DE60016367D1 - Modulverbinder - Google Patents
ModulverbinderInfo
- Publication number
- DE60016367D1 DE60016367D1 DE60016367T DE60016367T DE60016367D1 DE 60016367 D1 DE60016367 D1 DE 60016367D1 DE 60016367 T DE60016367 T DE 60016367T DE 60016367 T DE60016367 T DE 60016367T DE 60016367 D1 DE60016367 D1 DE 60016367D1
- Authority
- DE
- Germany
- Prior art keywords
- module connector
- connector
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1429—Housings for circuits carrying a CPU and adapted to receive expansion cards
- H05K7/1431—Retention mechanisms for CPU modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP37570499 | 1999-12-28 | ||
JP37570499A JP2001185307A (ja) | 1999-12-28 | 1999-12-28 | モジュール用コネクタ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60016367D1 true DE60016367D1 (de) | 2005-01-05 |
DE60016367T2 DE60016367T2 (de) | 2005-05-04 |
Family
ID=18505927
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60016367T Expired - Fee Related DE60016367T2 (de) | 1999-12-28 | 2000-08-29 | Modulverbinder |
Country Status (7)
Country | Link |
---|---|
US (1) | US6278610B1 (de) |
EP (1) | EP1113529B1 (de) |
JP (1) | JP2001185307A (de) |
KR (1) | KR20010067243A (de) |
CN (1) | CN1258835C (de) |
DE (1) | DE60016367T2 (de) |
TW (1) | TW463425B (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299460B1 (en) * | 2000-04-14 | 2001-10-09 | Hewlett Packard Company | Spring-loaded backing plate assembly for use with land grid array-type devices |
DE102004009055B4 (de) * | 2004-02-23 | 2006-01-26 | Infineon Technologies Ag | Kühlanordnung für Geräte mit Leistungshalbleitern und Verfahren zum Kühlen derartiger Geräte |
KR100626035B1 (ko) * | 2004-11-16 | 2006-09-20 | 삼성에스디아이 주식회사 | 신호 전달 케이블 접속용 커넥터 및, 그것을 구비한플라즈마 디스플레이 장치용 |
US7372702B2 (en) * | 2004-12-23 | 2008-05-13 | Intel Corporation | Heat spreader |
US7524206B2 (en) * | 2005-03-23 | 2009-04-28 | Pulse Engineering, Inc. | Power-enabled connector assembly with heat dissipation apparatus and method of manufacturing |
DE102006029782A1 (de) * | 2006-02-17 | 2007-08-23 | Peiker, Andreas | Haltevorrichtung für ein elektronisches Gerät |
DE102006012446B3 (de) * | 2006-03-17 | 2007-12-20 | Infineon Technologies Ag | Speichermodul mit einem Mittel zur Kühlung, Verfahren zur Herstellung des Speichermoduls mit einem Mittel zur Kühlung sowie Datenverarbeitungsgerät umfassend ein Speichermodul mit einem Mittel zur Kühlung |
US7474529B2 (en) * | 2006-11-29 | 2009-01-06 | International Business Machines Corporation | Folded-sheet-metal heatsinks for closely packaged heat-producing devices |
US7804696B2 (en) | 2006-12-07 | 2010-09-28 | Finisar Corporation | Electromagnetic radiation containment in an electronic module |
DE202007006626U1 (de) * | 2007-05-09 | 2007-10-04 | Hamburg Industries Co., Ltd., Shen Keng | Verbindungseinrichtung |
JP4703619B2 (ja) * | 2007-09-10 | 2011-06-15 | 株式会社東芝 | 電子機器 |
DE102007056952B4 (de) * | 2007-11-27 | 2011-04-28 | Qimonda Ag | Vorrichtung und Verfahren zur Montage eines Kühlkörpers |
US20090290301A1 (en) * | 2008-05-23 | 2009-11-26 | Anton Legen | Heat sink for an electronic device |
JP5436879B2 (ja) * | 2009-02-12 | 2014-03-05 | 日立コンシューマエレクトロニクス株式会社 | 放射線検出器 |
US8270169B2 (en) * | 2009-03-24 | 2012-09-18 | Raytheon Company | Translating hinge |
TWI507116B (zh) * | 2009-11-30 | 2015-11-01 | 散熱件及具有該散熱件之可攜帶式電子裝置 | |
US8382509B2 (en) * | 2010-08-06 | 2013-02-26 | Fci Americas Technology Llc | Electrical connector assembly including compliant heat sink |
KR101796448B1 (ko) * | 2010-12-03 | 2017-11-10 | 삼성전자주식회사 | 기판 냉각플레이트 분리장치 및 기판 냉각플레이트 분리방법 |
JP5657363B2 (ja) * | 2010-12-07 | 2015-01-21 | モレックス インコーポレイテドMolex Incorporated | カード用コネクタ |
TWI441590B (zh) * | 2011-12-15 | 2014-06-11 | Inventec Corp | 電子模組 |
CN103176566A (zh) * | 2011-12-22 | 2013-06-26 | 英业达股份有限公司 | 电子模块 |
WO2013186587A1 (en) * | 2012-06-12 | 2013-12-19 | Fci | Connector assembly |
US8911244B2 (en) * | 2012-12-13 | 2014-12-16 | International Business Machines Corporation | Receptacle with heat management for electronic and optical systems |
US9786578B2 (en) * | 2014-01-27 | 2017-10-10 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Orthogonally hinged individualized memory module cooling |
US9509102B2 (en) * | 2015-01-16 | 2016-11-29 | Tyco Electronics Corporation | Pluggable module for a communication system |
WO2016164417A1 (en) * | 2015-04-10 | 2016-10-13 | Phoenix Contact Development and Manufacturing, Inc. | Enclosure with multiple heat dissipating surfaces |
WO2017131638A1 (en) * | 2016-01-26 | 2017-08-03 | Hewlett Packard Enterprise Development Lp | Semiconductor assembly |
US9893474B1 (en) * | 2016-10-12 | 2018-02-13 | International Business Machines Corporation | Active cable heat sink |
CN108695628A (zh) * | 2017-04-11 | 2018-10-23 | 技嘉科技股份有限公司 | 连接器模块 |
TWI624212B (zh) * | 2017-04-11 | 2018-05-11 | 技嘉科技股份有限公司 | 連接器模組 |
CN108738289A (zh) * | 2017-04-20 | 2018-11-02 | 仁宝电脑工业股份有限公司 | 防射频干扰的电子组件 |
TWI669050B (zh) * | 2017-04-20 | 2019-08-11 | 仁寶電腦工業股份有限公司 | 防射頻干擾的電子組件 |
CN107666043B (zh) * | 2017-08-04 | 2021-05-25 | 富士康(昆山)电脑接插件有限公司 | 卡缘连接器及其组件 |
JP2021114430A (ja) * | 2020-01-21 | 2021-08-05 | 日本航空電子工業株式会社 | コネクタ |
TWM598580U (zh) * | 2020-03-12 | 2020-07-11 | 連展科技股份有限公司 | 屏蔽罩 |
US11503734B2 (en) * | 2021-02-25 | 2022-11-15 | Dell Products L.P. | Assembly for card expansion on printer circuit board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2469019A1 (fr) * | 1979-10-26 | 1981-05-08 | Socapex | Support pour carte enfichable a raccordement electrique et thermique |
US5161087A (en) * | 1990-10-15 | 1992-11-03 | International Business Machines Corporation | Pivotal heat sink assembly |
US5764482A (en) * | 1996-07-24 | 1998-06-09 | Thermacore, Inc. | Integrated circuit heat seat |
JP3273242B2 (ja) * | 1997-10-08 | 2002-04-08 | 日本航空電子工業株式会社 | カードコネクタ |
US6088228A (en) * | 1998-12-16 | 2000-07-11 | 3M Innovative Properties Company | Protective enclosure for a multi-chip module |
US6188576B1 (en) * | 1999-05-13 | 2001-02-13 | Intel Corporation | Protective cover and packaging for multi-chip memory modules |
-
1999
- 1999-12-28 JP JP37570499A patent/JP2001185307A/ja not_active Withdrawn
-
2000
- 2000-08-23 US US09/643,962 patent/US6278610B1/en not_active Expired - Fee Related
- 2000-08-29 EP EP00118664A patent/EP1113529B1/de not_active Expired - Lifetime
- 2000-08-29 DE DE60016367T patent/DE60016367T2/de not_active Expired - Fee Related
- 2000-09-28 KR KR1020000056884A patent/KR20010067243A/ko not_active Application Discontinuation
- 2000-10-11 TW TW089121248A patent/TW463425B/zh active
- 2000-11-15 CN CNB001309684A patent/CN1258835C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1113529A2 (de) | 2001-07-04 |
TW463425B (en) | 2001-11-11 |
KR20010067243A (ko) | 2001-07-12 |
JP2001185307A (ja) | 2001-07-06 |
EP1113529B1 (de) | 2004-12-01 |
DE60016367T2 (de) | 2005-05-04 |
US6278610B1 (en) | 2001-08-21 |
CN1258835C (zh) | 2006-06-07 |
EP1113529A3 (de) | 2003-01-08 |
CN1302096A (zh) | 2001-07-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |