DE60132620D1 - Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatte - Google Patents
Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatteInfo
- Publication number
- DE60132620D1 DE60132620D1 DE60132620T DE60132620T DE60132620D1 DE 60132620 D1 DE60132620 D1 DE 60132620D1 DE 60132620 T DE60132620 T DE 60132620T DE 60132620 T DE60132620 T DE 60132620T DE 60132620 D1 DE60132620 D1 DE 60132620D1
- Authority
- DE
- Germany
- Prior art keywords
- pcbs
- pcb
- primary
- windings
- winding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004804 winding Methods 0.000 abstract 7
- 150000003071 polychlorinated biphenyls Chemical class 0.000 abstract 6
- 230000000149 penetrating effect Effects 0.000 abstract 3
- 238000005516 engineering process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10196—Variable component, e.g. variable resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Coils Of Transformers For General Uses (AREA)
- Prostheses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/735,030 US6628531B2 (en) | 2000-12-11 | 2000-12-11 | Multi-layer and user-configurable micro-printed circuit board |
PCT/US2001/048504 WO2002049048A2 (en) | 2000-12-11 | 2001-12-06 | Multi-layer and user-configurable micro-printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60132620D1 true DE60132620D1 (de) | 2008-03-13 |
Family
ID=24954061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60132620T Expired - Lifetime DE60132620D1 (de) | 2000-12-11 | 2001-12-06 | Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatte |
Country Status (8)
Country | Link |
---|---|
US (1) | US6628531B2 (de) |
EP (1) | EP1342252B1 (de) |
CN (1) | CN1331170C (de) |
AT (1) | ATE385035T1 (de) |
AU (1) | AU2002234029A1 (de) |
DE (1) | DE60132620D1 (de) |
TW (1) | TW519857B (de) |
WO (1) | WO2002049048A2 (de) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1624734A3 (de) * | 2001-05-02 | 2006-06-07 | Fuji Photo Film Co., Ltd. | Blitzanordnung |
US7211289B2 (en) * | 2003-12-18 | 2007-05-01 | Endicott Interconnect Technologies, Inc. | Method of making multilayered printed circuit board with filled conductive holes |
US7292126B2 (en) * | 2004-04-30 | 2007-11-06 | Astec International Limited | Low noise planar transformer |
US7506280B2 (en) * | 2004-11-12 | 2009-03-17 | Tabtronics, Inc. | Magnetic winding and method of making same |
US7524206B2 (en) * | 2005-03-23 | 2009-04-28 | Pulse Engineering, Inc. | Power-enabled connector assembly with heat dissipation apparatus and method of manufacturing |
US7627947B2 (en) * | 2005-04-21 | 2009-12-08 | Endicott Interconnect Technologies, Inc. | Method for making a multilayered circuitized substrate |
US7293355B2 (en) * | 2005-04-21 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Apparatus and method for making circuitized substrates in a continuous manner |
US7827682B2 (en) | 2005-04-21 | 2010-11-09 | Endicott Interconnect Technologies, Inc. | Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner |
US8941457B2 (en) * | 2006-09-12 | 2015-01-27 | Cooper Technologies Company | Miniature power inductor and methods of manufacture |
US9589716B2 (en) | 2006-09-12 | 2017-03-07 | Cooper Technologies Company | Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets |
US8466764B2 (en) | 2006-09-12 | 2013-06-18 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
US8378777B2 (en) * | 2008-07-29 | 2013-02-19 | Cooper Technologies Company | Magnetic electrical device |
US7791445B2 (en) * | 2006-09-12 | 2010-09-07 | Cooper Technologies Company | Low profile layered coil and cores for magnetic components |
US8310332B2 (en) * | 2008-10-08 | 2012-11-13 | Cooper Technologies Company | High current amorphous powder core inductor |
US7352270B1 (en) | 2006-10-27 | 2008-04-01 | Itt Manufacturing Enterprises, Inc. | Printed circuit board with magnetic assembly |
US7872560B2 (en) * | 2007-03-19 | 2011-01-18 | Abc Taiwan Electronics Corp. | Independent planar transformer |
US7332993B1 (en) * | 2007-04-10 | 2008-02-19 | Bose Corporation | Planar transformer having fractional windings |
WO2008132645A1 (en) * | 2007-04-26 | 2008-11-06 | Philips Intellectual Property & Standards Gmbh | Planar transformer with boards |
IES20080903A2 (en) * | 2007-11-09 | 2009-05-13 | Vox Power Ltd | A switched mode power supply transformer |
US7859381B2 (en) * | 2008-07-05 | 2010-12-28 | Honeywell International Inc. | Autotransformer using printed wireboard |
US9859043B2 (en) | 2008-07-11 | 2018-01-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US9558881B2 (en) | 2008-07-11 | 2017-01-31 | Cooper Technologies Company | High current power inductor |
US8659379B2 (en) | 2008-07-11 | 2014-02-25 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8279037B2 (en) * | 2008-07-11 | 2012-10-02 | Cooper Technologies Company | Magnetic components and methods of manufacturing the same |
US8054154B2 (en) * | 2008-09-26 | 2011-11-08 | Linclon Global, Inc. | Planar transformer and method of manufacturing |
US7859382B2 (en) * | 2008-09-26 | 2010-12-28 | Lincoln Global, Inc. | Planar transformer |
US8089331B2 (en) * | 2009-05-12 | 2012-01-03 | Raytheon Company | Planar magnetic structure |
US8498124B1 (en) | 2009-12-10 | 2013-07-30 | Universal Lighting Technologies, Inc. | Magnetic circuit board stacking component |
JP4920089B2 (ja) * | 2010-01-14 | 2012-04-18 | Tdkラムダ株式会社 | エッジワイズコイル及びインダクタ |
US8384478B2 (en) | 2010-03-04 | 2013-02-26 | Bose Corporation | Versatile audio power amplifier |
US8350537B2 (en) * | 2010-03-04 | 2013-01-08 | Bose Corporation | Power supply transient response improving |
US8243960B2 (en) * | 2010-03-04 | 2012-08-14 | Bose Corporation | Planar audio amplifier output inductor with current sense |
US7986187B1 (en) | 2010-03-04 | 2011-07-26 | Bose Corporation | Versatile audio power amplifier |
US8237535B2 (en) * | 2010-04-16 | 2012-08-07 | World Properties, Inc. | Integral planar transformer and busbar |
TWI662385B (zh) | 2010-06-11 | 2019-06-11 | 日商理光股份有限公司 | 容器及影像形成裝置 |
US8601673B2 (en) * | 2010-11-25 | 2013-12-10 | Cyntec Co., Ltd. | Method of producing an inductor with a high inductance |
ITTO20110295A1 (it) * | 2011-04-01 | 2012-10-02 | St Microelectronics Srl | Dispositivo ad induttore integrato ad elevato valore di induttanza, in particolare per l'uso come antenna in un sistema di identificazione a radiofrequenza |
EP2716142A1 (de) * | 2011-06-01 | 2014-04-09 | Telefonaktiebolaget LM Ericsson (PUBL) | Thermoelektrische leiteranordnung für mehrschichtige leiterplatten |
ITTO20111169A1 (it) * | 2011-12-19 | 2013-06-20 | Gate Srl | Induttore per piastre circuitali |
US8841845B2 (en) * | 2012-07-24 | 2014-09-23 | Ricardo Montemayor | Proximity-based wireless lighting system |
KR20150065698A (ko) | 2012-09-03 | 2015-06-15 | 아이-블레이즈 인코포레이티드 | 스마트 콘택트 어레이 및 적층 디바이스를 위한 방법 |
WO2014062357A1 (en) | 2012-10-17 | 2014-04-24 | Covidien Lp | Planar transformers having reduced termination losses |
AU2013203801A1 (en) * | 2012-12-15 | 2014-07-03 | JENKINS III, Arthur L. DR | Multilayered Electromagnetic Assembly |
CN104105341A (zh) * | 2013-04-10 | 2014-10-15 | 张海洲 | Pcb线圈及音圈电机 |
US9703321B2 (en) | 2013-07-09 | 2017-07-11 | I-Blades, Inc. | Snap on wearable module |
CN103795273A (zh) * | 2014-03-11 | 2014-05-14 | 湖南进芯电子科技有限公司 | 一种具有pcb集成型变压器的开关电源模块 |
CN104980003B (zh) * | 2014-04-01 | 2017-10-10 | 台达电子企业管理(上海)有限公司 | 电源模块及pol电源模块 |
KR101475677B1 (ko) * | 2014-09-11 | 2014-12-23 | 삼성전기주식회사 | 코일 부품 및 이를 포함하는 전원공급장치 |
US9520793B2 (en) | 2014-09-22 | 2016-12-13 | Raytheon Company | Stacked power converter assembly |
US10050438B2 (en) | 2015-10-16 | 2018-08-14 | Raytheon Company | Stacked power converter assembly |
US10049810B2 (en) | 2015-11-09 | 2018-08-14 | Raytheon Company | High voltage high frequency transformer |
US10476393B2 (en) | 2015-12-01 | 2019-11-12 | Astec International Limited | Modifiable DC-DC power converters for providing different output voltages |
US10050533B2 (en) | 2016-07-26 | 2018-08-14 | Raytheon Company | High voltage high frequency transformer |
US10672553B2 (en) | 2017-05-10 | 2020-06-02 | Raytheon Company | High voltage high frequency transformer |
CN107481837B (zh) * | 2017-08-17 | 2023-04-11 | 广州金升阳科技有限公司 | 一种开关电源模块结构 |
JP6948757B2 (ja) * | 2018-06-01 | 2021-10-13 | 株式会社タムラ製作所 | 電子部品 |
CN109065337A (zh) * | 2018-07-11 | 2018-12-21 | 深圳振华富电子有限公司 | 印刷电路板式平板变压器 |
CN109065332A (zh) * | 2018-07-11 | 2018-12-21 | 深圳振华富电子有限公司 | 平板变压器 |
US11694832B2 (en) | 2019-02-01 | 2023-07-04 | Raytheon Company | High voltage high frequency transformer |
US20200258675A1 (en) * | 2019-02-08 | 2020-08-13 | Lear Corporation | Hybrid transformer for dc/dc converter |
CN114078623A (zh) * | 2020-08-20 | 2022-02-22 | Tdk株式会社 | 线圈部件以及搭载其的开关电源装置 |
WO2023020957A1 (en) * | 2021-08-20 | 2023-02-23 | Biotronik Se & Co. Kg | Pcb transformer with integrated internal and external electrical contacting for automated manufacturing |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1306354A (de) | 1969-06-06 | 1973-02-07 | ||
US3728656A (en) * | 1972-06-26 | 1973-04-17 | Gte Sylvania Inc | Transormer and terminal assembly |
US3765082A (en) | 1972-09-20 | 1973-10-16 | San Fernando Electric Mfg | Method of making an inductor chip |
US4873757A (en) * | 1987-07-08 | 1989-10-17 | The Foxboro Company | Method of making a multilayer electrical coil |
US5179365A (en) | 1989-12-29 | 1993-01-12 | At&T Bell Laboratories | Multiple turn low profile magnetic component using sheet windings |
US5020377A (en) | 1990-01-23 | 1991-06-04 | Kavlico Corporation | Low pressure transducer using metal foil diaphragm |
JP2539367Y2 (ja) | 1991-01-30 | 1997-06-25 | 株式会社村田製作所 | 積層型電子部品 |
US5345670A (en) | 1992-12-11 | 1994-09-13 | At&T Bell Laboratories | Method of making a surface-mount power magnetic device |
JP3158757B2 (ja) | 1993-01-13 | 2001-04-23 | 株式会社村田製作所 | チップ型コモンモードチョークコイル及びその製造方法 |
EP0689214B1 (de) * | 1994-06-21 | 1999-09-22 | Sumitomo Special Metals Co., Ltd. | Herstellungsverfahren für Substrat mit mehrschichtigen gedruckten Spulen |
EP0807941A3 (de) | 1994-08-24 | 1998-02-25 | Yokogawa Electric Corporation | Gedruckte Spule |
EP0741396A1 (de) | 1995-05-04 | 1996-11-06 | AT&T IPM Corp. | Magnetische Leistungsvorrichtung mit drahtlose Leiterplattenanschluss und ihr Herstellungsverfahren |
EP0741395A1 (de) | 1995-05-04 | 1996-11-06 | AT&T IPM Corp. | Anschluss-montierbare planare magnetischen Vorrichtung und ihr Herstellungsverfahren |
US5777277A (en) * | 1995-09-21 | 1998-07-07 | Canon Kabushiki Kaisha | Printed circuit board |
US5777539A (en) | 1995-09-27 | 1998-07-07 | International Business Machines Corporation | Inductor using multilayered printed circuit board for windings |
US5781093A (en) | 1996-08-05 | 1998-07-14 | International Power Devices, Inc. | Planar transformer |
US5880662A (en) | 1997-08-21 | 1999-03-09 | Dale Electronics, Inc. | High self resonant frequency multilayer inductor and method for making same |
JPH11265831A (ja) * | 1998-03-18 | 1999-09-28 | Fuji Elelctrochem Co Ltd | シートトランス |
-
2000
- 2000-12-11 US US09/735,030 patent/US6628531B2/en not_active Expired - Lifetime
-
2001
- 2001-11-30 TW TW090129621A patent/TW519857B/zh not_active IP Right Cessation
- 2001-12-06 AT AT01985040T patent/ATE385035T1/de not_active IP Right Cessation
- 2001-12-06 DE DE60132620T patent/DE60132620D1/de not_active Expired - Lifetime
- 2001-12-06 CN CNB018224660A patent/CN1331170C/zh not_active Expired - Fee Related
- 2001-12-06 WO PCT/US2001/048504 patent/WO2002049048A2/en active IP Right Grant
- 2001-12-06 AU AU2002234029A patent/AU2002234029A1/en not_active Abandoned
- 2001-12-06 EP EP01985040A patent/EP1342252B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1342252B1 (de) | 2008-01-23 |
WO2002049048A2 (en) | 2002-06-20 |
CN1331170C (zh) | 2007-08-08 |
US20020070834A1 (en) | 2002-06-13 |
EP1342252A2 (de) | 2003-09-10 |
ATE385035T1 (de) | 2008-02-15 |
US6628531B2 (en) | 2003-09-30 |
AU2002234029A1 (en) | 2002-06-24 |
TW519857B (en) | 2003-02-01 |
CN1488152A (zh) | 2004-04-07 |
WO2002049048A3 (en) | 2002-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |