DE60019352D1 - Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch - Google Patents
Chemisch-mechanisches Polieren mit einem bewegenden PoliertuchInfo
- Publication number
- DE60019352D1 DE60019352D1 DE60019352T DE60019352T DE60019352D1 DE 60019352 D1 DE60019352 D1 DE 60019352D1 DE 60019352 T DE60019352 T DE 60019352T DE 60019352 T DE60019352 T DE 60019352T DE 60019352 D1 DE60019352 D1 DE 60019352D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- chemical
- moving
- cloth
- mechanical polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title 2
- 239000004744 fabric Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US244456 | 1999-02-04 | ||
US09/244,456 US6244935B1 (en) | 1999-02-04 | 1999-02-04 | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
US09/303,812 US6241583B1 (en) | 1999-02-04 | 1999-04-30 | Chemical mechanical polishing with a plurality of polishing sheets |
US302570 | 1999-04-30 | ||
US09/302,570 US6475070B1 (en) | 1999-02-04 | 1999-04-30 | Chemical mechanical polishing with a moving polishing sheet |
US303812 | 1999-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60019352D1 true DE60019352D1 (de) | 2005-05-19 |
DE60019352T2 DE60019352T2 (de) | 2006-05-11 |
Family
ID=27399758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60019352T Expired - Lifetime DE60019352T2 (de) | 1999-02-04 | 2000-02-04 | Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1025955B1 (de) |
JP (1) | JP3825220B2 (de) |
KR (1) | KR100773190B1 (de) |
DE (1) | DE60019352T2 (de) |
TW (1) | TW438648B (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6589105B2 (en) | 1998-12-01 | 2003-07-08 | Nutool, Inc. | Pad tensioning method and system in a bi-directional linear polisher |
US6468139B1 (en) * | 1998-12-01 | 2002-10-22 | Nutool, Inc. | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
US6626736B2 (en) | 2000-06-30 | 2003-09-30 | Ebara Corporation | Polishing apparatus |
US20020072296A1 (en) * | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
EP1395392A1 (de) * | 2001-06-12 | 2004-03-10 | Nutool, Inc. | Verbesserte verfahren und vorrichtung zum bidirectionalen polieren von werkstücken |
KR100841623B1 (ko) * | 2002-03-21 | 2008-06-27 | 엘지디스플레이 주식회사 | 액정 패널의 연마장치 |
US6939203B2 (en) | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
JP4941735B2 (ja) * | 2007-03-30 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
KR102453254B1 (ko) * | 2017-07-10 | 2022-10-12 | 주식회사 케이씨텍 | 순환 구동 유닛 및 이를 포함하는 기판 연마 장치 |
CN108789062B (zh) * | 2018-06-14 | 2024-03-15 | 深圳市特瑞华腾新能源有限公司 | 一种基于多电机电控磨平板状物料装置及其控制方法 |
JP7541988B2 (ja) * | 2019-02-28 | 2024-08-29 | アプライド マテリアルズ インコーポレイテッド | バッキング層の濡れを調整することによる化学機械研磨パッド剛性の制御 |
CN109719599B (zh) * | 2019-03-13 | 2024-07-05 | 广东泰格威机器人科技有限公司 | 铝型材门窗框架打磨装置 |
CN112692724A (zh) * | 2019-10-23 | 2021-04-23 | 中国石油化工股份有限公司 | 一种磨头组件及使用该磨头组件的岩石薄片磨片装置 |
CN113579990B (zh) * | 2021-07-30 | 2022-07-26 | 上海积塔半导体有限公司 | 固定研磨粒抛光装置及抛光方法 |
CN117921537B (zh) * | 2024-01-26 | 2024-09-20 | 深圳西可实业有限公司 | 一种多工位双面研磨机 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0818272A1 (de) * | 1996-07-12 | 1998-01-14 | Applied Materials, Inc. | Halterung für ein Polierkissen auf einer Scheibe in einem chemisch-mechanischen Poliersystem |
JPH1034514A (ja) * | 1996-07-24 | 1998-02-10 | Sanshin:Kk | 表面研磨加工方法及びその装置 |
-
2000
- 2000-02-04 JP JP2000028260A patent/JP3825220B2/ja not_active Expired - Lifetime
- 2000-02-04 EP EP00300878A patent/EP1025955B1/de not_active Expired - Lifetime
- 2000-02-04 DE DE60019352T patent/DE60019352T2/de not_active Expired - Lifetime
- 2000-02-07 KR KR1020000005614A patent/KR100773190B1/ko active IP Right Grant
- 2000-04-06 TW TW089102032A patent/TW438648B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1025955A2 (de) | 2000-08-09 |
DE60019352T2 (de) | 2006-05-11 |
JP3825220B2 (ja) | 2006-09-27 |
EP1025955A3 (de) | 2003-05-02 |
EP1025955B1 (de) | 2005-04-13 |
KR100773190B1 (ko) | 2007-11-02 |
TW438648B (en) | 2001-06-07 |
JP2000317823A (ja) | 2000-11-21 |
KR20000057941A (ko) | 2000-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60013663D1 (de) | Schleifmaschine mit ununterbrochenem Abrichten | |
DE69904313D1 (de) | Chemisch-mechanisches polierverfahren mit mehreren polierkissen | |
DE60019352D1 (de) | Chemisch-mechanisches Polieren mit einem bewegenden Poliertuch | |
DE69727584D1 (de) | Mehrschichtige gewebe mit elastizität in der querrichtung | |
DE69914834D1 (de) | Polierkissen | |
DE69830121D1 (de) | Polierschlamm Spendevorrichtung | |
DE60009103D1 (de) | Markiertes schleifmittel | |
BR9707399A (pt) | Artigo para a limpeza de superfícies | |
NO20022128D0 (no) | Slipeskiver | |
DE69739038D1 (de) | Poliervorrichtung mit Verriegelungsfunktion | |
DE69700790D1 (de) | Kautschukartikel mit abriebfester Oberflächenbeschaffenheit | |
DE69820021D1 (de) | Poliermaschine | |
DE60013921D1 (de) | Polieraufschlämmung | |
SG86431A1 (en) | Sustained surface step scrubbing | |
DE19882425T1 (de) | Werkzeug zum chemisch-mechanischen Ebnen mit einer linear arbeitenden Polierrolle | |
DE60041671D1 (de) | Poliervorrichtung | |
DE69723731D1 (de) | Reinigungszusammensetzungen mit scheuermittel | |
DE69815952D1 (de) | Poliergerät | |
DE69816146D1 (de) | Poliervorrichtung | |
DE69610821D1 (de) | Chemisch-mechanisch polieren mit gebogenen traegern | |
HU0002634D0 (en) | Sustained surface scrubbing | |
DE69838161D1 (de) | Poliervorrichtung | |
DE69914958D1 (de) | Reifen mit verzahnung in der wulstoberfläche | |
DE69814093T2 (de) | Werkzeugmaschine mit Schwenktischen | |
DE50003411D1 (de) | Wischmop mit Stiel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |