DE60106972D1 - Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen - Google Patents
Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungenInfo
- Publication number
- DE60106972D1 DE60106972D1 DE60106972T DE60106972T DE60106972D1 DE 60106972 D1 DE60106972 D1 DE 60106972D1 DE 60106972 T DE60106972 T DE 60106972T DE 60106972 T DE60106972 T DE 60106972T DE 60106972 D1 DE60106972 D1 DE 60106972D1
- Authority
- DE
- Germany
- Prior art keywords
- pillows
- wafer polishing
- devices implementing
- producing reinforced
- reinforced wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US752509 | 1985-07-08 | ||
US752703 | 2000-12-27 | ||
US09/752,509 US6561889B1 (en) | 2000-12-27 | 2000-12-27 | Methods for making reinforced wafer polishing pads and apparatuses implementing the same |
US09/752,703 US6572463B1 (en) | 2000-12-27 | 2000-12-27 | Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same |
PCT/US2001/047219 WO2002051587A1 (en) | 2000-12-27 | 2001-12-07 | Methods for making reinforced wafer polshing pads and apparatuses implementing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60106972D1 true DE60106972D1 (de) | 2004-12-09 |
DE60106972T2 DE60106972T2 (de) | 2005-11-03 |
Family
ID=27115606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60106972T Expired - Fee Related DE60106972T2 (de) | 2000-12-27 | 2001-12-07 | Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1345733B1 (de) |
JP (1) | JP2004524676A (de) |
KR (1) | KR20040015043A (de) |
CN (1) | CN1209229C (de) |
DE (1) | DE60106972T2 (de) |
TW (1) | TW558481B (de) |
WO (1) | WO2002051587A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
US8087975B2 (en) | 2007-04-30 | 2012-01-03 | San Fang Chemical Industry Co., Ltd. | Composite sheet for mounting a workpiece and the method for making the same |
JP4593643B2 (ja) | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
US20110045753A1 (en) * | 2008-05-16 | 2011-02-24 | Toray Industries, Inc. | Polishing pad |
TWI410299B (zh) | 2009-08-24 | 2013-10-01 | Bestac Advanced Material Co Ltd | 研磨墊與其應用及其製造方法 |
CN102990535A (zh) * | 2012-11-27 | 2013-03-27 | 无锡市彩云机械设备有限公司 | 一种抛光垫 |
CN103722500A (zh) * | 2013-11-27 | 2014-04-16 | 苏州道众机械制造有限公司 | 磨削砂带 |
US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
CN106245089B (zh) * | 2016-09-09 | 2017-11-17 | 广东欧珀移动通信有限公司 | 一种铝合金阳极氧化后的高光工艺和铝合金制品 |
KR102318482B1 (ko) * | 2017-03-24 | 2021-10-29 | 주식회사 케이씨텍 | 연마 패드 및 이를 구비하는 기판 연마 장치, 연마 패드의 제조 방법 |
CN113714928B (zh) * | 2021-08-23 | 2023-05-05 | 武汉华星光电半导体显示技术有限公司 | 一种研磨盘及基板清洁装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2036247A1 (en) * | 1990-03-29 | 1991-09-30 | Jeffrey L. Berger | Nonwoven surface finishing articles reinforced with a polymer backing layer and method of making same |
US5897424A (en) * | 1995-07-10 | 1999-04-27 | The United States Of America As Represented By The Secretary Of Commerce | Renewable polishing lap |
US5807161A (en) * | 1996-03-15 | 1998-09-15 | Minnesota Mining And Manufacturing Company | Reversible back-up pad |
US6328642B1 (en) * | 1997-02-14 | 2001-12-11 | Lam Research Corporation | Integrated pad and belt for chemical mechanical polishing |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6290589B1 (en) * | 1998-12-09 | 2001-09-18 | Applied Materials, Inc. | Polishing pad with a partial adhesive coating |
-
2001
- 2001-12-07 KR KR10-2003-7008573A patent/KR20040015043A/ko not_active Application Discontinuation
- 2001-12-07 WO PCT/US2001/047219 patent/WO2002051587A1/en active IP Right Grant
- 2001-12-07 JP JP2002552714A patent/JP2004524676A/ja active Pending
- 2001-12-07 DE DE60106972T patent/DE60106972T2/de not_active Expired - Fee Related
- 2001-12-07 CN CNB018215181A patent/CN1209229C/zh not_active Expired - Fee Related
- 2001-12-07 EP EP01995441A patent/EP1345733B1/de not_active Expired - Lifetime
- 2001-12-25 TW TW090132475A patent/TW558481B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1345733B1 (de) | 2004-11-03 |
TW558481B (en) | 2003-10-21 |
CN1482958A (zh) | 2004-03-17 |
KR20040015043A (ko) | 2004-02-18 |
EP1345733A1 (de) | 2003-09-24 |
CN1209229C (zh) | 2005-07-06 |
DE60106972T2 (de) | 2005-11-03 |
WO2002051587A1 (en) | 2002-07-04 |
JP2004524676A (ja) | 2004-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |