DE60005837D1 - Herstellungsverfahren einer gedruckten schaltung - Google Patents
Herstellungsverfahren einer gedruckten schaltungInfo
- Publication number
- DE60005837D1 DE60005837D1 DE60005837T DE60005837T DE60005837D1 DE 60005837 D1 DE60005837 D1 DE 60005837D1 DE 60005837 T DE60005837 T DE 60005837T DE 60005837 T DE60005837 T DE 60005837T DE 60005837 D1 DE60005837 D1 DE 60005837D1
- Authority
- DE
- Germany
- Prior art keywords
- link
- closed loop
- data
- measurement
- server
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000005259 measurement Methods 0.000 abstract 3
- 230000002596 correlated effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31186—TCP-IP internet protocol
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/33—Director till display
- G05B2219/33148—CLS client server architecture, client consumes, server provides services
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49302—Part, workpiece, code, tool identification
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Operations Research (AREA)
- General Engineering & Computer Science (AREA)
- General Factory Administration (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Molding Of Porous Articles (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Circuits Of Receivers In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE990589 | 1999-07-13 | ||
IE990589 | 1999-07-13 | ||
PCT/IE2000/000089 WO2001004711A1 (en) | 1999-07-13 | 2000-07-13 | A circuit production method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60005837D1 true DE60005837D1 (de) | 2003-11-13 |
DE60005837T2 DE60005837T2 (de) | 2004-08-19 |
Family
ID=11042103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60005837T Expired - Fee Related DE60005837T2 (de) | 1999-07-13 | 2000-07-13 | Herstellungsverfahren einer gedruckten schaltung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6580961B2 (de) |
EP (1) | EP1196830B1 (de) |
JP (1) | JP2003504746A (de) |
AT (1) | ATE251771T1 (de) |
AU (1) | AU5703100A (de) |
DE (1) | DE60005837T2 (de) |
IE (2) | IE20000566A1 (de) |
WO (1) | WO2001004711A1 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6999164B2 (en) * | 2001-04-26 | 2006-02-14 | Tokyo Electron Limited | Measurement system cluster |
US7089075B2 (en) * | 2001-05-04 | 2006-08-08 | Tokyo Electron Limited | Systems and methods for metrology recipe and model generation |
GB0124130D0 (en) * | 2001-10-08 | 2001-11-28 | Millennium Venture Holdings Lt | Improvements relating to staged production in volume manufacture |
US7555831B2 (en) * | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
US7813559B2 (en) | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
US6934596B2 (en) * | 2002-03-18 | 2005-08-23 | Seiko Epson Corporation | Manufacturing system, measurement data collecting system, and measurement terminal apparatus |
US7496921B2 (en) * | 2003-08-29 | 2009-02-24 | Intel Corporation | Processing block with integrated light weight multi-threading support |
US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US7706595B2 (en) * | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
US7415317B2 (en) * | 2004-02-25 | 2008-08-19 | Micron Technology, Inc. | Method and system for correlating and combining production and non-production data for analysis |
US7395130B2 (en) | 2004-02-27 | 2008-07-01 | Micron Technology, Inc. | Method and system for aggregating and combining manufacturing data for analysis |
JP3882840B2 (ja) * | 2004-03-01 | 2007-02-21 | オムロン株式会社 | はんだ印刷検査方法、およびこの方法を用いたはんだ印刷検査機ならびにはんだ印刷検査システム |
CN1716306B (zh) * | 2004-07-02 | 2010-05-05 | 鸿富锦精密工业(深圳)有限公司 | 工治具管控系统及方法 |
KR100639676B1 (ko) * | 2004-09-21 | 2006-10-30 | 삼성전자주식회사 | 반도체 제조용 포토리소그라피 설비 제어시스템 및 그제어방법 |
US20060075631A1 (en) * | 2004-10-05 | 2006-04-13 | Case Steven K | Pick and place machine with improved component pick up inspection |
US20070003126A1 (en) * | 2005-05-19 | 2007-01-04 | Case Steven K | Method and apparatus for evaluating a component pick action in an electronics assembly machine |
WO2007033349A1 (en) * | 2005-09-14 | 2007-03-22 | Cyberoptics Corporation | Pick and place machine with improved component pick image processing |
JP2009514234A (ja) * | 2005-10-31 | 2009-04-02 | サイバーオプティクス コーポレーション | 組み込み型半田ペースト検査を備える電子アセンブリマシン |
US20070276867A1 (en) * | 2006-05-23 | 2007-11-29 | David Fishbaine | Embedded inspection image archival for electronics assembly machines |
GB0614596D0 (en) * | 2006-07-24 | 2006-08-30 | Rolls Royce Plc | Control Of A Machining Operation |
GB201113331D0 (en) * | 2011-08-03 | 2011-09-14 | Rolls Royce Plc | Control of a machining operation |
CN104298190A (zh) * | 2013-07-09 | 2015-01-21 | Abb技术股份公司 | 用于现场仪器的维护系统 |
JP6404359B2 (ja) * | 2014-10-03 | 2018-10-10 | 株式会社Fuji | 部品装着システムおよび部品装着装置の異常停止診断方法 |
WO2016203638A1 (ja) * | 2015-06-19 | 2016-12-22 | ヤマハ発動機株式会社 | 部品実装装置および部品実装方法 |
US10795406B2 (en) | 2016-07-28 | 2020-10-06 | Fuji Corporation | Work device and time-measuring method of work device |
US10842026B2 (en) | 2018-02-12 | 2020-11-17 | Xerox Corporation | System for forming electrical circuits on non-planar objects |
US10624251B2 (en) | 2018-08-24 | 2020-04-14 | Rockwell Automation Technologies, Inc. | Nozzle performance analytics |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1985004521A1 (en) * | 1984-03-22 | 1985-10-10 | Mostek Corporation | Integrated circuit add-on components |
KR910002998B1 (ko) * | 1987-02-09 | 1991-05-11 | 산요덴끼 가부시끼가이샤 | 접착제 도포장치 |
JP2769358B2 (ja) * | 1989-06-22 | 1998-06-25 | 株式会社日立製作所 | プリント基板組立システム |
KR920702046A (ko) * | 1989-10-13 | 1992-08-12 | 원본미기재 | 테이프 자동 본딩 |
JPH04291795A (ja) * | 1991-03-20 | 1992-10-15 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
US5564183A (en) * | 1992-09-30 | 1996-10-15 | Matsushita Electric Industrial Co., Ltd. | Producing system of printed circuit board and method therefor |
JPH07193397A (ja) * | 1993-12-27 | 1995-07-28 | Yamaha Motor Co Ltd | 実装機の吸着ポイント補正装置 |
US5586059A (en) * | 1995-06-07 | 1996-12-17 | Advanced Micro Devices, Inc. | Automated data management system for analysis and control of photolithography stepper performance |
TW364956B (en) * | 1996-10-21 | 1999-07-21 | Nxp Bv | Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products |
US5859964A (en) * | 1996-10-25 | 1999-01-12 | Advanced Micro Devices, Inc. | System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes |
JP2867982B2 (ja) * | 1996-11-29 | 1999-03-10 | 日本電気株式会社 | 半導体装置の製造装置 |
US6445969B1 (en) * | 1997-01-27 | 2002-09-03 | Circuit Image Systems | Statistical process control integration systems and methods for monitoring manufacturing processes |
US6007631A (en) * | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
-
2000
- 2000-07-13 WO PCT/IE2000/000089 patent/WO2001004711A1/en active IP Right Grant
- 2000-07-13 AT AT00942342T patent/ATE251771T1/de not_active IP Right Cessation
- 2000-07-13 IE IE20000566A patent/IE20000566A1/en not_active IP Right Cessation
- 2000-07-13 EP EP00942342A patent/EP1196830B1/de not_active Expired - Lifetime
- 2000-07-13 IE IE20000567A patent/IES20000567A2/en unknown
- 2000-07-13 JP JP2001510056A patent/JP2003504746A/ja active Pending
- 2000-07-13 DE DE60005837T patent/DE60005837T2/de not_active Expired - Fee Related
- 2000-07-13 AU AU57031/00A patent/AU5703100A/en not_active Abandoned
-
2002
- 2002-01-09 US US10/040,477 patent/US6580961B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60005837T2 (de) | 2004-08-19 |
IES20000567A2 (en) | 2001-02-21 |
US20020099466A1 (en) | 2002-07-25 |
EP1196830B1 (de) | 2003-10-08 |
JP2003504746A (ja) | 2003-02-04 |
AU5703100A (en) | 2001-01-30 |
WO2001004711A1 (en) | 2001-01-18 |
EP1196830A1 (de) | 2002-04-17 |
IE20000566A1 (en) | 2001-02-21 |
US6580961B2 (en) | 2003-06-17 |
ATE251771T1 (de) | 2003-10-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |