 (ja) * 2006-11-29 2008-06-12 Toyoboseki Kabushiki Kaisha オキセタン含有樹脂、それを用いた接着剤及びレジスト剤
CN101663617B (zh) * 2007-04-24 2013-05-08 三井化学株式会社 感光性树脂组合物、干膜及使用它的加工品
JP7045796B2 (ja) 2014-06-23 2022-04-01 カーボン，インコーポレイテッド 多様な硬化機構を有する材料からの三次元物体製造方法
TWI559082B (zh) 2014-07-07 2016-11-21 財團法人工業技術研究院 生質材料與其形成方法與印刷電路板
KR101871549B1 (ko) * 2014-10-29 2018-07-03 삼성에스디아이 주식회사 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치
KR20170115070A (ko) 2015-02-05 2017-10-16 카본, 인크. 비연속 노광에 의한 적층체 제조방법
WO2016140886A1 (en) 2015-03-05 2016-09-09 Carbon3D, Inc. Fabrication of three dimensional objects with multiple operating modes
JP6362272B2 (ja) * 2015-03-13 2018-07-25 日本化薬株式会社 カルボキシル基含有反応性化合物、それを用いた硬化型樹脂組成物、およびその用途。
US10106643B2 (en) * 2015-03-31 2018-10-23 3M Innovative Properties Company Dual-cure nanostructure transfer film
WO2017040883A1 (en) 2015-09-04 2017-03-09 Carbon, Inc. Cyanate ester dual cure resins for additive manufacturing
CN108291011B (zh) 2015-09-09 2021-03-02 卡本有限公司 用于增材制造的环氧双重固化树脂
US10647873B2 (en) 2015-10-30 2020-05-12 Carbon, Inc. Dual cure article of manufacture with portions of differing solubility
US11891485B2 (en) 2015-11-05 2024-02-06 Carbon, Inc. Silicone dual cure resins for additive manufacturing
US10647054B2 (en) 2015-12-22 2020-05-12 Carbon, Inc. Accelerants for additive manufacturing with dual cure resins
US10639844B2 (en) 2015-12-22 2020-05-05 Carbon, Inc. Fabrication of compound products from multiple intermediates by additive manufacturing with dual cure resins
WO2017112751A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Blocked silicone dual cure resins for additive manufacturing
US10343331B2 (en) 2015-12-22 2019-07-09 Carbon, Inc. Wash liquids for use in additive manufacturing with dual cure resins
WO2017112571A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
US10350823B2 (en) 2015-12-22 2019-07-16 Carbon, Inc. Dual precursor resin systems for additive manufacturing with dual cure resins
US10501572B2 (en) 2015-12-22 2019-12-10 Carbon, Inc. Cyclic ester dual cure resins for additive manufacturing
US10500786B2 (en) 2016-06-22 2019-12-10 Carbon, Inc. Dual cure resins containing microwave absorbing materials and methods of using the same
US11135790B2 (en) 2016-11-21 2021-10-05 Carbon, Inc. Method of making three-dimensional object by delivering reactive component for subsequent cure
WO2018165090A1 (en) 2017-03-09 2018-09-13 Carbon, Inc. Tough, high temperature polymers produced by stereolithography
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
US11458673B2 (en) 2017-06-21 2022-10-04 Carbon, Inc. Resin dispenser for additive manufacturing
US11504903B2 (en) 2018-08-28 2022-11-22 Carbon, Inc. 1K alcohol dual cure resins for additive manufacturing

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JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
US5853957A (en) * 1995-05-08 1998-12-29 Tamura Kaken Co., Ltd Photosensitive resin compositions, cured films thereof, and circuit boards
JP3851366B2 (ja) * 1995-10-30 2006-11-29 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 感光性樹脂組成物
JP3933322B2 (ja) * 1998-09-01 2007-06-20 学校法人神奈川大学 硬化性組成物
DE60020762T2 (de) * 1999-02-25 2006-05-04 Dai Nippon Printing Co., Ltd. Lichtempfindliche Harzzusammensetzung, Farbfilter und dafür geeignetes Copolymerharz
JP4218851B2 (ja) 1999-02-25 2009-02-04 大日本印刷株式会社 カラーフィルタ保護膜形成用感光性樹脂組成物
JP5016768B2 (ja) * 2000-03-29 2012-09-05 学校法人神奈川大学 活性エネルギー線硬化性樹脂、その製造方法及び光硬化性・熱硬化性樹脂組成物

Also Published As

Publication number Publication date
WO2002046840A1 (fr) 2002-06-13
TWI278497B (en) 2007-04-11
US6867282B2 (en) 2005-03-15
JP2002169279A (ja) 2002-06-14
KR20040024533A (ko) 2004-03-20
US20030216514A1 (en) 2003-11-20
CN1478219A (zh) 2004-02-25
EP1341039A4 (de) 2006-09-20
EP1341039A1 (de) 2003-09-03
CN1217233C (zh) 2005-08-31
EP1341039B1 (de) 2008-07-09
JP4382978B2 (ja) 2009-12-16
ATE400838T1 (de) 2008-07-15
KR100830019B1 (ko) 2008-05-15

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