DE60108969D1 - Einrichtung zum zuführen elektronischer bauelemente zu einer abnahmeposition - Google Patents

Einrichtung zum zuführen elektronischer bauelemente zu einer abnahmeposition

Info

Publication number
DE60108969D1
DE60108969D1 DE60108969T DE60108969T DE60108969D1 DE 60108969 D1 DE60108969 D1 DE 60108969D1 DE 60108969 T DE60108969 T DE 60108969T DE 60108969 T DE60108969 T DE 60108969T DE 60108969 D1 DE60108969 D1 DE 60108969D1
Authority
DE
Germany
Prior art keywords
electronic components
removal position
supplying electronic
supplying
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60108969T
Other languages
English (en)
Other versions
DE60108969T2 (de
Inventor
Der Rijst P Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Assembleon BV
Original Assignee
Assembleon BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Assembleon BV filed Critical Assembleon BV
Publication of DE60108969D1 publication Critical patent/DE60108969D1/de
Application granted granted Critical
Publication of DE60108969T2 publication Critical patent/DE60108969T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60108969T 2000-11-14 2001-11-08 Einrichtung zum zuführen elektronischer bauelemente zu einer abnahmeposition Expired - Lifetime DE60108969T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP00203995 2000-11-14
EP00203995 2000-11-14
PCT/EP2001/013046 WO2002041681A1 (en) 2000-11-14 2001-11-08 Device for supplying electronic components to a pick-up position.

Publications (2)

Publication Number Publication Date
DE60108969D1 true DE60108969D1 (de) 2005-03-24
DE60108969T2 DE60108969T2 (de) 2006-04-06

Family

ID=8172270

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60108969T Expired - Lifetime DE60108969T2 (de) 2000-11-14 2001-11-08 Einrichtung zum zuführen elektronischer bauelemente zu einer abnahmeposition

Country Status (5)

Country Link
US (1) US6705376B2 (de)
EP (1) EP1338183B1 (de)
JP (1) JP4041736B2 (de)
DE (1) DE60108969T2 (de)
WO (1) WO2002041681A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7296963B2 (en) * 2002-08-08 2007-11-20 Intel Corporation Multi-row passive component carrier tape
ITFI20050232A1 (it) * 2005-11-14 2007-05-15 Lcm S R L Caricatore multiplo lineare per macchine di posizionamento automatico di componenti elettronici smd
US7850040B2 (en) * 2006-10-23 2010-12-14 Hover-Davis, Inc. Component tape feeder
JP5357743B2 (ja) 2009-12-26 2013-12-04 富士機械製造株式会社 電子回路部品供給装置
JP2012069669A (ja) * 2010-09-22 2012-04-05 Fuji Mach Mfg Co Ltd テープフィーダ，部品供給装置および部品供給方法
WO2014125528A1 (ja) 2013-02-15 2014-08-21 パナソニック株式会社 部品供給装置および部品供給方法
US10902161B2 (en) * 2015-03-06 2021-01-26 Fuji Corporation Method for optimizing component type arrangement and apparatus for optimizing component type arrangement
US20160345441A1 (en) * 2015-05-22 2016-11-24 Accu-Assembly Incorporated Verifying components for placement
CN109479390B (zh) * 2016-08-08 2020-11-27 雅马哈发动机株式会社 元件供应装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114319B2 (ja) 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JPH06302992A (ja) * 1993-04-14 1994-10-28 Toshiba Corp 部品実装機のカートリッジ構造及び部品実装機の管理システム

Also Published As

Publication number Publication date
EP1338183B1 (de) 2005-02-16
JP2004514279A (ja) 2004-05-13
WO2002041681A1 (en) 2002-05-23
JP4041736B2 (ja) 2008-01-30
DE60108969T2 (de) 2006-04-06
US20030010790A1 (en) 2003-01-16
US6705376B2 (en) 2004-03-16
EP1338183A1 (de) 2003-08-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: ACKMANN MENGES PATENT- UND RECHTSANWAELTE, 80469 M

R082 Change of representative

Ref document number: 1338183

Country of ref document: EP

Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT, DE