DE60033258D1 - Einrichtung zur Bestimmung eines Positionsfehlers - Google Patents

Einrichtung zur Bestimmung eines Positionsfehlers

Info

Publication number
DE60033258D1
DE60033258D1 DE60033258T DE60033258T DE60033258D1 DE 60033258 D1 DE60033258 D1 DE 60033258D1 DE 60033258 T DE60033258 T DE 60033258T DE 60033258 T DE60033258 T DE 60033258T DE 60033258 D1 DE60033258 D1 DE 60033258D1
Authority
DE
Germany
Prior art keywords
determining
position error
hole
alignment
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60033258T
Other languages
English (en)
Other versions
DE60033258T2 (de
Inventor
Damien Boureau
David Clavier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Automa Tech SA
Original Assignee
Automa Tech SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Automa Tech SA filed Critical Automa Tech SA
Publication of DE60033258D1 publication Critical patent/DE60033258D1/de
Application granted granted Critical
Publication of DE60033258T2 publication Critical patent/DE60033258T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Body Structure For Vehicles (AREA)
  • Numerical Control (AREA)
  • Automatic Control Of Machine Tools (AREA)
DE60033258T 1999-11-03 2000-10-16 Einrichtung zur Bestimmung eines Positionsfehlers Expired - Fee Related DE60033258T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9913725A FR2800565B1 (fr) 1999-11-03 1999-11-03 Dispositif de mesure d'erreur de position relative
FR9913725 1999-11-03

Publications (2)

Publication Number Publication Date
DE60033258D1 true DE60033258D1 (de) 2007-03-22
DE60033258T2 DE60033258T2 (de) 2007-11-22

Family

ID=9551646

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60033258T Expired - Fee Related DE60033258T2 (de) 1999-11-03 2000-10-16 Einrichtung zur Bestimmung eines Positionsfehlers

Country Status (11)

Country Link
US (1) US6683684B1 (de)
EP (1) EP1098556B1 (de)
JP (1) JP2001188007A (de)
KR (1) KR20010060196A (de)
CN (1) CN1220116C (de)
AT (1) ATE353538T1 (de)
CA (1) CA2324913A1 (de)
DE (1) DE60033258T2 (de)
ES (1) ES2281329T3 (de)
FR (1) FR2800565B1 (de)
TW (1) TW556456B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050035153A (ko) * 2001-10-10 2005-04-15 액센트 옵티칼 테크놀로지스 인코포레이티드 단면 분석법에 의한 초점 중심의 결정
JP4338577B2 (ja) * 2004-04-28 2009-10-07 株式会社ブイ・テクノロジー 露光装置
JP4391545B2 (ja) * 2007-03-30 2009-12-24 日立ビアメカニクス株式会社 ワーク加工機
CN101450788B (zh) * 2007-12-05 2011-04-13 中国科学院微电子研究所 石英晶圆深微孔加工设备及方法
CN102865815B (zh) * 2012-09-24 2015-01-07 上海功源电子科技有限公司 一种新型的单视觉相机对位pcb的定位补偿方法
CN104378916B (zh) * 2013-08-13 2018-04-03 达观科技有限公司 物件校正方法
CN104897070B (zh) * 2014-03-07 2018-04-17 达观科技有限公司 加工物件基础规格的检测方法
JP6483536B2 (ja) * 2015-06-05 2019-03-13 株式会社アドテックエンジニアリング パターン描画装置及びパターン描画方法
CN105043269B (zh) * 2015-07-08 2017-09-29 上海与德通讯技术有限公司 一种物体尺寸的测量方法及电子设备
CN106767556B (zh) * 2016-12-26 2023-06-06 重庆越发机械制造有限公司 高精度变档拨叉同心度检测设备
CN111095111A (zh) * 2017-09-11 2020-05-01 Asml荷兰有限公司 光刻装置和方法
CN109209546B (zh) * 2018-09-30 2019-12-27 东风汽车集团有限公司 连续可变气门升程机构的间隙调节装置及调节方法
CN112179286B (zh) * 2020-08-18 2021-12-21 江苏瑞尔隆盛叶轮科技有限公司 一种gom三维光学扫描仪专用夹具
CN111928873A (zh) * 2020-09-28 2020-11-13 快克智能装备股份有限公司 一种标定测高中心与相机中心的方法
CN112857220B (zh) * 2021-01-13 2022-08-09 德阳市产品质量监督检验所 一种发电设备零部件的检测结构
CN113207232A (zh) * 2021-04-30 2021-08-03 东莞市五株电子科技有限公司 一种三维pcb的制作方法及pcb

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE241562C (de) 1909-07-31 1911-12-05
DD241562A1 (de) * 1985-10-10 1986-12-17 Robotron Bueromasch Messtechnische anordnung zur ueberwachung des schneidvorganges beim lasertrennen
US5264869A (en) * 1991-08-19 1993-11-23 Xerox Corporation Electro-optical control apparatus and system for spot position control in an optical output device
FR2703558B1 (fr) * 1993-03-31 1995-06-30 Automa Tech Sa Installation d'exposition à la lumière d'une plaque de circuit imprimé double face à travers les clichés.
US5814826A (en) * 1996-08-26 1998-09-29 Demminer Maschinen Technik Gmbh Method and apparatus for aligning photoprinting plates in a production line

Also Published As

Publication number Publication date
CN1295268A (zh) 2001-05-16
TW556456B (en) 2003-10-01
EP1098556A1 (de) 2001-05-09
FR2800565A1 (fr) 2001-05-04
JP2001188007A (ja) 2001-07-10
FR2800565B1 (fr) 2002-10-25
US6683684B1 (en) 2004-01-27
ES2281329T3 (es) 2007-10-01
KR20010060196A (ko) 2001-07-06
CA2324913A1 (en) 2001-05-03
DE60033258T2 (de) 2007-11-22
ATE353538T1 (de) 2007-02-15
EP1098556B1 (de) 2007-02-07
CN1220116C (zh) 2005-09-21

Similar Documents

Publication Publication Date Title
ATE353538T1 (de) Einrichtung zur bestimmung eines positionsfehlers
ATE431543T1 (de) Lasernivelliervorrichtung mit gegenstandsdetektor
DE60133667D1 (de) Mit kommentareingabefunktion ausgestattete messvorrichtung
ATE324567T1 (de) Bandmass mit laser
ATE235709T1 (de) System zur verfolgung von kopfbewegungen
EP1098167A3 (de) Apparat zur Montagegenauigkeitsmessung einer Montagevorrichtung und Verfahren zur Montagegenauigkeitsmessung einer Montagevorrichtung
EP0962777A3 (de) Leiterplattentestvorrichtung
DE68912444T2 (de) Vorrichtung zum Ausrichten eines ophthalmologischen Instruments.
EP1014036A3 (de) Vorrichtung und Verfahren zur Objektuntersuchung
DE69619240D1 (de) Vorrichtung zur Befestigung an ein freies Ende eines Massbandes
EP1677158A3 (de) Verfahrung zur Messung von Substratinformationen und Substrat für Gebrauch in einem lithografischen Apparat
SE9700066D0 (sv) Method and arrangemant for determining the position of an object
ATE440266T1 (de) Positionsmesseinrichtung
NO20025623D0 (no) Fremgangsmåte og arrangement for inspeksjon
ATE82065T1 (de) Positionsmesseinrichtung mit referenzmarken.
DE59809848D1 (de) Positionsmesseinrichtung
CA2403883A1 (en) Eye measurement system
EP1403045A3 (de) Verfahren und Vorrichtung zur Bestimmung der Position und/oder Form von Marken auf einer bedruckten Papierbahn
ES2050745T3 (es) Dispositivo de medicion de la posicion angular.
DE69302180D1 (de) Positionierungsvorrichtung
ITVI930044A1 (it) Goniometro per la misura di angoli con almeno un emettitore di raggi laser
ATE287523T1 (de) Objektabbildung mit abstandskompensation ( grösse,farbe )
TW200520333A (en) Laser device and processing apparatus utilizing the same
JPS6473480A (en) Structure provided with recognition code of electronic parts and the like
JPS6281005U (de)

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee