ATE385035T1 - Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatte - Google Patents

Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatte

Info

Publication number
ATE385035T1
ATE385035T1 AT01985040T AT01985040T ATE385035T1 AT E385035 T1 ATE385035 T1 AT E385035T1 AT 01985040 T AT01985040 T AT 01985040T AT 01985040 T AT01985040 T AT 01985040T AT E385035 T1 ATE385035 T1 AT E385035T1
Authority
AT
Austria
Prior art keywords
pcbs
primary
pcb
windings
layer
Prior art date
Application number
AT01985040T
Other languages
English (en)
Inventor
Majid Dadafshar
Original Assignee
Pulse Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pulse Eng Inc filed Critical Pulse Eng Inc
Application granted granted Critical
Publication of ATE385035T1 publication Critical patent/ATE385035T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10196—Variable component, e.g. variable resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Structure Of Printed Boards (AREA)
  • Prostheses (AREA)
AT01985040T 2000-12-11 2001-12-06 Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatte ATE385035T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/735,030 US6628531B2 (en) 2000-12-11 2000-12-11 Multi-layer and user-configurable micro-printed circuit board

Publications (1)

Publication Number Publication Date
ATE385035T1 true ATE385035T1 (de) 2008-02-15

Family

ID=24954061

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01985040T ATE385035T1 (de) 2000-12-11 2001-12-06 Mehrschichtige und benutzerkonfigurierbare mikrogedruckte leiterplatte

Country Status (8)

Country Link
US (1) US6628531B2 (de)
EP (1) EP1342252B1 (de)
CN (1) CN1331170C (de)
AT (1) ATE385035T1 (de)
AU (1) AU2002234029A1 (de)
DE (1) DE60132620D1 (de)
TW (1) TW519857B (de)
WO (1) WO2002049048A2 (de)

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US7827682B2 (en) 2005-04-21 2010-11-09 Endicott Interconnect Technologies, Inc. Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
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US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US7791445B2 (en) * 2006-09-12 2010-09-07 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8310332B2 (en) * 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
US8941457B2 (en) * 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
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US8279037B2 (en) * 2008-07-11 2012-10-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
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US8243960B2 (en) * 2010-03-04 2012-08-14 Bose Corporation Planar audio amplifier output inductor with current sense
US7986187B1 (en) 2010-03-04 2011-07-26 Bose Corporation Versatile audio power amplifier
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US8237535B2 (en) * 2010-04-16 2012-08-07 World Properties, Inc. Integral planar transformer and busbar
KR101784850B1 (ko) * 2010-06-11 2017-11-06 가부시키가이샤 리코 화상 형성 장치에서 탈착 가능하게 설치되는 정보 저장 시스템, 탈착 장치 및 토너 용기
US8601673B2 (en) * 2010-11-25 2013-12-10 Cyntec Co., Ltd. Method of producing an inductor with a high inductance
ITTO20110295A1 (it) * 2011-04-01 2012-10-02 St Microelectronics Srl Dispositivo ad induttore integrato ad elevato valore di induttanza, in particolare per l'uso come antenna in un sistema di identificazione a radiofrequenza
US9107296B2 (en) * 2011-06-01 2015-08-11 Telefonaktiebolaget L M Ericsson (Publ) Thermo/electrical conductor arrangement for multilayer printed circuit boards
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US8841845B2 (en) * 2012-07-24 2014-09-23 Ricardo Montemayor Proximity-based wireless lighting system
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US9703321B2 (en) 2013-07-09 2017-07-11 I-Blades, Inc. Snap on wearable module
CN103795273A (zh) * 2014-03-11 2014-05-14 湖南进芯电子科技有限公司 一种具有pcb集成型变压器的开关电源模块
CN104980003B (zh) * 2014-04-01 2017-10-10 台达电子企业管理（上海）有限公司 电源模块及pol电源模块
KR101475677B1 (ko) * 2014-09-11 2014-12-23 삼성전기주식회사 코일 부품 및 이를 포함하는 전원공급장치
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Also Published As

Publication number Publication date
WO2002049048A3 (en) 2002-10-10
CN1331170C (zh) 2007-08-08
DE60132620D1 (de) 2008-03-13
CN1488152A (zh) 2004-04-07
AU2002234029A1 (en) 2002-06-24
US6628531B2 (en) 2003-09-30
EP1342252A2 (de) 2003-09-10
EP1342252B1 (de) 2008-01-23
US20020070834A1 (en) 2002-06-13
TW519857B (en) 2003-02-01
WO2002049048A2 (en) 2002-06-20

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