DE60116757T4 - Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges - Google Patents

Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges Download PDF

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Publication number
DE60116757T4
DE60116757T4 DE60116757T DE60116757T DE60116757T4 DE 60116757 T4 DE60116757 T4 DE 60116757T4 DE 60116757 T DE60116757 T DE 60116757T DE 60116757 T DE60116757 T DE 60116757T DE 60116757 T4 DE60116757 T4 DE 60116757T4
Authority
DE
Germany
Prior art keywords
polishing
substrate
monitoring system
signal
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60116757T
Other languages
German (de)
English (en)
Other versions
DE60116757T2 (de
DE60116757D1 (de
Inventor
Hiroji Sunnyvale Hanawa
Nils Los Gatos Johansson
A. Boguslaw San Jose SWEDEK
Manoocher Los Gatos Birang
C. Fritz Fremont REDEKER
Rajeev Fremont BAJAJ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/574,008 external-priority patent/US6924641B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE60116757T2 publication Critical patent/DE60116757T2/de
Application granted granted Critical
Publication of DE60116757T4 publication Critical patent/DE60116757T4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE60116757T 2000-05-19 2001-05-18 Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges Expired - Lifetime DE60116757T4 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US574008 1995-12-18
US09/574,008 US6924641B1 (en) 2000-05-19 2000-05-19 Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US21722800P 2000-07-10 2000-07-10
US217228P 2000-07-10
US22166800P 2000-07-27 2000-07-27
US221668P 2000-07-27
PCT/US2001/016290 WO2001089765A1 (fr) 2000-05-19 2001-05-18 Detection de pointe in situ et procede de surveillance de processus ainsi qu'appareil de polissage chimique mecanique

Publications (2)

Publication Number Publication Date
DE60116757T2 DE60116757T2 (de) 2006-07-27
DE60116757T4 true DE60116757T4 (de) 2007-01-18

Family

ID=27396396

Family Applications (3)

Application Number Title Priority Date Filing Date
DE60132385T Expired - Lifetime DE60132385T2 (de) 2000-05-19 2001-05-18 Polierkissen
DE60116757T Expired - Lifetime DE60116757T4 (de) 2000-05-19 2001-05-18 Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges
DE60116757A Expired - Lifetime DE60116757D1 (de) 2000-05-19 2001-05-18 Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60132385T Expired - Lifetime DE60132385T2 (de) 2000-05-19 2001-05-18 Polierkissen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60116757A Expired - Lifetime DE60116757D1 (de) 2000-05-19 2001-05-18 Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges

Country Status (7)

Country Link
EP (1) EP1294534B2 (fr)
JP (4) JP5542293B2 (fr)
KR (1) KR100827871B1 (fr)
AT (1) ATE315980T1 (fr)
DE (3) DE60132385T2 (fr)
TW (1) TW496812B (fr)
WO (1) WO2001089765A1 (fr)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7374477B2 (en) 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6608495B2 (en) 2001-03-19 2003-08-19 Applied Materials, Inc. Eddy-optic sensor for object inspection
US6966816B2 (en) 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6811466B1 (en) 2001-12-28 2004-11-02 Applied Materials, Inc. System and method for in-line metal profile measurement
JP2005517290A (ja) * 2002-02-06 2005-06-09 アプライド　マテリアルズ　インコーポレイテッド 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置
EP1349199A1 (fr) * 2002-03-28 2003-10-01 Esec Trading S.A. Dispositif pour le montage de puces semiconductrices
DE10310262A1 (de) 2002-03-28 2003-10-23 Esec Trading Sa Einrichtung für die Montage von Halbleiterchips
US7205166B2 (en) * 2002-06-28 2007-04-17 Lam Research Corporation Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
US7112961B2 (en) 2002-12-13 2006-09-26 Applied Materials, Inc. Method and apparatus for dynamically measuring the thickness of an object
US6788050B2 (en) * 2002-12-23 2004-09-07 Lam Research Corp. System, method and apparatus for thin-film substrate signal separation using eddy current
KR100902893B1 (ko) * 2003-01-13 2009-06-16 엘지전자 주식회사 광디스크 표면의 기계적 내구성 검사 장치 및 방법
US7008296B2 (en) * 2003-06-18 2006-03-07 Applied Materials, Inc. Data processing for monitoring chemical mechanical polishing
JP2005051076A (ja) * 2003-07-29 2005-02-24 Trecenti Technologies Inc 半導体装置の製造方法
US7112960B2 (en) * 2003-07-31 2006-09-26 Applied Materials, Inc. Eddy current system for in-situ profile measurement
KR100947230B1 (ko) 2003-09-16 2010-03-11 엘지전자 주식회사 광디스크 표면의 기계적 내구성 검사 장치 및 방법
KR101078007B1 (ko) * 2004-06-21 2011-10-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치 및 폴리싱방법
JP2006128563A (ja) * 2004-11-01 2006-05-18 Toyo Tire & Rubber Co Ltd 半導体ウエハ研磨用研磨パッドおよび半導体デバイスの製造方法
JP2009026850A (ja) * 2007-07-18 2009-02-05 Elpida Memory Inc Ｃｍｐ装置及びｃｍｐによるウェハー研磨方法
JP2009033038A (ja) * 2007-07-30 2009-02-12 Elpida Memory Inc Ｃｍｐ装置及びｃｍｐによるウェハー研磨方法
JP4319692B2 (ja) 2007-09-03 2009-08-26 株式会社東京精密 研磨終了時点の予測・検出方法とその装置並びにリアルタイム膜厚モニタ方法とその装置
JP5495493B2 (ja) * 2008-02-07 2014-05-21 株式会社東京精密 膜厚測定装置、及び膜厚測定方法
DE102008021569A1 (de) 2008-04-30 2009-11-05 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals
JP5513795B2 (ja) * 2009-07-16 2014-06-04 株式会社荏原製作所 研磨方法および装置
JP5513821B2 (ja) * 2009-09-17 2014-06-04 株式会社荏原製作所 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法
US9023667B2 (en) * 2011-04-27 2015-05-05 Applied Materials, Inc. High sensitivity eddy current monitoring system
US9308618B2 (en) 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
US9067295B2 (en) * 2012-07-25 2015-06-30 Applied Materials, Inc. Monitoring retaining ring thickness and pressure control
US9205527B2 (en) * 2012-11-08 2015-12-08 Applied Materials, Inc. In-situ monitoring system with monitoring of elongated region
US9636797B2 (en) * 2014-02-12 2017-05-02 Applied Materials, Inc. Adjusting eddy current measurements
JP6423600B2 (ja) 2014-03-12 2018-11-14 株式会社荏原製作所 膜厚測定装置、及び、研磨装置
TW201710029A (zh) 2015-09-01 2017-03-16 Ebara Corp 渦電流檢測器
JP6779633B2 (ja) 2016-02-23 2020-11-04 株式会社荏原製作所 研磨装置
CN106985059B (zh) * 2017-04-27 2018-12-28 厦门大学 一种空心球体内外球面研抛方法及装置
CN107520740A (zh) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种化学机械抛光中光谱终点的检测方法、装置及系统
TWI689081B (zh) 2018-10-02 2020-03-21 華邦電子股份有限公司 非揮發性記憶體裝置的製造方法
US20200276685A1 (en) * 2019-02-28 2020-09-03 Kevin H. Song Controlling Chemical Mechanical Polishing Pad Stiffness By Adjusting Wetting in the Backing Layer
WO2024091314A1 (fr) * 2022-10-27 2024-05-02 Applied Materials, Inc. Surveillance acoustique de tête de support à l'aide d'un capteur dans un plateau

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005359A (en) * 1975-11-07 1977-01-25 Smoot William N Resonant frequency measuring device for gauging coating thickness
JPS5842902A (ja) * 1981-09-08 1983-03-12 Toyo Seikan Kaisha Ltd プレスの打抜き不良検出装置
US4829251A (en) * 1983-08-31 1989-05-09 Helmut Fischer Electromagnetic probe for measuring the thickness of thin coatings on magnetic substrates
JPS63212804A (ja) * 1987-02-28 1988-09-05 Sumitomo Metal Ind Ltd 膜厚測定方法
US5355083A (en) * 1988-11-16 1994-10-11 Measurex Corporation Non-contact sensor and method using inductance and laser distance measurements for measuring the thickness of a layer of material overlaying a substrate
DE4002083A1 (de) * 1990-01-25 1991-08-01 Hoechst Ag Flaechen- oder schlauchfoermige folie auf basis von cellulosehydrat
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
DE69618698T2 (de) * 1995-03-28 2002-08-14 Applied Materials, Inc. Verfahren und Vorrichtung zur In-Situ-Kontroll und Bestimmung des Endes von chemisch-mechanischen Planiervorgänge
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US5660672A (en) * 1995-04-10 1997-08-26 International Business Machines Corporation In-situ monitoring of conductive films on semiconductor wafers
US5644221A (en) * 1996-03-19 1997-07-01 International Business Machines Corporation Endpoint detection for chemical mechanical polishing using frequency or amplitude mode
JP3303963B2 (ja) * 1997-01-20 2002-07-22 株式会社東京精密 ウェーハの厚み加工量測定装置
JP2973404B2 (ja) * 1997-07-11 1999-11-08 株式会社東京精密 ウェーハ研磨装置
JP3001051B2 (ja) * 1997-08-22 2000-01-17 日本電気株式会社 半導体ウェハ研磨終点検出装置
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6162368A (en) * 1998-06-13 2000-12-19 Applied Materials, Inc. Technique for chemical mechanical polishing silicon
JP3907414B2 (ja) * 2000-01-17 2007-04-18 株式会社荏原製作所 ポリッシング装置
JP3916375B2 (ja) * 2000-06-02 2007-05-16 株式会社荏原製作所 ポリッシング方法および装置

Also Published As

Publication number Publication date
DE60116757T2 (de) 2006-07-27
JP5980843B2 (ja) 2016-08-31
JP5778110B2 (ja) 2015-09-16
JP6041833B2 (ja) 2016-12-14
JP2014209643A (ja) 2014-11-06
EP1294534A1 (fr) 2003-03-26
ATE315980T1 (de) 2006-02-15
DE60132385T2 (de) 2008-05-15
DE60132385D1 (de) 2008-02-21
TW496812B (en) 2002-08-01
JP2013058762A (ja) 2013-03-28
KR100827871B1 (ko) 2008-05-07
EP1294534B1 (fr) 2006-01-18
JP2003534649A (ja) 2003-11-18
WO2001089765A1 (fr) 2001-11-29
KR20030001529A (ko) 2003-01-06
JP5542293B2 (ja) 2014-07-09
JP2014208401A (ja) 2014-11-06
EP1294534B2 (fr) 2006-01-25
DE60116757D1 (de) 2006-04-06

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