DE60103963D1 - Abschirmungsverfahren mit Ferritschutzschicht - Google Patents

Abschirmungsverfahren mit Ferritschutzschicht

Info

Publication number
DE60103963D1
DE60103963D1 DE60103963T DE60103963T DE60103963D1 DE 60103963 D1 DE60103963 D1 DE 60103963D1 DE 60103963 T DE60103963 T DE 60103963T DE 60103963 T DE60103963 T DE 60103963T DE 60103963 D1 DE60103963 D1 DE 60103963D1
Authority
DE
Germany
Prior art keywords
protective
ferrite layer
shielding process
shielding
ferrite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60103963T
Other languages
English (en)
Other versions
DE60103963T2 (de
Inventor
Philip M Bator
Andrew R Macko
Jack H King Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Visteon Global Technologies Inc
Original Assignee
Visteon Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visteon Global Technologies Inc filed Critical Visteon Global Technologies Inc
Application granted granted Critical
Publication of DE60103963D1 publication Critical patent/DE60103963D1/de
Publication of DE60103963T2 publication Critical patent/DE60103963T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Hard Magnetic Materials (AREA)
DE60103963T 2000-10-11 2001-10-11 Abschirmungsverfahren mit Ferritschutzschicht Expired - Fee Related DE60103963T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US686189 2000-10-11
US09/686,189 US6534707B1 (en) 2000-10-11 2000-10-11 Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating

Publications (2)

Publication Number Publication Date
DE60103963D1 true DE60103963D1 (de) 2004-07-29
DE60103963T2 DE60103963T2 (de) 2005-07-14

Family

ID=24755288

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60103963T Expired - Fee Related DE60103963T2 (de) 2000-10-11 2001-10-11 Abschirmungsverfahren mit Ferritschutzschicht

Country Status (3)

Country Link
US (1) US6534707B1 (de)
EP (1) EP1198165B1 (de)
DE (1) DE60103963T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0104910D0 (en) * 2001-02-28 2001-04-18 Ibm Devices to reduce electro-magnetic field radiation
JP3916889B2 (ja) * 2001-06-08 2007-05-23 ソニー株式会社 半導体封止用樹脂組成物およびそれを用いた半導体装置
US7730823B1 (en) * 2005-01-15 2010-06-08 Cedar Ridge Research Llc Magnetic damping field armor system and method
JP2008544555A (ja) * 2005-06-24 2008-12-04 コナルカ テクノロジーズ インコーポレイテッド 電極の調製方法
EP1902476B1 (de) * 2005-07-12 2014-07-09 Merck Patent GmbH Verfahren zum übertragen von photovoltaischen zellen
WO2007011742A2 (en) * 2005-07-14 2007-01-25 Konarka Technologies, Inc. Cigs photovoltaic cells
DE102005046908A1 (de) * 2005-09-30 2007-04-05 Merck Patent Gmbh Elektrochemische Abscheidung von Selen in ionischen Flüssigkeiten
EP2180672B1 (de) 2008-10-23 2018-01-24 Volkswagen Aktiengesellschaft Mobilgerätsystem für ein Kraftfahrzeug
DE102009050529B4 (de) 2009-10-23 2020-06-04 Volkswagen Ag Mobilgerätsystem für ein Kraftfahrzeug
DE202009017289U1 (de) 2009-12-22 2010-03-25 Volkswagen Ag Bedienteil zur Bedienung eines Mobiltelefons in einem Kraftfahrzeug
US9121885B2 (en) * 2010-08-16 2015-09-01 Infineon Technologies Ag Sensor package and method of manufacturing thereof
EP2461657A1 (de) * 2010-12-02 2012-06-06 Siemens Aktiengesellschaft Elektrische Baugruppe und Verfahren zur Herstellung einer elektrischen Baugruppe
KR101934945B1 (ko) * 2013-10-15 2019-01-04 인텔 코포레이션 자기 차폐형 집적 회로 패키지
US10856455B1 (en) * 2019-09-05 2020-12-01 The Boeing Company Electromagnetic interference shielding panels and associated methods

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188605A (en) 1978-07-21 1980-02-12 Stout Glenn M Encapsulated Hall effect device
JPS6018145B2 (ja) 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
JPS59158016A (ja) 1983-02-28 1984-09-07 ティーディーケイ株式会社 電磁シ−ルド材料
US4698197A (en) * 1985-02-12 1987-10-06 The United States Of America As Represented By The United States Department Of Energy Magnetic shielding
US5547599A (en) 1989-03-17 1996-08-20 Raytheon Company Ferrite/epoxy film
JPH0645781A (ja) * 1992-07-22 1994-02-18 Uniden Corp 電磁波遮蔽構造体
JP2951487B2 (ja) * 1992-09-11 1999-09-20 ユニデン株式会社 電磁波遮蔽方法
US5371404A (en) 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
FI117224B (fi) * 1994-01-20 2006-07-31 Nec Tokin Corp Sähkömagneettinen häiriönpoistokappale, ja sitä soveltavat elektroninen laite ja hybridimikropiirielementti
US5677511A (en) 1995-03-20 1997-10-14 National Semiconductor Corporation Overmolded PC board with ESD protection and EMI suppression
US5785913A (en) * 1996-05-30 1998-07-28 Westinghouse Electric Corporation Method of magnetically forming a particle filled polymer having enhanced material characteristics
US5709960A (en) 1996-06-21 1998-01-20 Motorola, Inc. Mold compound
KR100500919B1 (ko) * 1997-02-10 2005-07-14 마츠시타 덴끼 산교 가부시키가이샤 수지봉입형 반도체장치 및 그 제조방법
US6190509B1 (en) * 1997-03-04 2001-02-20 Tessera, Inc. Methods of making anisotropic conductive elements for use in microelectronic packaging
GB2345803B (en) * 1997-08-19 2001-06-20 Taiyo Yuden Kk Wire wound electronic component

Also Published As

Publication number Publication date
EP1198165B1 (de) 2004-06-23
DE60103963T2 (de) 2005-07-14
EP1198165A3 (de) 2002-10-16
US6534707B1 (en) 2003-03-18
EP1198165A2 (de) 2002-04-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee