DE60111411D1 - Verfahren und gerät zur integrierten prozesssteuerungsstruktur in werkzeugsystemen - Google Patents

Verfahren und gerät zur integrierten prozesssteuerungsstruktur in werkzeugsystemen

Info

Publication number
DE60111411D1
DE60111411D1 DE60111411T DE60111411T DE60111411D1 DE 60111411 D1 DE60111411 D1 DE 60111411D1 DE 60111411 T DE60111411 T DE 60111411T DE 60111411 T DE60111411 T DE 60111411T DE 60111411 D1 DE60111411 D1 DE 60111411D1
Authority
DE
Germany
Prior art keywords
process control
control structure
integrated process
tool systems
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60111411T
Other languages
English (en)
Other versions
DE60111411T2 (de
Inventor
Anthony J Toprac
Elfido Coss Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE60111411D1 publication Critical patent/DE60111411D1/de
Application granted granted Critical
Publication of DE60111411T2 publication Critical patent/DE60111411T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • General Factory Administration (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Multi-Process Working Machines And Systems (AREA)
DE60111411T 2000-10-23 2001-08-16 Verfahren und gerät zur integrierten prozesssteuerungsstruktur in werkzeugsystemen Expired - Lifetime DE60111411T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US694139 1996-08-08
US09/694,139 US6304999B1 (en) 2000-10-23 2000-10-23 Method and apparatus for embedded process control framework in tool systems
PCT/US2001/025655 WO2002035300A2 (en) 2000-10-23 2001-08-16 Method and apparatus for embedded process control framework in tool systems

Publications (2)

Publication Number Publication Date
DE60111411D1 true DE60111411D1 (de) 2005-07-14
DE60111411T2 DE60111411T2 (de) 2006-05-11

Family

ID=24787558

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60111411T Expired - Lifetime DE60111411T2 (de) 2000-10-23 2001-08-16 Verfahren und gerät zur integrierten prozesssteuerungsstruktur in werkzeugsystemen

Country Status (9)

Country Link
US (1) US6304999B1 (de)
EP (1) EP1330684B1 (de)
JP (1) JP2004512691A (de)
KR (1) KR100836946B1 (de)
CN (1) CN1630840B (de)
AU (1) AU2001283404A1 (de)
DE (1) DE60111411T2 (de)
TW (1) TWI281722B (de)
WO (1) WO2002035300A2 (de)

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US6643596B2 (en) * 2001-12-13 2003-11-04 Yield Dynamics, Inc. System and method for controlling critical dimension in a semiconductor manufacturing process
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US20040007325A1 (en) * 2002-06-11 2004-01-15 Applied Materials, Inc. Integrated equipment set for forming a low K dielectric interconnect on a substrate
US20040206621A1 (en) * 2002-06-11 2004-10-21 Hongwen Li Integrated equipment set for forming a low K dielectric interconnect on a substrate
US6735492B2 (en) * 2002-07-19 2004-05-11 International Business Machines Corporation Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings
US6912435B2 (en) * 2002-08-28 2005-06-28 Inficon Lt Inc. Methods and systems for controlling reticle-induced errors
US6912436B1 (en) * 2002-09-30 2005-06-28 Advanced Micro Devices, Inc. Prioritizing an application of correction in a multi-input control system
US6865438B1 (en) 2002-09-30 2005-03-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method of using time interval in IC foundry to control feed back system
US6912438B2 (en) * 2002-10-21 2005-06-28 Advanced Micro Devices, Inc. Using scatterometry to obtain measurements of in circuit structures
US6660543B1 (en) * 2002-10-31 2003-12-09 Advanced Micro Devices, Inc. Method of measuring implant profiles using scatterometric techniques wherein dispersion coefficients are varied based upon depth
WO2004046835A2 (en) 2002-11-15 2004-06-03 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US6815232B2 (en) * 2002-11-26 2004-11-09 Advanced Micro Devices, Inc. Method and apparatus for overlay control using multiple targets
US6957120B1 (en) * 2003-01-06 2005-10-18 Advanced Micro Devices, Inc. Multi-level process data representation
US7352453B2 (en) * 2003-01-17 2008-04-01 Kla-Tencor Technologies Corporation Method for process optimization and control by comparison between 2 or more measured scatterometry signals
US7085676B2 (en) 2003-06-27 2006-08-01 Tokyo Electron Limited Feed forward critical dimension control
JP4880888B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
JP4880889B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
US7018855B2 (en) 2003-12-24 2006-03-28 Lam Research Corporation Process controls for improved wafer uniformity using integrated or standalone metrology
US20050197721A1 (en) * 2004-02-20 2005-09-08 Yung-Cheng Chen Control of exposure energy on a substrate
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US7242995B1 (en) 2004-10-25 2007-07-10 Rockwell Automation Technologies, Inc. E-manufacturing in semiconductor and microelectronics processes
DE102005035735B4 (de) * 2005-07-29 2007-08-16 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Abschätzen eines Zustands einer nicht initialisierten fortschrittlichen Prozesssteuerung durch Anwendung unterteilter Steuerungsdaten
US7672749B1 (en) * 2005-12-16 2010-03-02 GlobalFoundries, Inc. Method and apparatus for hierarchical process control
US20070239305A1 (en) * 2006-03-28 2007-10-11 Haoren Zhuang Process control systems and methods
US7525673B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Optimizing selected variables of an optical metrology system
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US7639351B2 (en) * 2007-03-20 2009-12-29 Tokyo Electron Limited Automated process control using optical metrology with a photonic nanojet
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US7372583B1 (en) * 2007-04-12 2008-05-13 Tokyo Electron Limited Controlling a fabrication tool using support vector machine
US20090065820A1 (en) * 2007-09-06 2009-03-12 Lu-Yang Kao Method and structure for simultaneously fabricating selective film and spacer
US8069020B2 (en) * 2007-09-19 2011-11-29 Tokyo Electron Limited Generating simulated diffraction signal using a dispersion function relating process parameter to dispersion
US8190543B2 (en) * 2008-03-08 2012-05-29 Tokyo Electron Limited Autonomous biologically based learning tool
US7761178B2 (en) * 2008-06-18 2010-07-20 Tokyo Electron Limited Automated process control using an optical metrology system optimized with design goals
US8867018B2 (en) * 2009-02-10 2014-10-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for improved overlay correction
US8229588B2 (en) * 2009-03-03 2012-07-24 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for tuning advanced process control parameters
US9740184B2 (en) * 2009-11-16 2017-08-22 Applied Materials, Inc. Controls interface solution for energy savings
CN103199037A (zh) * 2012-01-06 2013-07-10 沈阳新松机器人自动化股份有限公司 一种半导体加工设备的efem控制系统
KR101967589B1 (ko) * 2012-05-24 2019-04-09 가부시키가이샤 니콘 디바이스 제조 방법 및 기판 처리 방법
CN102880153B (zh) * 2012-10-15 2015-06-24 中达光电工业（吴江）有限公司 使用不同运动控制产品的pcb钻铣设备的运行方法及系统
CN106597913A (zh) * 2015-10-20 2017-04-26 沈阳新松机器人自动化股份有限公司 硅片传输平台控制系统
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
JP6622741B2 (ja) 2017-03-07 2019-12-18 日本碍子株式会社 ハニカム構造体
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Also Published As

Publication number Publication date
CN1630840A (zh) 2005-06-22
TWI281722B (en) 2007-05-21
WO2002035300A2 (en) 2002-05-02
KR100836946B1 (ko) 2008-06-11
EP1330684A2 (de) 2003-07-30
KR20040005846A (ko) 2004-01-16
US6304999B1 (en) 2001-10-16
DE60111411T2 (de) 2006-05-11
CN1630840B (zh) 2010-04-28
EP1330684B1 (de) 2005-06-08
AU2001283404A1 (en) 2002-05-06
WO2002035300A3 (en) 2003-01-16
JP2004512691A (ja) 2004-04-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY

8328 Change in the person/name/address of the agent

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER,