DE60118786D1 - Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente - Google Patents

Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente

Info

Publication number
DE60118786D1
DE60118786D1 DE60118786T DE60118786T DE60118786D1 DE 60118786 D1 DE60118786 D1 DE 60118786D1 DE 60118786 T DE60118786 T DE 60118786T DE 60118786 T DE60118786 T DE 60118786T DE 60118786 D1 DE60118786 D1 DE 60118786D1
Authority
DE
Germany
Prior art keywords
conductive
liquid
elements
conductive track
deposition liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60118786T
Other languages
English (en)
Other versions
DE60118786T2 (de
Inventor
Hugh Baker-Smith
Donald Kings
John Tatum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xaar Technology Ltd
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Application granted granted Critical
Publication of DE60118786D1 publication Critical patent/DE60118786D1/de
Publication of DE60118786T2 publication Critical patent/DE60118786T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Confectionery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Coloring (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE60118786T 2000-12-09 2001-12-10 Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente Expired - Fee Related DE60118786T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0030095 2000-12-09
GBGB0030095.4A GB0030095D0 (en) 2000-12-09 2000-12-09 Method of ink jet printing
PCT/GB2001/005442 WO2002047447A1 (en) 2000-12-09 2001-12-10 Method of forming electrically conductive elements and patterns of such elements

Publications (2)

Publication Number Publication Date
DE60118786D1 true DE60118786D1 (de) 2006-05-24
DE60118786T2 DE60118786T2 (de) 2007-04-12

Family

ID=9904792

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60118786T Expired - Fee Related DE60118786T2 (de) 2000-12-09 2001-12-10 Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente

Country Status (8)

Country Link
US (1) US20040160465A1 (de)
EP (1) EP1352548B1 (de)
AT (1) ATE323399T1 (de)
AU (1) AU2002222147A1 (de)
DE (1) DE60118786T2 (de)
ES (1) ES2259648T3 (de)
GB (2) GB0030095D0 (de)
WO (1) WO2002047447A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
GB0305377D0 (en) * 2003-03-08 2003-04-16 Plastic Logic Ltd Surface-energy assisted printing with pressure release points
US7081322B2 (en) 2003-03-27 2006-07-25 Kodak Graphics Communications Canada Company Nanopastes as ink-jet compositions for printing plates
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7217502B2 (en) 2003-03-27 2007-05-15 Eastman Kodak Company Nanopastes for use as patterning compositions
US7094503B2 (en) 2003-03-27 2006-08-22 Kodak Graphics Communications Canada Company Nanopastes for use as patterning compositions
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
US6899988B2 (en) 2003-06-13 2005-05-31 Kodak Polychrome Graphics Llc Laser thermal metallic donors
US20050276933A1 (en) * 2004-06-14 2005-12-15 Ravi Prasad Method to form a conductive structure
EP1672967A1 (de) * 2004-12-17 2006-06-21 Valtronic S.A. Herstellungsverfahren einer mikrostrukturierten Volumenvorrichtung
US20060158478A1 (en) * 2005-01-14 2006-07-20 Howarth James J Circuit modeling and selective deposition
WO2006076607A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076604A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
WO2006076611A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
JP2006195863A (ja) * 2005-01-17 2006-07-27 Fujitsu Ten Ltd エラー検出装置
EP1728644B1 (de) * 2005-06-02 2009-01-21 Agfa Graphics N.V. Tintenstrahlsicherheitsmarkierung für ein Produkt oder eine Produktverpackung
EP2156715B1 (de) 2007-06-01 2012-05-02 BAE Systems PLC Direktschreib- und additive herstellungsprozesse und -vorrichtung
JP4939354B2 (ja) * 2007-09-28 2012-05-23 富士フイルム株式会社 インクジェット記録装置
US20100323102A1 (en) * 2009-06-23 2010-12-23 Xerox Corporation System and Method for Preparing Conductive Structures Using Radiation Curable Phase Change Gel Inks
JP5610836B2 (ja) * 2010-05-10 2014-10-22 キヤノン株式会社 インクジェット記録ヘッド
US20120236102A1 (en) * 2011-03-17 2012-09-20 Seiko Epson Corporation Method for manufacturing electronic component, method for marking same, and device for marking same
CN103747943B (zh) * 2011-04-17 2017-05-24 斯特拉塔西斯有限公司 用于对象的增材制造的系统和方法
US8586871B2 (en) 2011-07-19 2013-11-19 The Charles Stark Draper Laboratory, Inc. Interconnect schemes, and materials and methods for producing the same
WO2013163585A1 (en) * 2012-04-26 2013-10-31 Northeastern University Device and method to additively fabricate structures containing embedded electronics or sensors
US10548231B2 (en) 2013-11-29 2020-01-28 Botfactory Inc. Apparatus for depositing conductive and nonconductive material to form a printed circuit
EP3075216A4 (de) * 2013-11-29 2018-04-18 Michael E. Knox Vorrichtung und verfahren zur herstellung von leiterplatten und bauteilbefestigung
EP2892012A1 (de) * 2014-01-06 2015-07-08 Gemalto SA Elektronisches Modul, sein Herstellungsverfahren und dieses Modul umfassende elektronische Vorrichtung
US20150201500A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR System, device, and method of three-dimensional printing
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
US20150197063A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Device, method, and system of three-dimensional printing
US20210360786A1 (en) * 2018-10-11 2021-11-18 Schmutz Ip, Llc Methods for printing conductive inks and substrates produced thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
CH673920A5 (de) * 1987-05-19 1990-04-12 Rino Doriguzzi
CH673820A5 (en) * 1987-06-17 1990-04-12 Tetra Pak Romont Method of packing sterile goods
DK648187D0 (da) * 1987-12-09 1987-12-09 Linkease Test Systems A S Fremgangsmaade og apparat til fremstilling af kredsloebsdel
FR2718142B1 (fr) * 1994-03-31 1996-12-20 Toxot Science & Appl Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre.
US5972419A (en) * 1997-06-13 1999-10-26 Hewlett-Packard Company Electroluminescent display and method for making the same
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
WO1999053738A1 (de) * 1998-04-09 1999-10-21 Institut für Diagnostikforschung GmbH an der Freien Universität Berlin Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen
US6815125B1 (en) * 1999-06-30 2004-11-09 Dai Nippon Printing Co., Ltd. Color filter and process for producing the same
US6501527B1 (en) * 1999-07-29 2002-12-31 Canon Kabushiki Kaisha Liquid crystal elemental device, production process thereof and spacer-bearing substrate
US6743556B2 (en) * 2001-08-09 2004-06-01 Creo Srl Method for accurate placement of fluid materials on a substrate
GB2379083A (en) * 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体

Also Published As

Publication number Publication date
GB2385561A (en) 2003-08-27
AU2002222147A1 (en) 2002-06-18
DE60118786T2 (de) 2007-04-12
EP1352548B1 (de) 2006-04-12
ES2259648T3 (es) 2006-10-16
WO2002047447A8 (en) 2002-07-11
US20040160465A1 (en) 2004-08-19
ATE323399T1 (de) 2006-04-15
GB0030095D0 (en) 2001-01-24
WO2002047447A1 (en) 2002-06-13
EP1352548A1 (de) 2003-10-15
GB2385561B (en) 2004-07-21
GB0311984D0 (en) 2003-06-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee