US5345670A - Method of making a surface-mount power magnetic device - Google Patents
Method of making a surface-mount power magnetic device Download PDFInfo
- Publication number
- US5345670A US5345670A US07/989,394 US98939492A US5345670A US 5345670 A US5345670 A US 5345670A US 98939492 A US98939492 A US 98939492A US 5345670 A US5345670 A US 5345670A
- Authority
- US
- United States
- Prior art keywords
- lead
- sheet winding
- sheet
- magnetic device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000004804 winding Methods 0.000 claims abstract description 45
- 230000000630 rising effect Effects 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/027—Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
- H01F2005/046—Details of formers and pin terminals related to mounting on printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Definitions
- This invention relates generally to a magnetic device, such as an inductor or a transformer, especially suited for mounting on a surface of a substrate, and to a method of making such a magnetic device.
- Power magnetic devices such as inductors and transformers
- electrical circuits such as power supply circuits for example.
- most power magnetic devices are fabricated of one or more windings, formed by an electrical member, such as a wire of a circular or rectangular cross section, or a planar conductor, which is wound or mounted to a bobbin of insulative material, e.g., plastic or the like.
- the electrical member is soldered to terminations on the bobbin.
- the electrical member may be threaded through the bobbin for connection directly to a metallized area on a circuit board.
- a ferromagnetic core is typically affixed about the bobbin to impart a greater reactance to the power magnetic device.
- the resistance of the power magnetic device must be reduced, typically, by increasing the cross-sectional area of the electrical member forming the device winding(s).
- the bobbin is usually made very thin in the region constituting the core of the device to optimize the electrical member resistance.
- the remainder of the bobbin is usually made thick to facilitate attachment of the electrical member to the bobbin terminals and/or to facilitate attachment of terminals on the bobbin to a circuit board.
- Another problem associated with present-day power magnetic devices is the lack of planarity of the device terminations. Because of the need to optimize the winding thickness of the power magnetic device in order to provide the requisite number of turns while minimizing the winding resistance, the thickness of the electrical member forming each separate winding of the device is often varied. The variation in the winding thickness often results in a lack of planarity of the device terminations, which is especially critical when the device is to be mounted onto a surface of a substrate such as a printed circuit board.
- a power magnetic device which is especially well suited for attachment to the surface of a substrate.
- the power magnetic device comprises at least one sheet winding having a pair of spaced-apart terminations. Each sheet winding termination at least partially receives an upwardly rising portion of a separate lead lying coplanar with every other lead.
- the sheet winding terminations and upwardly rising portion of each lead, together with the sheet winding itself, are encapsulated with an insulative material such that each lead has a portion extending out from the encapsulant.
- a ferromagnetic core surrounds at least a portion of the sheet winding(s) to impart a greater reactance to the power magnetic device.
- the portion of each lead of the power magnetic device extending out from the encapsulant is typically formed to facilitate attachment of the power magnetic device to a surface of a substrate such as a printed wiring board or the like.
- FIG. 1 is a perspective view of a power magnetic device in accordance with a preferred embodiment of the invention
- FIG. 2 is a cross-sectional view of the device of FIG. 1;
- FIG. 3 is a perspective view of an assembly comprised of a lead frame stock on which sheet windings are layered to fabricate the device of FIG. 1;
- FIG. 4 is a perspective view of the assembly of FIG. 3 after encapsulation, showing how a core assembly is attached thereto to fabricate the power magnetic device of FIG. 1.
- FIG. 1 shows a power magnetic device 10 in accordance with the invention.
- the device 10 has a plurality of leads 12 which, in the illustrated embodiment of FIG. 1, are arranged in two opposed banks 14 and 16. While the illustrated embodiment is depicted as having four and six leads in the banks 14 and 16, respectively, a greater or lesser number of leads is possible.
- Each of the leads 12 in each of the banks 14 and 16 extends out from a separate one of a pair of insulative bodies 18 and 19 spaced apart by a gap g.
- the gap g between the bodies 18 and 19 is enclosed by a pair of core halves 20 and 22 lying in opposed, face-to-face relationship.
- Each of the core halves 20 and 22 is fabricated from a ferromagnetic material.
- each sheet winding 24 is comprised of a generally circular conductive element 25 having a pair of radially, outwardly extending, spaced-apart terminations 26, each having an aperture 27 therethrough.
- the conductive member 25 may be formed of a unitary structure which is punched or etched from a metallic strip of copper or the like and coated with a dielectric.
- the conductive member 25 of each sheet winding 24 may be formed of a flat, wound-wire coil.
- the power magnetic device 10 is fabricated in the following manner.
- a lead frame stock 30 is first fabricated from a strip of metal, such as copper or the like.
- the lead frame stock 30 is either punched or etched, and then is manipulated to create the opposed banks 14 and 16 of leads 12 such that each lead is provided with the upwardly rising portion 28.
- the leads 12 of each of the banks 14 and 16 are made integral to each other by way of a set of internal webs or dams 32, and by a flashing 33 about the periphery of the leads.
- the sheet windings 24 are stacked one above the other such that the aperture 27 in each sheet winding termination 26 receives the upwardly rising portion 28 of a separate one of the leads 12 in a particular one of the banks 14 and 16.
- the sheet windings 24 can be of the same or different thicknesses, provided that the combined thickness of all the sheet windings is less than the height of the upwardly rising portion 28 of each lead 12.
- the sheet windings 24 can vary in thickness without adversely affecting the planarity of the leads 12.
- the sheet winding terminations 26 are soldered or otherwise mechanically bonded to the corresponding, upwardly rising lead portions 28, using a mass reflow bonding technique as is well known in the art.
- the lead frame stock 30 of FIG. 2 is then placed in a mold (not shown) consisting of upper and lower mold halves.
- the sheet winding terminations 26 and the upwardly rising portion 28 of the leads 12 in each of the banks 14 and 16 reside in a pair of spaced-apart mold cavities (not shown) in the lower mold half, separated from the upper mold half by the lead frame stock 30.
- the lower mold half typically has an intermediate cavity (not shown) lying between the two cavities accommodating a separate one of the lead banks 14 and 16.
- the central cavity accommodates the central portion of the sheet windings 24.
- the depth of each of the two cavities accommodating the upwardly rising portion of the lead banks 14 and 16 is greater than that of the cavity accommodating the central portion of the sheet windings 24.
- the mold may be configured to mold a plurality of devices at one time.
- insulative encapsulant typically plastic or the like
- the molding process employs high pressure (in excess of 350 psi) to force the insulative material into the mold cavities, thereby allowing the use of highly thermally filled materials which typically have a high viscosity and also eliminating air voids in such insulative material.
- the result of the molding process is the formation of the insulative bodies 18 and 19 of FIG. 2 which encapsulate the sheet winding terminations 26 and the upwardly rising lead portions 28 of each of the lead banks 14 and 16, respectively, and the formation of an insulative body 34 which encapsulates the central portion of the sheet windings 24.
- the insulative body 34 serves to impart a large measure of rigidity to the sheet windings 24. Note that the insulative body 34 is of a height much less than the height of the bodies 18 and 19, leaving an "open" region above and below the encapsulated stack of sheet windings.
- the dams 32 and the peripheral flashing 33 of FIG. 3 of the lead frame stock 30 are trimmed from the leads 12, and the leads are then formed as seen in FIG. 4 to complete the magnetic device and facilitate its attachment to a surface of a substrate (not shown) such as a printed circuit board.
- the leads 12 could be formed for insertion in corresponding apertures in a circuit board. Rather than trim all of the dams 32, it may be desirable to allow selected ones of the dams to remain in place to effectively short-circuit one or more pairs of the leads 12 to increase the current-carrying capability of the device 10.
- the above-described construction of the magnetic device 10 affords a number of distinct advantages.
- a far greater strength is afforded to the stack of sheet windings 24 than would be afforded by a conventional bobbin.
- the fact that the device 10 is fabricated without a bobbin allows it to have a reduced size without any diminution in strength.
- more highly thermally filled materials can be used, allowing for better heat dissipation, and also air voids in such material can be eliminated. By eliminating such air voids, the dielectric property of the insulation about the sheet windings is maintained at a high level.
- fabricating the power magnetic device 10 from the lead frame stock 30 allows for greater co-planarity of the leads 12, which better facilitates attachment of the device 10 on the surface of a substrate. Also, the use of the lead frame 30 allows for assembly techniques, employed in the construction of integrated circuits, to be employed in fabricating the power magnetic device 10.
- bobbinless power magnetic device 10 which offers increased strength and greater coplanarity as compared to devices utilizing a bobbin.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
Claims (5)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/989,394 US5345670A (en) | 1992-12-11 | 1992-12-11 | Method of making a surface-mount power magnetic device |
EP93309626A EP0601791A1 (en) | 1992-12-11 | 1993-12-01 | Surface-mount power magnetic device and method of making the same |
JP5339867A JPH06215953A (en) | 1992-12-11 | 1993-12-07 | Magnet device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/989,394 US5345670A (en) | 1992-12-11 | 1992-12-11 | Method of making a surface-mount power magnetic device |
Publications (1)
Publication Number | Publication Date |
---|---|
US5345670A true US5345670A (en) | 1994-09-13 |
Family
ID=25535080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/989,394 Expired - Lifetime US5345670A (en) | 1992-12-11 | 1992-12-11 | Method of making a surface-mount power magnetic device |
Country Status (3)
Country | Link |
---|---|
US (1) | US5345670A (en) |
EP (1) | EP0601791A1 (en) |
JP (1) | JPH06215953A (en) |
Cited By (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5469334A (en) * | 1991-09-09 | 1995-11-21 | Power Integrations, Inc. | Plastic quad-packaged switched-mode integrated circuit with integrated transformer windings and mouldings for transformer core pieces |
US5479146A (en) * | 1993-07-21 | 1995-12-26 | Fmtt, Inc. | Pot core matrix transformer having improved heat rejection |
EP0726642A1 (en) * | 1995-02-08 | 1996-08-14 | AT&T Corp. | High frequency surface mount transformer-diode power module |
US5724016A (en) * | 1995-05-04 | 1998-03-03 | Lucent Technologies Inc. | Power magnetic device employing a compression-mounted lead to a printed circuit board |
US5804952A (en) * | 1996-12-05 | 1998-09-08 | Lucent Technologies Inc. | Encapsulated package for a power magnetic device and method of manufacture therefor |
WO1999017317A1 (en) * | 1997-09-29 | 1999-04-08 | Pulse Engineering, Inc. | Microelectronic component carrier and method of its manufacture |
DE19818673A1 (en) * | 1998-04-27 | 1999-10-28 | Thomson Brandt Gmbh | Kitchen sink |
US6073339A (en) * | 1996-09-20 | 2000-06-13 | Tdk Corporation Of America | Method of making low profile pin-less planar magnetic devices |
US6138344A (en) * | 1997-08-08 | 2000-10-31 | Lucent Technologies Inc. | Methods of manufacturing a magnetic device and tool for manufacturing the same |
US6239683B1 (en) | 1995-05-04 | 2001-05-29 | Tyco Electronics Logistics A.G. | Post-mountable planar magnetic device and method of manufacture thereof |
US6353379B1 (en) | 2000-02-28 | 2002-03-05 | Lucent Technologies Inc. | Magnetic device employing a winding structure spanning multiple boards and method of manufacture thereof |
US20040095737A1 (en) * | 2000-07-31 | 2004-05-20 | Delta Electronics, Inc | Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure |
US20050046534A1 (en) * | 2003-07-08 | 2005-03-03 | Gilmartin Michael T. | Form-less electronic device and methods of manufacturing |
US20050168216A1 (en) * | 2002-01-23 | 2005-08-04 | Mitsubishi Denki Kabushiki Kaisha | Rotation angle detector |
DE19945013C5 (en) * | 1999-09-20 | 2005-10-13 | Epcos Ag | Planar |
US20050241415A1 (en) * | 2004-04-28 | 2005-11-03 | Damon Germanton | Load sensor plate |
US20060097833A1 (en) * | 2004-11-10 | 2006-05-11 | Lotfi Ashraf W | Encapsulated package for a magnetic device |
US20060096088A1 (en) * | 2004-11-10 | 2006-05-11 | Lotfi Ashraf W | Method of manufacturing an encapsulated package for a magnetic device |
US20060097832A1 (en) * | 2004-11-10 | 2006-05-11 | Lotfi Ashraf W | Encapsulated package for a magnetic device |
US20060097831A1 (en) * | 2004-11-10 | 2006-05-11 | Lotfi Ashraf W | Power module |
US20070075817A1 (en) * | 2005-10-05 | 2007-04-05 | Lotfi Ashraf W | Magnetic device having a conductive clip |
US7378932B1 (en) | 2007-05-11 | 2008-05-27 | Ice Components, Inc. | Reduced size high-frequency surface-mount current sense transformer |
US7426780B2 (en) | 2004-11-10 | 2008-09-23 | Enpirion, Inc. | Method of manufacturing a power module |
US20090066300A1 (en) * | 2007-09-10 | 2009-03-12 | Lotfi Ashraf W | Power Converter Employing a Micromagnetic Device |
US20090066467A1 (en) * | 2007-09-10 | 2009-03-12 | Lotfi Ashraf W | Micromagnetic Device and Method of Forming the Same |
US20090085702A1 (en) * | 2007-09-29 | 2009-04-02 | Delta Electronics, Inc. | Connector and Power Transformer Structure Comprising the Same |
US20090160594A1 (en) * | 2007-12-20 | 2009-06-25 | Kabushiki Kaisha Toshiba | Coiled component and electronic apparatus |
US20090309686A1 (en) * | 2008-06-12 | 2009-12-17 | Power Integrations, Inc. | Low profile coil-wound bobbin |
US20100163068A1 (en) * | 2008-12-17 | 2010-07-01 | L'oreal | Nail varnish comprising at least one polysaccharide ester or alkyl ether and at least one plant resin |
US20100265029A1 (en) * | 2009-04-17 | 2010-10-21 | Delta Electronics, Inc. | Winding structure for a transformer and winding |
US7920042B2 (en) | 2007-09-10 | 2011-04-05 | Enpirion, Inc. | Micromagnetic device and method of forming the same |
US20110101949A1 (en) * | 2008-04-16 | 2011-05-05 | Douglas Dean Lopata | Power Converter with Controller Operable in Selected Modes of Operation |
US20110101948A1 (en) * | 2008-04-16 | 2011-05-05 | Douglas Dean Lopata | Power Converter with Controller Operable in Selected Modes of Operation |
US7955868B2 (en) | 2007-09-10 | 2011-06-07 | Enpirion, Inc. | Method of forming a micromagnetic device |
US8018315B2 (en) | 2007-09-10 | 2011-09-13 | Enpirion, Inc. | Power converter employing a micromagnetic device |
US8133529B2 (en) | 2007-09-10 | 2012-03-13 | Enpirion, Inc. | Method of forming a micromagnetic device |
US8139362B2 (en) | 2005-10-05 | 2012-03-20 | Enpirion, Inc. | Power module with a magnetic device having a conductive clip |
US8153473B2 (en) | 2008-10-02 | 2012-04-10 | Empirion, Inc. | Module having a stacked passive element and method of forming the same |
US8266793B2 (en) | 2008-10-02 | 2012-09-18 | Enpirion, Inc. | Module having a stacked magnetic device and semiconductor device and method of forming the same |
US8339802B2 (en) | 2008-10-02 | 2012-12-25 | Enpirion, Inc. | Module having a stacked magnetic device and semiconductor device and method of forming the same |
US8541991B2 (en) | 2008-04-16 | 2013-09-24 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
US20130278371A1 (en) * | 2012-03-27 | 2013-10-24 | Pulse Electronics, Inc. | Flat coil planar transformer and methods |
US8631560B2 (en) | 2005-10-05 | 2014-01-21 | Enpirion, Inc. | Method of forming a magnetic device having a conductive clip |
US8692532B2 (en) | 2008-04-16 | 2014-04-08 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
US8698463B2 (en) | 2008-12-29 | 2014-04-15 | Enpirion, Inc. | Power converter with a dynamically configurable controller based on a power conversion mode |
US8701272B2 (en) | 2005-10-05 | 2014-04-22 | Enpirion, Inc. | Method of forming a power module with a magnetic device having a conductive clip |
US20140275915A1 (en) * | 2013-03-13 | 2014-09-18 | Medtronic, Inc. | Implantable medical device including a molded planar transformer |
US8867295B2 (en) | 2010-12-17 | 2014-10-21 | Enpirion, Inc. | Power converter for a memory module |
US9054086B2 (en) | 2008-10-02 | 2015-06-09 | Enpirion, Inc. | Module having a stacked passive element and method of forming the same |
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US11670448B2 (en) * | 2018-05-07 | 2023-06-06 | Astronics Advanced Electronic Systems Corp. | System of termination of high power transformers for reduced AC termination loss at high frequency |
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US6335671B1 (en) * | 1999-08-20 | 2002-01-01 | Tyco Electronics Logistics Ag | Surface mount circuit assembly |
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US6628531B2 (en) | 2000-12-11 | 2003-09-30 | Pulse Engineering, Inc. | Multi-layer and user-configurable micro-printed circuit board |
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NL2013277B1 (en) | 2014-07-30 | 2016-09-21 | Compact Electro-Magnetic Tech And Eco-Logical Entpr B V | Electrical device, in particular a coil or a transformer. |
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CN117637312A (en) * | 2022-08-17 | 2024-03-01 | 绵阳普思电子有限公司 | Lead frame structure and magnetic core structure combined with lead frame structure |
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-
1992
- 1992-12-11 US US07/989,394 patent/US5345670A/en not_active Expired - Lifetime
-
1993
- 1993-12-01 EP EP93309626A patent/EP0601791A1/en not_active Withdrawn
- 1993-12-07 JP JP5339867A patent/JPH06215953A/en active Pending
Patent Citations (3)
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