DE60106972D1 - Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen - Google Patents

Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen

Info

Publication number
DE60106972D1
DE60106972D1 DE60106972T DE60106972T DE60106972D1 DE 60106972 D1 DE60106972 D1 DE 60106972D1 DE 60106972 T DE60106972 T DE 60106972T DE 60106972 T DE60106972 T DE 60106972T DE 60106972 D1 DE60106972 D1 DE 60106972D1
Authority
DE
Germany
Prior art keywords
pillows
wafer polishing
devices implementing
producing reinforced
reinforced wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60106972T
Other languages
English (en)
Other versions
DE60106972T2 (de
Inventor
Cangshan Xu
Y Zhao
Fen Dai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/752,509 external-priority patent/US6561889B1/en
Priority claimed from US09/752,703 external-priority patent/US6572463B1/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60106972D1 publication Critical patent/DE60106972D1/de
Publication of DE60106972T2 publication Critical patent/DE60106972T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60106972T 2000-12-27 2001-12-07 Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen Expired - Fee Related DE60106972T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US752509 1985-07-08
US752703 2000-12-27
US09/752,509 US6561889B1 (en) 2000-12-27 2000-12-27 Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US09/752,703 US6572463B1 (en) 2000-12-27 2000-12-27 Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
PCT/US2001/047219 WO2002051587A1 (en) 2000-12-27 2001-12-07 Methods for making reinforced wafer polshing pads and apparatuses implementing the same

Publications (2)

Publication Number Publication Date
DE60106972D1 true DE60106972D1 (de) 2004-12-09
DE60106972T2 DE60106972T2 (de) 2005-11-03

Family

ID=27115606

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60106972T Expired - Fee Related DE60106972T2 (de) 2000-12-27 2001-12-07 Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen

Country Status (7)

Country Link
EP (1) EP1345733B1 (de)
JP (1) JP2004524676A (de)
KR (1) KR20040015043A (de)
CN (1) CN1209229C (de)
DE (1) DE60106972T2 (de)
TW (1) TW558481B (de)
WO (1) WO2002051587A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4884726B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US8087975B2 (en) 2007-04-30 2012-01-03 San Fang Chemical Industry Co., Ltd. Composite sheet for mounting a workpiece and the method for making the same
JP4593643B2 (ja) 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
WO2009139401A1 (ja) * 2008-05-16 2009-11-19 東レ株式会社 研磨パッド
TWI410299B (zh) 2009-08-24 2013-10-01 Bestac Advanced Material Co Ltd 研磨墊與其應用及其製造方法
CN102990535A (zh) * 2012-11-27 2013-03-27 无锡市彩云机械设备有限公司 一种抛光垫
CN103722500A (zh) * 2013-11-27 2014-04-16 苏州道众机械制造有限公司 磨削砂带
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
CN106245089B (zh) * 2016-09-09 2017-11-17 广东欧珀移动通信有限公司 一种铝合金阳极氧化后的高光工艺和铝合金制品
KR102318482B1 (ko) * 2017-03-24 2021-10-29 주식회사 케이씨텍 연마 패드 및 이를 구비하는 기판 연마 장치, 연마 패드의 제조 방법
CN113714928B (zh) * 2021-08-23 2023-05-05 武汉华星光电半导体显示技术有限公司 一种研磨盘及基板清洁装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2036247A1 (en) * 1990-03-29 1991-09-30 Jeffrey L. Berger Nonwoven surface finishing articles reinforced with a polymer backing layer and method of making same
US5897424A (en) * 1995-07-10 1999-04-27 The United States Of America As Represented By The Secretary Of Commerce Renewable polishing lap
US5807161A (en) * 1996-03-15 1998-09-15 Minnesota Mining And Manufacturing Company Reversible back-up pad
US6328642B1 (en) * 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6290589B1 (en) * 1998-12-09 2001-09-18 Applied Materials, Inc. Polishing pad with a partial adhesive coating

Also Published As

Publication number Publication date
DE60106972T2 (de) 2005-11-03
WO2002051587A1 (en) 2002-07-04
EP1345733B1 (de) 2004-11-03
CN1209229C (zh) 2005-07-06
EP1345733A1 (de) 2003-09-24
KR20040015043A (ko) 2004-02-18
CN1482958A (zh) 2004-03-17
JP2004524676A (ja) 2004-08-12
TW558481B (en) 2003-10-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee