DE60109561D1 - Lichtquelle mit Laserdioden-Modul - Google Patents

Lichtquelle mit Laserdioden-Modul

Info

Publication number
DE60109561D1
DE60109561D1 DE60109561T DE60109561T DE60109561D1 DE 60109561 D1 DE60109561 D1 DE 60109561D1 DE 60109561 T DE60109561 T DE 60109561T DE 60109561 T DE60109561 T DE 60109561T DE 60109561 D1 DE60109561 D1 DE 60109561D1
Authority
DE
Germany
Prior art keywords
light source
laser diode
diode module
module
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60109561T
Other languages
English (en)
Inventor
Shinya Nagamatsu
Kenichi Namba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of DE60109561D1 publication Critical patent/DE60109561D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/30—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range using scattering effects, e.g. stimulated Brillouin or Raman effects
    • H01S3/302—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range using scattering effects, e.g. stimulated Brillouin or Raman effects in an optical fibre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Lasers (AREA)
DE60109561T 2000-11-08 2001-11-08 Lichtquelle mit Laserdioden-Modul Expired - Lifetime DE60109561D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000340597A JP4646166B2 (ja) 2000-11-08 2000-11-08 レーザダイオードモジュールからなる光源

Publications (1)

Publication Number Publication Date
DE60109561D1 true DE60109561D1 (de) 2005-04-28

Family

ID=18815483

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60109561T Expired - Lifetime DE60109561D1 (de) 2000-11-08 2001-11-08 Lichtquelle mit Laserdioden-Modul

Country Status (5)

Country Link
US (1) US6839367B2 (de)
EP (1) EP1206018B1 (de)
JP (1) JP4646166B2 (de)
CA (1) CA2357433A1 (de)
DE (1) DE60109561D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
JP2002280659A (ja) * 2001-03-16 2002-09-27 Furukawa Electric Co Ltd:The レーザダイオードモジュールからなる光源
WO2002089208A2 (de) * 2001-04-30 2002-11-07 Mergeoptics Gmbh Anordnung mit mindestens zwei unterschiedlichen elektronischen halbleiterschaltungen
JP2003094716A (ja) * 2001-09-20 2003-04-03 Dainippon Screen Mfg Co Ltd 画像記録装置および光源ユニット
EP1309048A1 (de) * 2001-11-06 2003-05-07 Agilent Technologies, Inc. (a Delaware corporation) Elektronische oder opto-elektronische Gehäuse
JP2005534201A (ja) 2002-07-25 2005-11-10 ジョナサン エス． ダーム、 発光ダイオードを硬化用に使用するための方法および装置
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
US6973106B1 (en) * 2002-10-11 2005-12-06 Corvis Corporation Optical package and optical systems apparatuses, and methods of use therein
US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods
US7508671B2 (en) 2003-10-10 2009-03-24 Intel Corporation Computer system having controlled cooling
US20050257912A1 (en) * 2004-01-12 2005-11-24 Litelaser Llc Laser cooling system and method
EP1766287B1 (de) * 2004-06-15 2012-04-11 Data Cloak LLC Elektro-optische hochleistungs-led-anordnung
GB2419476B (en) * 2004-10-21 2009-04-08 Agilent Technologies Inc Optical networking systems
US7457126B2 (en) 2005-06-27 2008-11-25 Intel Corporation Optical transponder with active heat transfer
US8047686B2 (en) 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
US7755901B2 (en) * 2008-01-08 2010-07-13 Asia Vital Components Co., Ltd. Heat dissipating structure for light emitting diodes
JP5511420B2 (ja) 2010-02-05 2014-06-04 三菱電機株式会社 レーザ光源装置及びプロジェクタ装置
US9746412B2 (en) 2012-05-30 2017-08-29 Iris International, Inc. Flow cytometer
JP6004767B2 (ja) * 2012-06-14 2016-10-12 三菱電機株式会社 光源装置
JPWO2015145608A1 (ja) * 2014-03-26 2017-04-13 株式会社島津製作所 レーザ装置
RU170831U1 (ru) * 2014-03-31 2017-05-11 Айпиджи Фотоникс Корпорэйшн Способ корпусирования лазерного диода высокой мощности и лазерный диодный модуль

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0634409B2 (ja) 1984-01-20 1994-05-02 富士通株式会社 発光ダイオ−ド
JPS60153188A (ja) * 1984-01-21 1985-08-12 Toshiaki Shinmura ヒ−トパイプを利用した半導体レ−ザ−出力装置
JPH0727149B2 (ja) 1986-11-04 1995-03-29 沖電気工業株式会社 光結合器
US4820010A (en) 1987-04-28 1989-04-11 Spectra Diode Laboratories, Inc. Bright output optical system with tapered bundle
JPS63302584A (ja) 1987-06-02 1988-12-09 Fujitsu Ltd レ−ザダイオ−ドの温度制御装置
US4791634A (en) * 1987-09-29 1988-12-13 Spectra-Physics, Inc. Capillary heat pipe cooled diode pumped slab laser
DE3925201A1 (de) * 1989-07-29 1991-02-07 Messerschmitt Boelkow Blohm Optische bank zur halterung optischer, elektrischer u.a. komponenten
JPH04179180A (ja) * 1990-11-08 1992-06-25 Matsushita Electric Ind Co Ltd 短波長レーザ光源
JPH05167143A (ja) * 1991-12-19 1993-07-02 Nippon Steel Corp 半導体レーザ装置
US5371753A (en) * 1993-08-26 1994-12-06 Litton Systems, Inc. Laser diode mount
US5764675A (en) 1994-06-30 1998-06-09 Juhala; Roland E. Diode laser array
JPH08116138A (ja) 1994-10-17 1996-05-07 Mitsubishi Heavy Ind Ltd 半導体レーザ素子の冷却装置
JPH09181376A (ja) 1995-12-26 1997-07-11 Mitsubishi Heavy Ind Ltd 固体レーザ励起用半導体レーザ及びその製造方法
JPH09223845A (ja) * 1996-02-15 1997-08-26 Nec Corp 光モジュール用液体冷却装置
JPH10200208A (ja) 1997-01-09 1998-07-31 Nec Corp 半導体レーザーモジュール
EP1914849B1 (de) * 1997-02-18 2011-06-29 Nippon Telegraph & Telephone Corporation Optischer Verstärker und Übertragungssystem damit
GB9720376D0 (en) 1997-09-26 1997-11-26 Marconi Gec Ltd A semi-conductor laser diode bar assembly
US6252726B1 (en) * 1999-09-02 2001-06-26 Lightlogic, Inc. Dual-enclosure optoelectronic packages
JP2002141609A (ja) 2000-11-02 2002-05-17 Furukawa Electric Co Ltd:The 半導体レーザモジュール、レーザユニット、およびラマン増幅器

Also Published As

Publication number Publication date
EP1206018B1 (de) 2005-03-23
JP2002151784A (ja) 2002-05-24
US6839367B2 (en) 2005-01-04
EP1206018A2 (de) 2002-05-15
JP4646166B2 (ja) 2011-03-09
EP1206018A3 (de) 2002-11-06
CA2357433A1 (en) 2002-05-08
US20020054615A1 (en) 2002-05-09

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Legal Events

Date Code Title Description
8332 No legal effect for de