AU2002222147A1 - Method of printing using a droplet deposition apparatus - Google Patents

Method of printing using a droplet deposition apparatus

Info

Publication number
AU2002222147A1
AU2002222147A1 AU2002222147A AU2214702A AU2002222147A1 AU 2002222147 A1 AU2002222147 A1 AU 2002222147A1 AU 2002222147 A AU2002222147 A AU 2002222147A AU 2214702 A AU2214702 A AU 2214702A AU 2002222147 A1 AU2002222147 A1 AU 2002222147A1
Authority
AU
Australia
Prior art keywords
conductive
liquid
printing
conductive track
deposition liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002222147A
Inventor
Hugh Baker-Smith
Donald Kings
John Tatum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xaar Technology Ltd
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Publication of AU2002222147A1 publication Critical patent/AU2002222147A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas

Abstract

A method of forming a printed circuit board using an ink jet print head by printing a three dimensional groove using a curable, non-conductive deposition liquid and depositing a liquid that dries to form a conductive track. The walls on either side of the groove impede the liquid from spreading and consequently larger quantities of the conductive deposition liquid can be deposited without causing a short circuit. A multi layer printed circuit board can be produced by depositing further layers of curable non-conductive deposition liquid over the conductive track, a further conductive track in an upper layer being in contact with a conductive track in a lower layer along a slope formed from the non-conductive deposition liquid.
AU2002222147A 2000-12-09 2001-12-10 Method of printing using a droplet deposition apparatus Abandoned AU2002222147A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0030095 2000-12-09
GBGB0030095.4A GB0030095D0 (en) 2000-12-09 2000-12-09 Method of ink jet printing
PCT/GB2001/005442 WO2002047447A1 (en) 2000-12-09 2001-12-10 Method of forming electrically conductive elements and patterns of such elements

Publications (1)

Publication Number Publication Date
AU2002222147A1 true AU2002222147A1 (en) 2002-06-18

Family

ID=9904792

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002222147A Abandoned AU2002222147A1 (en) 2000-12-09 2001-12-10 Method of printing using a droplet deposition apparatus

Country Status (8)

Country Link
US (1) US20040160465A1 (en)
EP (1) EP1352548B1 (en)
AT (1) ATE323399T1 (en)
AU (1) AU2002222147A1 (en)
DE (1) DE60118786T2 (en)
ES (1) ES2259648T3 (en)
GB (2) GB0030095D0 (en)
WO (1) WO2002047447A1 (en)

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US20060159838A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
GB0305377D0 (en) * 2003-03-08 2003-04-16 Plastic Logic Ltd Surface-energy assisted printing with pressure release points
US7081322B2 (en) 2003-03-27 2006-07-25 Kodak Graphics Communications Canada Company Nanopastes as ink-jet compositions for printing plates
US6921626B2 (en) 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7094503B2 (en) 2003-03-27 2006-08-22 Kodak Graphics Communications Canada Company Nanopastes for use as patterning compositions
US7217502B2 (en) 2003-03-27 2007-05-15 Eastman Kodak Company Nanopastes for use as patterning compositions
US20040224541A1 (en) * 2003-05-09 2004-11-11 Murata Co., Ltd. Apparatus and method for forming solder wicking prevention zone and electronic part
US6899988B2 (en) 2003-06-13 2005-05-31 Kodak Polychrome Graphics Llc Laser thermal metallic donors
US20050276933A1 (en) * 2004-06-14 2005-12-15 Ravi Prasad Method to form a conductive structure
EP1672967A1 (en) * 2004-12-17 2006-06-21 Valtronic S.A. Fabrication method of a miniaturized volume device
WO2006076609A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060176350A1 (en) * 2005-01-14 2006-08-10 Howarth James J Replacement of passive electrical components
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060160373A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Processes for planarizing substrates and encapsulating printable electronic features
WO2006076611A2 (en) 2005-01-14 2006-07-20 Cabot Corporation Production of metal nanoparticles
US20060158478A1 (en) * 2005-01-14 2006-07-20 Howarth James J Circuit modeling and selective deposition
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
JP2006195863A (en) * 2005-01-17 2006-07-27 Fujitsu Ten Ltd Error detection device
DE602005012486D1 (en) * 2005-06-02 2009-03-12 Agfa Graphics Nv Inkjet security marking for a product or product packaging
ATE556572T1 (en) 2007-06-01 2012-05-15 Bae Systems Plc DIRECT WRITE AND ADDITIVE MANUFACTURING PROCESSES AND APPARATUS
JP4939354B2 (en) * 2007-09-28 2012-05-23 富士フイルム株式会社 Inkjet recording device
US20100323102A1 (en) * 2009-06-23 2010-12-23 Xerox Corporation System and Method for Preparing Conductive Structures Using Radiation Curable Phase Change Gel Inks
JP5610836B2 (en) * 2010-05-10 2014-10-22 キヤノン株式会社 Inkjet recording head
US20120236102A1 (en) * 2011-03-17 2012-09-20 Seiko Epson Corporation Method for manufacturing electronic component, method for marking same, and device for marking same
WO2012143923A2 (en) 2011-04-17 2012-10-26 Objet Ltd. System and method for additive manufacturing of an object
US8586871B2 (en) 2011-07-19 2013-11-19 The Charles Stark Draper Laboratory, Inc. Interconnect schemes, and materials and methods for producing the same
WO2013163585A1 (en) * 2012-04-26 2013-10-31 Northeastern University Device and method to additively fabricate structures containing embedded electronics or sensors
US10548231B2 (en) 2013-11-29 2020-01-28 Botfactory Inc. Apparatus for depositing conductive and nonconductive material to form a printed circuit
WO2015081347A1 (en) * 2013-11-29 2015-06-04 Michael Knox Apparatus and method for the manufacturing of printed wiring boards and component attachment
EP2892012A1 (en) * 2014-01-06 2015-07-08 Gemalto SA Electronic module, method for manufacturing same and electronic device including such a module
US20150201500A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR System, device, and method of three-dimensional printing
US20150197062A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Method, device, and system of three-dimensional printing
US20150197063A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR Device, method, and system of three-dimensional printing
US20210360786A1 (en) * 2018-10-11 2021-11-18 Schmutz Ip, Llc Methods for printing conductive inks and substrates produced thereof

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CH673920A5 (en) * 1987-05-19 1990-04-12 Rino Doriguzzi
CH673820A5 (en) * 1987-06-17 1990-04-12 Tetra Pak Romont Method of packing sterile goods
DK648187D0 (en) * 1987-12-09 1987-12-09 Linkease Test Systems A S METHOD AND APPARATUS FOR CIRCUIT MANUFACTURING
FR2718142B1 (en) * 1994-03-31 1996-12-20 Toxot Science & Appl Inks for depositing dielectric layers by the continuous ink jet printing technique.
US5972419A (en) * 1997-06-13 1999-10-26 Hewlett-Packard Company Electroluminescent display and method for making the same
EP1027723B1 (en) * 1997-10-14 2009-06-17 Patterning Technologies Limited Method of forming an electric capacitor
JP4003273B2 (en) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 Pattern forming method and substrate manufacturing apparatus
EP1070444B1 (en) * 1998-04-09 2002-04-17 B.R. Deutschland, vertr.d. Bundesministerium f. Wirtschaft u. Technologie, dieses vertr.d. Präs. d. Phys.-Techn. Bundesanstalt Method and device for producing thin-layer structures
KR100687835B1 (en) * 1999-06-30 2007-02-27 다이니폰 인사츠 가부시키가이샤 Color filter and process for producing the same
US6501527B1 (en) * 1999-07-29 2002-12-31 Canon Kabushiki Kaisha Liquid crystal elemental device, production process thereof and spacer-bearing substrate
US6743556B2 (en) * 2001-08-09 2004-06-01 Creo Srl Method for accurate placement of fluid materials on a substrate
GB2379083A (en) * 2001-08-20 2003-02-26 Seiko Epson Corp Inkjet printing on a substrate using two immiscible liquids
JP2003133691A (en) * 2001-10-22 2003-05-09 Seiko Epson Corp Method and device for forming film pattern, conductive film wiring, electro-optical device, electronic equipment, and non-contact card medium

Also Published As

Publication number Publication date
GB2385561B (en) 2004-07-21
GB0311984D0 (en) 2003-06-25
DE60118786T2 (en) 2007-04-12
GB0030095D0 (en) 2001-01-24
WO2002047447A1 (en) 2002-06-13
DE60118786D1 (en) 2006-05-24
EP1352548A1 (en) 2003-10-15
ES2259648T3 (en) 2006-10-16
GB2385561A (en) 2003-08-27
WO2002047447A8 (en) 2002-07-11
ATE323399T1 (en) 2006-04-15
EP1352548B1 (en) 2006-04-12
US20040160465A1 (en) 2004-08-19

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