DE60129317D1 - Elektrisch verbinden von integrierten schaltungen und wandlern - Google Patents

Elektrisch verbinden von integrierten schaltungen und wandlern

Info

Publication number
DE60129317D1
DE60129317D1 DE60129317T DE60129317T DE60129317D1 DE 60129317 D1 DE60129317 D1 DE 60129317D1 DE 60129317 T DE60129317 T DE 60129317T DE 60129317 T DE60129317 T DE 60129317T DE 60129317 D1 DE60129317 D1 DE 60129317D1
Authority
DE
Germany
Prior art keywords
walkers
integrated circuits
electrically connecting
connecting integrated
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60129317T
Other languages
English (en)
Other versions
DE60129317T2 (de
Inventor
Schelto Vandoorn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Finisar Corp
Original Assignee
Infineon Technologies North America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies North America Corp filed Critical Infineon Technologies North America Corp
Application granted granted Critical
Publication of DE60129317D1 publication Critical patent/DE60129317D1/de
Publication of DE60129317T2 publication Critical patent/DE60129317T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE60129317T 2000-05-18 2001-05-15 Elektrisch verbinden von integrierten schaltungen und wandlern Expired - Fee Related DE60129317T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/574,647 US6969265B2 (en) 2000-05-18 2000-05-18 Electrically connecting integrated circuits and transducers
US574647 2000-05-18
PCT/US2001/015758 WO2001089275A2 (en) 2000-05-18 2001-05-15 Electrically connecting integrated circuits and transducers

Publications (2)

Publication Number Publication Date
DE60129317D1 true DE60129317D1 (de) 2007-08-23
DE60129317T2 DE60129317T2 (de) 2008-03-20

Family

ID=24297006

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60129317T Expired - Fee Related DE60129317T2 (de) 2000-05-18 2001-05-15 Elektrisch verbinden von integrierten schaltungen und wandlern

Country Status (5)

Country Link
US (1) US6969265B2 (de)
EP (1) EP1284094B1 (de)
DE (1) DE60129317T2 (de)
TW (1) TW515014B (de)
WO (1) WO2001089275A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9052880B2 (en) 2012-04-18 2015-06-09 International Business Machines Corporation Multi-level interconnect apparatus
US9960840B2 (en) * 2014-09-15 2018-05-01 Arris Enterprises Llc Intra-chassis protection systems and methods for passive optical network optical line terminals

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4171855A (en) * 1977-06-06 1979-10-23 Jef Raskin Multi-position electronic component mounting
US4345299A (en) * 1980-11-03 1982-08-17 Motorola, Inc. Capacitive pressure transducer assembly with improved output lead design
US4373778A (en) 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4553813A (en) 1983-05-16 1985-11-19 International Business Machines Corporation Fiber optic connector system for integrated circuit modules
US4846701A (en) * 1987-12-16 1989-07-11 Amp Incorporated Quick disconnect smart connector
US4953930A (en) 1989-03-15 1990-09-04 Ramtech, Inc. CPU socket supporting socket-to-socket optical communications
EP0419689B1 (de) 1989-09-25 1994-06-01 Siemens Aktiengesellschaft Baugruppe mit einer Leiterplatte
US5134508A (en) 1990-01-29 1992-07-28 The United States Of America As Represented By The Secretary Of The Navy Optical high-speed parallel backplane
US5199087A (en) 1991-12-31 1993-03-30 Texas Instruments Incorporated Optoelectronic integrated circuit for transmitting optical and electrical signals and method of forming same
JP2986613B2 (ja) 1992-05-27 1999-12-06 株式会社日立製作所 光伝送モジュール
CN1038179C (zh) * 1992-09-30 1998-04-22 星精密株式会社 电音响变换器
US5408373A (en) * 1993-03-15 1995-04-18 International Business Machines Corporation Integrated transducer-suspension assembly for vertical recording
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
SE9402082L (sv) * 1994-06-14 1995-12-15 Ericsson Telefon Ab L M Optisk miniatyrkapsel
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
JPH1168031A (ja) 1997-08-11 1999-03-09 Mitsubishi Electric Corp Ｉｃモジュールおよび半導体部品
EP0936485A1 (de) 1998-02-12 1999-08-18 Alcatel Optoelektronisches Bauelement

Also Published As

Publication number Publication date
TW515014B (en) 2002-12-21
DE60129317T2 (de) 2008-03-20
US6969265B2 (en) 2005-11-29
WO2001089275A2 (en) 2001-11-22
EP1284094A2 (de) 2003-02-19
WO2001089275A3 (en) 2002-04-04
EP1284094B1 (de) 2007-07-11
US20020177333A1 (en) 2002-11-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FINISAR CORP., SUNNYVALE, CALIF., US

8339 Ceased/non-payment of the annual fee