DE60040959D1 - Hochvakuumverpacktes Mikrogyroskop und Verfahren zu seiner Herstellung - Google Patents

Hochvakuumverpacktes Mikrogyroskop und Verfahren zu seiner Herstellung

Info

Publication number
DE60040959D1
DE60040959D1 DE60040959T DE60040959T DE60040959D1 DE 60040959 D1 DE60040959 D1 DE 60040959D1 DE 60040959 T DE60040959 T DE 60040959T DE 60040959 T DE60040959 T DE 60040959T DE 60040959 D1 DE60040959 D1 DE 60040959D1
Authority
DE
Germany
Prior art keywords
microgyroscope
preparation
high vacuum
vacuum packed
packed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60040959T
Other languages
English (en)
Inventor
Seok-Jin Kang
Youn-Il Ko
Ho-Suk Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE60040959D1 publication Critical patent/DE60040959D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Pressure Sensors (AREA)
  • Gyroscopes (AREA)
DE60040959T 1999-11-01 2000-10-25 Hochvakuumverpacktes Mikrogyroskop und Verfahren zu seiner Herstellung Expired - Fee Related DE60040959D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-1999-0047965A KR100413789B1 (ko) 1999-11-01 1999-11-01 고진공 패키징 마이크로자이로스코프 및 그 제조방법

Publications (1)

Publication Number Publication Date
DE60040959D1 true DE60040959D1 (de) 2009-01-15

Family

ID=19618019

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60040959T Expired - Fee Related DE60040959D1 (de) 1999-11-01 2000-10-25 Hochvakuumverpacktes Mikrogyroskop und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (2) US6559487B1 (de)
EP (1) EP1096259B1 (de)
JP (1) JP2001189467A (de)
KR (1) KR100413789B1 (de)
DE (1) DE60040959D1 (de)

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FR2848339B1 (fr) * 2002-12-05 2005-08-26 St Microelectronics Sa Procede d'adhesion de deux elements, en particulier d'un circuit integre, par exemple une encapsulation d'un resonateur, et circuit integre correspondant
FR2848336B1 (fr) 2002-12-09 2005-10-28 Commissariat Energie Atomique Procede de realisation d'une structure contrainte destinee a etre dissociee
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Also Published As

Publication number Publication date
US6559487B1 (en) 2003-05-06
US20030132493A1 (en) 2003-07-17
EP1096259A1 (de) 2001-05-02
KR20010044908A (ko) 2001-06-05
US6767757B2 (en) 2004-07-27
JP2001189467A (ja) 2001-07-10
EP1096259B1 (de) 2008-12-03
KR100413789B1 (ko) 2003-12-31

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