DE60032283D1 - Festkörperbildaufnahmevorrichtung - Google Patents

Festkörperbildaufnahmevorrichtung

Info

Publication number
DE60032283D1
DE60032283D1 DE60032283T DE60032283T DE60032283D1 DE 60032283 D1 DE60032283 D1 DE 60032283D1 DE 60032283 T DE60032283 T DE 60032283T DE 60032283 T DE60032283 T DE 60032283T DE 60032283 D1 DE60032283 D1 DE 60032283D1
Authority
DE
Germany
Prior art keywords
imaging device
solid state
state imaging
solid
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60032283T
Other languages
English (en)
Other versions
DE60032283T2 (de
Inventor
Hiroyuki Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE60032283D1 publication Critical patent/DE60032283D1/de
Publication of DE60032283T2 publication Critical patent/DE60032283T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
    • H01L27/14818—Optical shielding
DE60032283T 1999-05-31 2000-05-26 Festkörperbildaufnahmevorrichtung Expired - Lifetime DE60032283T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15210299 1999-05-31
JP15210299A JP4284752B2 (ja) 1999-05-31 1999-05-31 固体撮像素子

Publications (2)

Publication Number Publication Date
DE60032283D1 true DE60032283D1 (de) 2007-01-25
DE60032283T2 DE60032283T2 (de) 2007-09-20

Family

ID=15533106

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60032283T Expired - Lifetime DE60032283T2 (de) 1999-05-31 2000-05-26 Festkörperbildaufnahmevorrichtung
DE60038584T Expired - Lifetime DE60038584T2 (de) 1999-05-31 2000-05-26 Festkörperbildaufnahmevorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60038584T Expired - Lifetime DE60038584T2 (de) 1999-05-31 2000-05-26 Festkörperbildaufnahmevorrichtung

Country Status (5)

Country Link
US (1) US6724022B1 (de)
EP (2) EP1717860B1 (de)
JP (1) JP4284752B2 (de)
KR (1) KR100712154B1 (de)
DE (2) DE60032283T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4892782B2 (ja) * 2001-02-15 2012-03-07 ソニー株式会社 固体撮像素子
WO2002104007A2 (en) * 2001-06-15 2002-12-27 Dalsa Corporation Image pick up device and camera provided therewith
US6670071B2 (en) * 2002-01-15 2003-12-30 Quallion Llc Electric storage battery construction and method of manufacture
JP4758061B2 (ja) * 2003-10-16 2011-08-24 パナソニック株式会社 固体撮像装置およびその製造方法
US7002231B2 (en) * 2004-02-02 2006-02-21 Micron Technology, Inc. Barrier regions for image sensors
US7902624B2 (en) * 2004-02-02 2011-03-08 Aptina Imaging Corporation Barrier regions for image sensors
US7920185B2 (en) * 2004-06-30 2011-04-05 Micron Technology, Inc. Shielding black reference pixels in image sensors
JP4313789B2 (ja) * 2005-07-29 2009-08-12 富士通マイクロエレクトロニクス株式会社 半導体撮像装置およびその製造方法
JP4555785B2 (ja) * 2006-02-10 2010-10-06 シャープ株式会社 固定パターン雑音除去装置、固体撮像装置、電子機器、及び固定パターン雑音除去プログラム
JP4311419B2 (ja) 2006-08-02 2009-08-12 ソニー株式会社 固体撮像装置
US8482639B2 (en) 2008-02-08 2013-07-09 Omnivision Technologies, Inc. Black reference pixel for backside illuminated image sensor
US8233066B2 (en) 2010-02-18 2012-07-31 Omnivision Technologies, Inc. Image sensor with improved black level calibration
US8338856B2 (en) 2010-08-10 2012-12-25 Omnivision Technologies, Inc. Backside illuminated image sensor with stressed film
US8760543B2 (en) 2011-09-26 2014-06-24 Truesense Imaging, Inc. Dark reference in CCD image sensors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6033345B2 (ja) * 1979-06-08 1985-08-02 日本電気株式会社 電荷転送撮像装置とその駆動方法
JP3032036B2 (ja) * 1991-04-19 2000-04-10 三菱化学株式会社 粉砕装置
JPH05175471A (ja) * 1991-12-26 1993-07-13 Toshiba Corp 固体撮像装置
JP3326940B2 (ja) * 1993-12-07 2002-09-24 ソニー株式会社 固体撮像素子およびその製造方法
JP2699841B2 (ja) * 1993-12-10 1998-01-19 日本電気株式会社 固体撮像装置
JP2751817B2 (ja) * 1994-02-16 1998-05-18 日本電気株式会社 固体撮像装置およびその製造方法
JPH0878654A (ja) * 1994-09-02 1996-03-22 Sony Corp 固体撮像素子
JPH09127402A (ja) * 1995-10-31 1997-05-16 Canon Inc 撮像装置

Also Published As

Publication number Publication date
DE60032283T2 (de) 2007-09-20
KR100712154B1 (ko) 2007-05-02
EP1717860A1 (de) 2006-11-02
KR20010014981A (ko) 2001-02-26
EP1058313A3 (de) 2004-06-02
EP1058313A2 (de) 2000-12-06
JP2000340784A (ja) 2000-12-08
DE60038584T2 (de) 2009-06-04
EP1717860B1 (de) 2008-04-09
JP4284752B2 (ja) 2009-06-24
EP1058313B1 (de) 2006-12-13
DE60038584D1 (de) 2008-05-21
US6724022B1 (en) 2004-04-20

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Legal Events

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8364 No opposition during term of opposition