DE60110248D1 - Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel - Google Patents

Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel

Info

Publication number
DE60110248D1
DE60110248D1 DE60110248T DE60110248T DE60110248D1 DE 60110248 D1 DE60110248 D1 DE 60110248D1 DE 60110248 T DE60110248 T DE 60110248T DE 60110248 T DE60110248 T DE 60110248T DE 60110248 D1 DE60110248 D1 DE 60110248D1
Authority
DE
Germany
Prior art keywords
polymer
particulate
crosslinked
binder
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60110248T
Other languages
English (en)
Other versions
DE60110248T2 (de
Inventor
G Swisher
E Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PPG Industries Ohio Inc
Original Assignee
PPG Industries Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PPG Industries Ohio Inc filed Critical PPG Industries Ohio Inc
Application granted granted Critical
Publication of DE60110248D1 publication Critical patent/DE60110248D1/de
Publication of DE60110248T2 publication Critical patent/DE60110248T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE60110248T 2000-09-15 2001-09-14 Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel Expired - Fee Related DE60110248T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US663180 2000-09-15
US09/663,180 US6477926B1 (en) 2000-09-15 2000-09-15 Polishing pad
PCT/US2001/028948 WO2002022309A1 (en) 2000-09-15 2001-09-14 Polishing pad comprising particulate polymer and crosslinked polymer binder

Publications (2)

Publication Number Publication Date
DE60110248D1 true DE60110248D1 (de) 2005-05-25
DE60110248T2 DE60110248T2 (de) 2006-03-09

Family

ID=24660789

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110248T Expired - Fee Related DE60110248T2 (de) 2000-09-15 2001-09-14 Polierkissen mit polymerpartikeln und vernetztem polymer-bindemittel

Country Status (8)

Country Link
US (1) US6477926B1 (de)
EP (1) EP1318891B1 (de)
CN (1) CN100346930C (de)
AT (1) ATE293516T1 (de)
AU (1) AU2001291016A1 (de)
DE (1) DE60110248T2 (de)
TW (1) TW550165B (de)
WO (1) WO2002022309A1 (de)

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US20020016139A1 (en) * 2000-07-25 2002-02-07 Kazuto Hirokawa Polishing tool and manufacturing method therefor
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US20030045214A1 (en) * 2001-08-29 2003-03-06 Shepherd Ross L. Decorative applique remover
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US7399516B2 (en) * 2002-05-23 2008-07-15 Novellus Systems, Inc. Long-life workpiece surface influencing device structure and manufacturing method
CN1684799A (zh) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 平面化用的抛光垫片
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
JP2005538571A (ja) * 2002-09-25 2005-12-15 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための窓を有する研磨パッド
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7066801B2 (en) 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
US6910951B2 (en) 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20040224622A1 (en) * 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
GB2402941B (en) * 2003-06-09 2007-06-27 Kao Corp Method for manufacturing substrate
US7074115B2 (en) * 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US7335239B2 (en) * 2003-11-17 2008-02-26 Advanced Technology Materials, Inc. Chemical mechanical planarization pad
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
TWI385050B (zh) 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
KR100909605B1 (ko) * 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
KR100949560B1 (ko) * 2005-05-17 2010-03-25 도요 고무 고교 가부시키가이샤 연마 패드
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
WO2008026451A1 (en) * 2006-08-28 2008-03-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
US7824249B2 (en) * 2007-02-05 2010-11-02 San Fang Chemical Industry Co., Ltd. Polishing material having polishing particles and method for making the same
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
US20080274674A1 (en) * 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
US7530887B2 (en) * 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
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US9951054B2 (en) * 2009-04-23 2018-04-24 Cabot Microelectronics Corporation CMP porous pad with particles in a polymeric matrix
TWI404596B (zh) * 2009-09-22 2013-08-11 San Fang Chemical Industry Co 製造研磨墊之方法及研磨墊
WO2011087737A2 (en) * 2009-12-22 2011-07-21 3M Innovative Properties Company Polishing pad and method of making the same
CN102859061B (zh) * 2010-04-15 2015-11-25 三井化学株式会社 纺粘非织造布、其制造方法及其用途
CA2823374C (en) * 2010-12-30 2016-04-05 Saint-Gobain Abrasifs Imide cross-linked binders for abrasive articles
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
US10906287B2 (en) 2013-03-15 2021-02-02 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
CN103878707B (zh) * 2014-03-31 2016-04-13 湖北鼎龙化学股份有限公司 化学机械抛光的抛光垫及其制备方法
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102630261B1 (ko) 2014-10-17 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
WO2016062879A1 (de) * 2014-10-24 2016-04-28 Basf Se Schleifelemente und verfahren zu deren herstellung von schleifelementen
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106041719B (zh) * 2016-06-03 2018-10-23 湖北鼎龙控股股份有限公司 一种抛光层及其制备方法以及化学机械抛光垫
NL2017319B1 (en) * 2016-08-16 2018-02-21 Van Blitterswijk Johannes Composition comprising thermoset polyurethane polymer particles provided with thermoplastic polymer particles
US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR101949905B1 (ko) * 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
KR102338854B1 (ko) * 2017-08-31 2021-12-15 후베이 딩후이 마이크로일렉트로닉스 머티리얼즈 코., 엘티디 폴리우레탄 연마층, 연마층을 포함하는 연마 패드, 연마층의 제조 방법 및 재료 평탄화 방법
WO2019173455A1 (en) 2018-03-07 2019-09-12 X-Card Holdings, Llc Metal card
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KR20220034826A (ko) * 2019-07-12 2022-03-18 씨엠씨 머티리얼즈, 인코포레이티드 폴리아민 및 시클로헥산디메탄올 경화제를 사용한 폴리싱 패드
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

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Also Published As

Publication number Publication date
WO2002022309A1 (en) 2002-03-21
EP1318891A1 (de) 2003-06-18
TW550165B (en) 2003-09-01
US6477926B1 (en) 2002-11-12
ATE293516T1 (de) 2005-05-15
CN100346930C (zh) 2007-11-07
EP1318891B1 (de) 2005-04-20
DE60110248T2 (de) 2006-03-09
AU2001291016A1 (en) 2002-03-26
CN1474735A (zh) 2004-02-11

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