DE60009261D1 - Mehrschichtige gedämpfte phasenschiebermaske - Google Patents
Mehrschichtige gedämpfte phasenschiebermaskeInfo
- Publication number
- DE60009261D1 DE60009261D1 DE60009261T DE60009261T DE60009261D1 DE 60009261 D1 DE60009261 D1 DE 60009261D1 DE 60009261 T DE60009261 T DE 60009261T DE 60009261 T DE60009261 T DE 60009261T DE 60009261 D1 DE60009261 D1 DE 60009261D1
- Authority
- DE
- Germany
- Prior art keywords
- phase shift
- masks
- multilayer
- shift mask
- attenuating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000010363 phase shift Effects 0.000 title abstract 5
- 150000004767 nitrides Chemical class 0.000 abstract 2
- 239000011358 absorbing material Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000012780 transparent material Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11590699P | 1999-01-14 | 1999-01-14 | |
US115906P | 1999-01-14 | ||
PCT/US2000/000871 WO2000042473A1 (en) | 1999-01-14 | 2000-01-13 | Multilayer attenuating phase-shift masks |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60009261D1 true DE60009261D1 (de) | 2004-04-29 |
DE60009261T2 DE60009261T2 (de) | 2005-03-03 |
Family
ID=22364059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60009261T Expired - Fee Related DE60009261T2 (de) | 1999-01-14 | 2000-01-13 | Mehrschichtige gedämpfte phasenschiebermaske |
Country Status (9)
Country | Link |
---|---|
US (1) | US6274280B1 (de) |
EP (1) | EP1141775B1 (de) |
JP (1) | JP2002535702A (de) |
KR (1) | KR20010112241A (de) |
CN (1) | CN1337012A (de) |
AT (1) | ATE262690T1 (de) |
DE (1) | DE60009261T2 (de) |
TW (1) | TW449675B (de) |
WO (1) | WO2000042473A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6835505B2 (en) * | 1998-10-08 | 2004-12-28 | Rochester Institute Of Technology | Mask for projection photolithography at or below about 160 nm and a method thereof |
JP2002296758A (ja) * | 2001-03-30 | 2002-10-09 | Hoya Corp | ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク |
JP2002296757A (ja) * | 2001-03-30 | 2002-10-09 | Hoya Corp | ハーフトーン型位相シフトマスク及びマスクブランク |
US7060394B2 (en) * | 2001-03-30 | 2006-06-13 | Hoya Corporation | Halftone phase-shift mask blank and halftone phase-shift mask |
JP4737483B2 (ja) * | 2001-03-30 | 2011-08-03 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスク |
US20020197509A1 (en) * | 2001-04-19 | 2002-12-26 | Carcia Peter Francis | Ion-beam deposition process for manufacturing multi-layered attenuated phase shift photomask blanks |
AU2002252701A1 (en) * | 2001-04-19 | 2002-11-05 | Peter Francis Carcia | Ion-beam deposition process for manufacturing binary photomask blanks |
US6756160B2 (en) | 2001-04-19 | 2004-06-29 | E.I. Du Pont De Nemours. And Company | Ion-beam deposition process for manufacturing attenuated phase shift photomask blanks |
DE10150874A1 (de) * | 2001-10-04 | 2003-04-30 | Zeiss Carl | Optisches Element und Verfahren zu dessen Herstellung sowie ein Lithographiegerät und ein Verfahren zur Herstellung eines Halbleiterbauelements |
US6872496B2 (en) * | 2002-10-31 | 2005-03-29 | Taiwan Semiconductor Manufacturing Company | AlSixOy as a new bi-layer high transmittance attenuating phase shifting mask material for 193 nanometer lithography |
US7026076B2 (en) | 2003-03-03 | 2006-04-11 | Freescale Semiconductor, Inc. | Method of patterning photoresist on a wafer using a reflective mask with a multi-layer ARC |
US6875546B2 (en) | 2003-03-03 | 2005-04-05 | Freescale Semiconductor, Inc. | Method of patterning photoresist on a wafer using an attenuated phase shift mask |
US20050048375A1 (en) * | 2003-08-27 | 2005-03-03 | Cheng-Ming Lin | Method of making an attenuated phase-shifting mask from a mask blank |
TW200513812A (en) * | 2003-09-05 | 2005-04-16 | Schott Ag | Attenuating phase shift mask blank and photomask |
US7029803B2 (en) * | 2003-09-05 | 2006-04-18 | Schott Ag | Attenuating phase shift mask blank and photomask |
US20050260504A1 (en) * | 2004-04-08 | 2005-11-24 | Hans Becker | Mask blank having a protection layer |
KR101316633B1 (ko) * | 2004-07-28 | 2013-10-15 | 삼성디스플레이 주식회사 | 다결정 규소용 마스크 및 이의 제조방법과, 이를 이용한박막트랜지스터의 제조방법 |
JP5483366B2 (ja) * | 2011-03-11 | 2014-05-07 | Hoya株式会社 | ハーフトーン型位相シフトマスクブランク及びハーフトーン型位相シフトマスクの製造方法 |
JP6005530B2 (ja) * | 2013-01-15 | 2016-10-12 | Hoya株式会社 | マスクブランク、位相シフトマスクおよびこれらの製造方法 |
JP2018063441A (ja) * | 2013-11-06 | 2018-04-19 | 信越化学工業株式会社 | ハーフトーン位相シフト型フォトマスクブランク、ハーフトーン位相シフト型フォトマスク及びパターン露光方法 |
JP6104852B2 (ja) * | 2014-07-14 | 2017-03-29 | Hoya株式会社 | マスクブランクの製造方法、位相シフトマスクの製造方法および半導体デバイスの製造方法 |
US10942440B2 (en) | 2016-08-26 | 2021-03-09 | Hoya Corporation | Mask blank, phase shift mask, method of manufacturing phase shift mask, and method of manufacturing semiconductor device |
WO2018056033A1 (ja) * | 2016-09-26 | 2018-03-29 | Hoya株式会社 | マスクブランク、位相シフトマスク、位相シフトマスクの製造方法及び半導体デバイスの製造方法 |
JP6437602B2 (ja) * | 2017-07-28 | 2018-12-12 | Hoya株式会社 | マスクブランク、転写用マスクの製造方法、および半導体デバイスの製造方法 |
JP6490786B2 (ja) * | 2017-12-25 | 2019-03-27 | Hoya株式会社 | マスクブランク、位相シフトマスクおよび半導体デバイスの製造方法 |
JP6547019B1 (ja) | 2018-02-22 | 2019-07-17 | Hoya株式会社 | マスクブランク、位相シフトマスク及び半導体デバイスの製造方法 |
SG11202009172VA (en) | 2018-03-26 | 2020-10-29 | Hoya Corp | Mask blank, phase shift mask, and method for manufacturing semiconductor device |
KR102473558B1 (ko) * | 2019-10-23 | 2022-12-05 | 주식회사 에스앤에스텍 | 극자외선 리소그래피용 하프톤 위상반전 블랭크 마스크 및 포토마스크 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5897976A (en) * | 1996-05-20 | 1999-04-27 | E. I. Du Pont De Nemours And Company | Attenuating embedded phase shift photomask blanks |
US5897977A (en) | 1996-05-20 | 1999-04-27 | E. I. Du Pont De Nemours And Company | Attenuating embedded phase shift photomask blanks |
-
1999
- 1999-12-13 US US09/459,777 patent/US6274280B1/en not_active Expired - Fee Related
-
2000
- 2000-01-13 EP EP00906909A patent/EP1141775B1/de not_active Expired - Lifetime
- 2000-01-13 KR KR1020017008886A patent/KR20010112241A/ko not_active Application Discontinuation
- 2000-01-13 JP JP2000593989A patent/JP2002535702A/ja active Pending
- 2000-01-13 DE DE60009261T patent/DE60009261T2/de not_active Expired - Fee Related
- 2000-01-13 AT AT00906909T patent/ATE262690T1/de not_active IP Right Cessation
- 2000-01-13 WO PCT/US2000/000871 patent/WO2000042473A1/en not_active Application Discontinuation
- 2000-01-13 CN CN00802673A patent/CN1337012A/zh active Pending
- 2000-01-14 TW TW089100535A patent/TW449675B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1337012A (zh) | 2002-02-20 |
DE60009261T2 (de) | 2005-03-03 |
WO2000042473A1 (en) | 2000-07-20 |
US6274280B1 (en) | 2001-08-14 |
KR20010112241A (ko) | 2001-12-20 |
ATE262690T1 (de) | 2004-04-15 |
EP1141775A1 (de) | 2001-10-10 |
EP1141775B1 (de) | 2004-03-24 |
JP2002535702A (ja) | 2002-10-22 |
TW449675B (en) | 2001-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |