TW200520333A - Laser device and processing apparatus utilizing the same - Google Patents

Laser device and processing apparatus utilizing the same

Info

Publication number
TW200520333A
TW200520333A TW093130356A TW93130356A TW200520333A TW 200520333 A TW200520333 A TW 200520333A TW 093130356 A TW093130356 A TW 093130356A TW 93130356 A TW93130356 A TW 93130356A TW 200520333 A TW200520333 A TW 200520333A
Authority
TW
Taiwan
Prior art keywords
laser light
aperture
laser device
same
processing apparatus
Prior art date
Application number
TW093130356A
Other languages
Chinese (zh)
Inventor
Yuuji Yada
Original Assignee
Ntn Toyo Bearing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ntn Toyo Bearing Co Ltd filed Critical Ntn Toyo Bearing Co Ltd
Publication of TW200520333A publication Critical patent/TW200520333A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08054—Passive cavity elements acting on the polarization, e.g. a polarizer for branching or walk-off compensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/08—Construction or shape of optical resonators or components thereof
    • H01S3/08018—Mode suppression
    • H01S3/0804—Transverse or lateral modes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123—Q-switching
    • H01S3/1127—Q-switching using pulse transmission mode [PTM]

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

A laser device easily obtaining a laser light with a single transverse mode. The laser device includes an aperture 7 and an adjustment mechanism 8. The aperture 7 includes a hole 7a for obtaining a laser light with a single transverse mode. The adjustment mechanism 8 moves the aperture 7 in a plane perpendicular to a proceeding direction of the laser light to adjust the position of the hole 7a with respect to the laser light 4. Thus, the aperture 7 may be adjusted to an optimal position based on environmental changes, such as temperature or mounting errors. As a result, optimal laser light with a single transverse mode may be obtained.
TW093130356A 2003-12-12 2004-10-07 Laser device and processing apparatus utilizing the same TW200520333A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003414295A JP2005175245A (en) 2003-12-12 2003-12-12 Laser beam system and laser beam machining system using the same

Publications (1)

Publication Number Publication Date
TW200520333A true TW200520333A (en) 2005-06-16

Family

ID=34734134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130356A TW200520333A (en) 2003-12-12 2004-10-07 Laser device and processing apparatus utilizing the same

Country Status (3)

Country Link
JP (1) JP2005175245A (en)
KR (1) KR20050059410A (en)
TW (1) TW200520333A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8461470B2 (en) 2007-11-20 2013-06-11 Mitsubishi Electric Corporation Method of measuring degradation condition of output mirror in laser oscillator and laser machining apparatus
US8908739B2 (en) 2011-12-23 2014-12-09 Alcon Lensx, Inc. Transverse adjustable laser beam restrictor

Also Published As

Publication number Publication date
JP2005175245A (en) 2005-06-30
KR20050059410A (en) 2005-06-20

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