ATE251771T1 - Herstellungsverfahren einer gedruckten schaltung - Google Patents

Herstellungsverfahren einer gedruckten schaltung

Info

Publication number
ATE251771T1
ATE251771T1 AT00942342T AT00942342T ATE251771T1 AT E251771 T1 ATE251771 T1 AT E251771T1 AT 00942342 T AT00942342 T AT 00942342T AT 00942342 T AT00942342 T AT 00942342T AT E251771 T1 ATE251771 T1 AT E251771T1
Authority
AT
Austria
Prior art keywords
link
closed loop
data
measurement
server
Prior art date
Application number
AT00942342T
Other languages
English (en)
Inventor
William Diggin
Kevin Keane
James Mahon
Joseph O'keeffe
John Milroy
Original Assignee
Mv Res Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mv Res Ltd filed Critical Mv Res Ltd
Application granted granted Critical
Publication of ATE251771T1 publication Critical patent/ATE251771T1/de

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31186—TCP-IP internet protocol
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/33—Director till display
    • G05B2219/33148—CLS client server architecture, client consumes, server provides services
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49302—Part, workpiece, code, tool identification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • General Factory Administration (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • Circuits Of Receivers In General (AREA)
  • Molding Of Porous Articles (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT00942342T 1999-07-13 2000-07-13 Herstellungsverfahren einer gedruckten schaltung ATE251771T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE990589 1999-07-13
PCT/IE2000/000089 WO2001004711A1 (en) 1999-07-13 2000-07-13 A circuit production method

Publications (1)

Publication Number Publication Date
ATE251771T1 true ATE251771T1 (de) 2003-10-15

Family

ID=11042103

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00942342T ATE251771T1 (de) 1999-07-13 2000-07-13 Herstellungsverfahren einer gedruckten schaltung

Country Status (8)

Country Link
US (1) US6580961B2 (de)
EP (1) EP1196830B1 (de)
JP (1) JP2003504746A (de)
AT (1) ATE251771T1 (de)
AU (1) AU5703100A (de)
DE (1) DE60005837T2 (de)
IE (2) IES20000567A2 (de)
WO (1) WO2001004711A1 (de)

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US6999164B2 (en) * 2001-04-26 2006-02-14 Tokyo Electron Limited Measurement system cluster
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
GB0124130D0 (en) * 2001-10-08 2001-11-28 Millennium Venture Holdings Lt Improvements relating to staged production in volume manufacture
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US6934596B2 (en) * 2002-03-18 2005-08-23 Seiko Epson Corporation Manufacturing system, measurement data collecting system, and measurement terminal apparatus
US7496921B2 (en) * 2003-08-29 2009-02-24 Intel Corporation Processing block with integrated light weight multi-threading support
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US7415317B2 (en) * 2004-02-25 2008-08-19 Micron Technology, Inc. Method and system for correlating and combining production and non-production data for analysis
US7395130B2 (en) 2004-02-27 2008-07-01 Micron Technology, Inc. Method and system for aggregating and combining manufacturing data for analysis
US20050209822A1 (en) * 2004-03-01 2005-09-22 Masato Ishiba Inspection method and system and production method of mounted substrate
CN1716306B (zh) * 2004-07-02 2010-05-05 鸿富锦精密工业（深圳）有限公司 工治具管控系统及方法
KR100639676B1 (ko) * 2004-09-21 2006-10-30 삼성전자주식회사 반도체 제조용 포토리소그라피 설비 제어시스템 및 그제어방법
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
DE112006003019T5 (de) * 2005-10-31 2008-10-23 Cyberoptics Corp., Golden Valley Elektronikmontagevorrichtung mit eingebauter Lötpastenprüfung
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
GB0614596D0 (en) * 2006-07-24 2006-08-30 Rolls Royce Plc Control Of A Machining Operation
GB201113331D0 (en) * 2011-08-03 2011-09-14 Rolls Royce Plc Control of a machining operation
CN104298190A (zh) * 2013-07-09 2015-01-21 Abb技术股份公司 用于现场仪器的维护系统
WO2016051602A1 (ja) * 2014-10-03 2016-04-07 富士機械製造株式会社 部品装着システムおよび部品装着装置の異常停止診断方法
KR102018070B1 (ko) * 2015-06-19 2019-09-04 야마하하쓰도키 가부시키가이샤 부품 실장 장치 및 부품 실장 방법
EP3493018B1 (de) * 2016-07-28 2021-05-05 Fuji Corporation Arbeitsvorrichtung und zeitmessverfahren für die arbeitsvorrichtung
US10842026B2 (en) 2018-02-12 2020-11-17 Xerox Corporation System for forming electrical circuits on non-planar objects
US10624251B2 (en) * 2018-08-24 2020-04-14 Rockwell Automation Technologies, Inc. Nozzle performance analytics

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EP0177560A1 (de) * 1984-03-22 1986-04-16 Mostek Corporation Zusätzliche bauelemente für integrierte schaltung
KR910002998B1 (ko) * 1987-02-09 1991-05-11 산요덴끼 가부시끼가이샤 접착제 도포장치
JP2769358B2 (ja) * 1989-06-22 1998-06-25 株式会社日立製作所 プリント基板組立システム
DE69021549T2 (de) * 1989-10-13 1996-04-18 Foxboro Co Anwendungsorientiertes automatisiertes bandbonding.
JPH04291795A (ja) * 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd 電子部品装着装置
US5564183A (en) * 1992-09-30 1996-10-15 Matsushita Electric Industrial Co., Ltd. Producing system of printed circuit board and method therefor
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
US5586059A (en) * 1995-06-07 1996-12-17 Advanced Micro Devices, Inc. Automated data management system for analysis and control of photolithography stepper performance
TW364956B (en) * 1996-10-21 1999-07-21 Nxp Bv Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
JP2867982B2 (ja) * 1996-11-29 1999-03-10 日本電気株式会社 半導体装置の製造装置
US6445969B1 (en) * 1997-01-27 2002-09-03 Circuit Image Systems Statistical process control integration systems and methods for monitoring manufacturing processes
US6007631A (en) * 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method

Also Published As

Publication number Publication date
EP1196830B1 (de) 2003-10-08
WO2001004711A1 (en) 2001-01-18
US20020099466A1 (en) 2002-07-25
DE60005837D1 (de) 2003-11-13
JP2003504746A (ja) 2003-02-04
AU5703100A (en) 2001-01-30
EP1196830A1 (de) 2002-04-17
US6580961B2 (en) 2003-06-17
IE20000566A1 (en) 2001-02-21
IES20000567A2 (en) 2001-02-21
DE60005837T2 (de) 2004-08-19

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties