DE60004844D1 - Verfahren zur herstellung einer kontaktlosen karte - Google Patents

Verfahren zur herstellung einer kontaktlosen karte

Info

Publication number
DE60004844D1
DE60004844D1 DE60004844T DE60004844T DE60004844D1 DE 60004844 D1 DE60004844 D1 DE 60004844D1 DE 60004844 T DE60004844 T DE 60004844T DE 60004844 T DE60004844 T DE 60004844T DE 60004844 D1 DE60004844 D1 DE 60004844D1
Authority
DE
Germany
Prior art keywords
producing
contactless card
support
card
functional elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60004844T
Other languages
English (en)
Other versions
DE60004844T2 (de
Inventor
Pierre Bertrand
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Publication of DE60004844D1 publication Critical patent/DE60004844D1/de
Application granted granted Critical
Publication of DE60004844T2 publication Critical patent/DE60004844T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/154—Coating solid articles, i.e. non-hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
    • B29C48/157—Coating linked inserts, e.g. chains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/06—PVC, i.e. polyvinylchloride
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
DE60004844T 1999-05-12 2000-05-11 Verfahren zur herstellung einer kontaktlosen karte Expired - Fee Related DE60004844T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9906535A FR2793577B1 (fr) 1999-05-12 1999-05-12 Procede de fabrication d'une carte sans contact
FR9906535 1999-05-12
PCT/FR2000/001263 WO2000070555A1 (fr) 1999-05-12 2000-05-11 Procede de fabrication d'une carte sans contact

Publications (2)

Publication Number Publication Date
DE60004844D1 true DE60004844D1 (de) 2003-10-02
DE60004844T2 DE60004844T2 (de) 2004-07-08

Family

ID=9545920

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60004844T Expired - Fee Related DE60004844T2 (de) 1999-05-12 2000-05-11 Verfahren zur herstellung einer kontaktlosen karte

Country Status (11)

Country Link
US (2) US20060131433A1 (de)
EP (1) EP1192590B1 (de)
JP (1) JP2002544631A (de)
CN (1) CN1350680A (de)
AT (1) ATE248408T1 (de)
AU (1) AU4415500A (de)
DE (1) DE60004844T2 (de)
ES (1) ES2206228T3 (de)
FR (1) FR2793577B1 (de)
MX (1) MXPA01009784A (de)
WO (1) WO2000070555A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7755484B2 (en) 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
WO2006022695A1 (en) * 2004-08-09 2006-03-02 Oberthur Card Systems Sa Multi-layer cards with aesthetic features and related methods of manufacturing
FR2932711B1 (fr) 2008-06-23 2012-01-20 Michelin Soc Tech Procede et installation de fabrication d'un composant electronique enrobe de gomme.
DE102008034984C5 (de) * 2008-07-25 2018-06-14 Atlantic Zeiser Gmbh Verfahren zur Herstellung einer Kunststoffkarte
WO2015131185A1 (en) * 2014-02-28 2015-09-03 Intellipaper, Llc Integrated circuitry and methods for manufacturing same
US20160275391A1 (en) * 2014-12-10 2016-09-22 Texas Instruments Deutschland Gmbh Miniature rfid tag with coil on ic package
DE102017002861A1 (de) * 2017-03-24 2018-09-27 Giesecke+Devrient Mobile Security Gmbh Verbundfolie
GB2602265A (en) * 2020-12-17 2022-06-29 Dyson Technology Ltd Apparatus for making an electrode-electrolyte structure

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE100616T1 (de) 1988-06-21 1994-02-15 Gec Avery Ltd Herstellung von tragbaren elektronischen karten.
US5387306A (en) * 1988-06-21 1995-02-07 Gec Avery Limited Manufacturing integrated circuit cards
JPH0780346B2 (ja) * 1990-09-19 1995-08-30 凸版印刷株式会社 サインパネル及びサインパネルの製造方法
JPH07147037A (ja) * 1993-11-22 1995-06-06 Canon Inc ハイブリットカードの製造方法
KR100355209B1 (ko) * 1994-09-22 2003-02-11 로무 가부시키가이샤 비접촉형ic카드및그제조방법
DE29502080U1 (de) * 1995-02-09 1995-03-23 Interlock Ag Vorrichtung zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte
JPH08249651A (ja) * 1995-03-09 1996-09-27 Toppan Printing Co Ltd 磁気記録媒体とその製造方法
JPH08276458A (ja) * 1995-04-06 1996-10-22 Dainippon Printing Co Ltd 非接触ｉｃタグの製造方法及び非接触ｉｃタグ
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
DE19602821C1 (de) * 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
US5826328A (en) * 1996-03-25 1998-10-27 International Business Machines Method of making a thin radio frequency transponder
JPH10236041A (ja) * 1997-02-27 1998-09-08 Konica Corp Ｉｃカード用電子部品供給装置、ウェブ状部品供給媒体、ウェブ状部品供給媒体収容カートリッジ、ｉｃカード製造システム、第２ｉｃカード用シート、第２ｉｃカード用シート収容カートリッジ、ｉｃカード製造方法
JPH10302040A (ja) * 1997-04-30 1998-11-13 Toshiba Corp 薄型電子機器の製法および薄型電子機器
WO1998052772A1 (fr) * 1997-05-19 1998-11-26 Hitachi Maxell, Ltd. Module de circuit integre flexible et son procede de production, procede de production de support d'information comprenant ledit module
JPH1111055A (ja) * 1997-06-20 1999-01-19 Toshiba Corp 無線モジュール及び無線カード
JPH1148661A (ja) * 1997-08-05 1999-02-23 Hitachi Maxell Ltd 非接触ｉｃカード及びその製造方法
US6248199B1 (en) * 1999-04-26 2001-06-19 Soundcraft, Inc. Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements

Also Published As

Publication number Publication date
US20060131433A1 (en) 2006-06-22
US20070069038A1 (en) 2007-03-29
MXPA01009784A (es) 2002-05-14
ATE248408T1 (de) 2003-09-15
AU4415500A (en) 2000-12-05
ES2206228T3 (es) 2004-05-16
WO2000070555A1 (fr) 2000-11-23
EP1192590B1 (de) 2003-08-27
DE60004844T2 (de) 2004-07-08
US7374107B2 (en) 2008-05-20
CN1350680A (zh) 2002-05-22
JP2002544631A (ja) 2002-12-24
FR2793577A1 (fr) 2000-11-17
EP1192590A1 (de) 2002-04-03
FR2793577B1 (fr) 2001-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee