ATE323399T1 - Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente - Google Patents

Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente

Info

Publication number
ATE323399T1
ATE323399T1 AT01270087T AT01270087T ATE323399T1 AT E323399 T1 ATE323399 T1 AT E323399T1 AT 01270087 T AT01270087 T AT 01270087T AT 01270087 T AT01270087 T AT 01270087T AT E323399 T1 ATE323399 T1 AT E323399T1
Authority
AT
Austria
Prior art keywords
conductive
liquid
elements
conductive track
deposition liquid
Prior art date
Application number
AT01270087T
Other languages
English (en)
Inventor
Hugh Baker-Smith
Donald Kings
John Tatum
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Application granted granted Critical
Publication of ATE323399T1 publication Critical patent/ATE323399T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
AT01270087T 2000-12-09 2001-12-10 Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente ATE323399T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0030095.4A GB0030095D0 (en) 2000-12-09 2000-12-09 Method of ink jet printing

Publications (1)

Publication Number Publication Date
ATE323399T1 true ATE323399T1 (de) 2006-04-15

Family

ID=9904792

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01270087T ATE323399T1 (de) 2000-12-09 2001-12-10 Verfahren zum ausbilden von elektrisch leitenden elementen und muster solcher elemente

Country Status (8)

Country Link
US (1) US20040160465A1 (de)
EP (1) EP1352548B1 (de)
AT (1) ATE323399T1 (de)
AU (1) AU2002222147A1 (de)
DE (1) DE60118786T2 (de)
ES (1) ES2259648T3 (de)
GB (2) GB0030095D0 (de)
WO (1) WO2002047447A1 (de)

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GB0305377D0 (en) * 2003-03-08 2003-04-16 Plastic Logic Ltd Surface-energy assisted printing with pressure release points
US7094503B2 (en) 2003-03-27 2006-08-22 Kodak Graphics Communications Canada Company Nanopastes for use as patterning compositions
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7217502B2 (en) 2003-03-27 2007-05-15 Eastman Kodak Company Nanopastes for use as patterning compositions
US7081322B2 (en) 2003-03-27 2006-07-25 Kodak Graphics Communications Canada Company Nanopastes as ink-jet compositions for printing plates
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
US6899988B2 (en) 2003-06-13 2005-05-31 Kodak Polychrome Graphics Llc Laser thermal metallic donors
US20050276933A1 (en) * 2004-06-14 2005-12-15 Ravi Prasad Method to form a conductive structure
EP1672967A1 (de) * 2004-12-17 2006-06-21 Valtronic S.A. Herstellungsverfahren einer mikrostrukturierten Volumenvorrichtung
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
WO2006076607A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of passive electricalcomponents
WO2006076605A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Circuit modeling and selective deposition
WO2006076606A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060160373A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
WO2006076610A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
US7575621B2 (en) 2005-01-14 2009-08-18 Cabot Corporation Separation of metal nanoparticles
JP2006195863A (ja) * 2005-01-17 2006-07-27 Fujitsu Ten Ltd エラー検出装置
DE602005012486D1 (de) * 2005-06-02 2009-03-12 Agfa Graphics Nv Tintenstrahlsicherheitsmarkierung für ein Produkt oder eine Produktverpackung
ATE556572T1 (de) 2007-06-01 2012-05-15 Bae Systems Plc Direktschreib- und additive herstellungsprozesse und -vorrichtung
JP4939354B2 (ja) * 2007-09-28 2012-05-23 富士フイルム株式会社 インクジェット記録装置
US20100323102A1 (en) * 2009-06-23 2010-12-23 Xerox Corporation System and Method for Preparing Conductive Structures Using Radiation Curable Phase Change Gel Inks
JP5610836B2 (ja) * 2010-05-10 2014-10-22 キヤノン株式会社 インクジェット記録ヘッド
US20120236102A1 (en) * 2011-03-17 2012-09-20 Seiko Epson Corporation Method for manufacturing electronic component, method for marking same, and device for marking same
CN108058373B (zh) 2011-04-17 2021-03-16 斯特拉塔西斯有限公司 用于对象的增材制造的系统和方法
US8586871B2 (en) 2011-07-19 2013-11-19 The Charles Stark Draper Laboratory, Inc. Interconnect schemes, and materials and methods for producing the same
EP2841881A4 (de) * 2012-04-26 2016-01-06 Univ Northeastern Vorrichtung und verfahren für die zusätzliche herstellung von strukturen mit integrierter elektronik oder sensoren
US10779451B2 (en) 2013-11-29 2020-09-15 BotFactory, Inc. Apparatus and method for the manufacturing of printed wiring boards on a substrate
US10548231B2 (en) 2013-11-29 2020-01-28 Botfactory Inc. Apparatus for depositing conductive and nonconductive material to form a printed circuit
EP2892012A1 (de) * 2014-01-06 2015-07-08 Gemalto SA Elektronisches Modul, sein Herstellungsverfahren und dieses Modul umfassende elektronische Vorrichtung
US20150201500A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR System, device, and method of three-dimensional printing
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
US20150197063A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Device, method, and system of three-dimensional printing
EP3864099A4 (de) * 2018-10-11 2022-07-06 Schmutz Ip, LLC Verfahren zum drucken von leitfähigen tinten und daraus hergestellte substrate

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US4485387A (en) * 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
CH673920A5 (de) * 1987-05-19 1990-04-12 Rino Doriguzzi
CH673820A5 (en) * 1987-06-17 1990-04-12 Tetra Pak Romont Method of packing sterile goods
DK648187D0 (da) * 1987-12-09 1987-12-09 Linkease Test Systems A S Fremgangsmaade og apparat til fremstilling af kredsloebsdel
FR2718142B1 (fr) * 1994-03-31 1996-12-20 Toxot Science & Appl Encres pour de dépôt de couches diélectriques par la technique d'impression par jet continu d'encre.
US5972419A (en) * 1997-06-13 1999-10-26 Hewlett-Packard Company Electroluminescent display and method for making the same
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
EP1070444B1 (de) * 1998-04-09 2002-04-17 B.R. Deutschland, vertr.d. Bundesministerium f. Wirtschaft u. Technologie, dieses vertr.d. Präs. d. Phys.-Techn. Bundesanstalt Verfahren und vorrichtung zur herstellung von dünnschichtstrukturen
US6815125B1 (en) * 1999-06-30 2004-11-09 Dai Nippon Printing Co., Ltd. Color filter and process for producing the same
US6501527B1 (en) * 1999-07-29 2002-12-31 Canon Kabushiki Kaisha Liquid crystal elemental device, production process thereof and spacer-bearing substrate
US6743556B2 (en) * 2001-08-09 2004-06-01 Creo Srl Method for accurate placement of fluid materials on a substrate
GB2379083A (en) * 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体

Also Published As

Publication number Publication date
US20040160465A1 (en) 2004-08-19
GB0030095D0 (en) 2001-01-24
WO2002047447A1 (en) 2002-06-13
DE60118786T2 (de) 2007-04-12
EP1352548B1 (de) 2006-04-12
EP1352548A1 (de) 2003-10-15
WO2002047447A8 (en) 2002-07-11
GB0311984D0 (en) 2003-06-25
DE60118786D1 (de) 2006-05-24
GB2385561A (en) 2003-08-27
ES2259648T3 (es) 2006-10-16
AU2002222147A1 (en) 2002-06-18
GB2385561B (en) 2004-07-21

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Legal Events

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