DE60004454D1 - Drucksensoreinheit - Google Patents

Drucksensoreinheit

Info

Publication number
DE60004454D1
DE60004454D1 DE60004454T DE60004454T DE60004454D1 DE 60004454 D1 DE60004454 D1 DE 60004454D1 DE 60004454 T DE60004454 T DE 60004454T DE 60004454 T DE60004454 T DE 60004454T DE 60004454 D1 DE60004454 D1 DE 60004454D1
Authority
DE
Germany
Prior art keywords
pressure sensor
sensor unit
unit
pressure
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60004454T
Other languages
English (en)
Other versions
DE60004454T2 (de
Inventor
Mikio Shiono
Kenichi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Application granted granted Critical
Publication of DE60004454D1 publication Critical patent/DE60004454D1/de
Publication of DE60004454T2 publication Critical patent/DE60004454T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE60004454T 1999-10-04 2000-05-31 Drucksensoreinheit Expired - Lifetime DE60004454T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28243099 1999-10-04
JP28243099A JP3640337B2 (ja) 1999-10-04 1999-10-04 圧力センサー装置

Publications (2)

Publication Number Publication Date
DE60004454D1 true DE60004454D1 (de) 2003-09-18
DE60004454T2 DE60004454T2 (de) 2004-04-15

Family

ID=17652321

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60004454T Expired - Lifetime DE60004454T2 (de) 1999-10-04 2000-05-31 Drucksensoreinheit

Country Status (4)

Country Link
US (1) US6425294B1 (de)
EP (1) EP1091201B1 (de)
JP (1) JP3640337B2 (de)
DE (1) DE60004454T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7252027B2 (en) * 2001-02-08 2007-08-07 Black & Decker Inc. Miter saw
JP2002310828A (ja) * 2001-04-19 2002-10-23 Hitachi Ltd 半導体圧力センサ
US6651319B2 (en) * 2001-09-07 2003-11-25 Visteon Global Technologies, Inc. Compliant standoff for low pressure sensing device
US6584853B2 (en) * 2001-10-12 2003-07-01 Kavlico Corporation Corrosion-proof pressure transducer
JP2004045142A (ja) 2002-07-10 2004-02-12 Shin Etsu Chem Co Ltd 半導体圧力センサ装置
JP2004198147A (ja) * 2002-12-16 2004-07-15 Toyoda Mach Works Ltd 圧力センサ
JP2005113004A (ja) 2003-10-08 2005-04-28 Shin Etsu Chem Co Ltd 半導体装置
JP2005181065A (ja) * 2003-12-18 2005-07-07 Denso Corp 半導体圧力センサ装置
JP4784743B2 (ja) * 2005-02-14 2011-10-05 信越化学工業株式会社 硬化性パーフルオロポリエーテル組成物、その硬化物を用いたゴム及びゲル製品
JP2007040772A (ja) * 2005-08-02 2007-02-15 Mitsubishi Electric Corp 半導体圧力センサ
JP5008192B2 (ja) 2006-09-08 2012-08-22 信越化学工業株式会社 パーフルオロポリエーテル−ポリオルガノシロキサン共重合体及びそれを含む表面処理剤
GB0703172D0 (en) 2007-02-19 2007-03-28 Pa Knowledge Ltd Printed circuit boards
GB2462822B (en) * 2008-08-18 2011-11-02 Crombie 123 Ltd Wire bonding
US8618420B2 (en) 2008-08-18 2013-12-31 Semblant Global Limited Apparatus with a wire bond and method of forming the same
SG193213A1 (en) 2008-08-18 2013-09-30 Semblant Ltd Halo-hydrocarbon polymer coating
DE102008042489B4 (de) * 2008-09-30 2018-07-26 Robert Bosch Gmbh Werkstückverbund sowie Verwendung des Werkstückverbundes
US8995146B2 (en) 2010-02-23 2015-03-31 Semblant Limited Electrical assembly and method
DE102011013912A1 (de) * 2011-03-15 2012-09-20 Volkswagen Aktiengesellschaft Drucksensor
US9345144B2 (en) * 2013-02-28 2016-05-17 Eastman Kodak Company Making multi-layer micro-wire structure
DE102013017317A1 (de) * 2013-10-18 2015-04-23 Endress + Hauser Flowtec Ag Messanordnung mit einem Trägerelement und einem Sensor
JP6519305B2 (ja) * 2015-05-11 2019-05-29 富士電機株式会社 封止材用シリコーン樹脂組成物及び該組成物を用いたパワー半導体モジュール
WO2017141460A1 (ja) * 2016-02-15 2017-08-24 京セラ株式会社 圧力センサ
GB201621177D0 (en) 2016-12-13 2017-01-25 Semblant Ltd Protective coating
JP6922244B2 (ja) * 2017-02-17 2021-08-18 富士電機株式会社 半導体物理量センサ装置の製造方法および半導体物理量センサ装置の試験方法
JP7188692B2 (ja) * 2018-08-24 2022-12-13 公立大学法人大阪 温度センサ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62228926A (ja) * 1986-03-31 1987-10-07 Hitachi Ltd 半導体式圧力センサ
JPS638523A (ja) * 1986-06-30 1988-01-14 Hitachi Ltd 半導体圧力センサ
JPH01189539A (ja) * 1988-01-25 1989-07-28 Hitachi Ltd 半導体圧力センサ
JP3092307B2 (ja) * 1992-04-16 2000-09-25 富士電機株式会社 半導体圧力センサ
US5747694A (en) * 1995-07-28 1998-05-05 Nippondenso Co., Ltd. Pressure sensor with barrier in a pressure chamber
JP3239717B2 (ja) * 1995-09-29 2001-12-17 信越化学工業株式会社 硬化性組成物
JP3671563B2 (ja) * 1996-12-09 2005-07-13 株式会社デンソー モールドｉｃをケースに固定した構造の半導体装置
JP3487744B2 (ja) * 1997-10-09 2004-01-19 信越化学工業株式会社 硬化性組成物
JPH11172108A (ja) * 1997-12-12 1999-06-29 Shin Etsu Chem Co Ltd 導電性フッ素樹脂組成物
JP3475760B2 (ja) * 1997-12-24 2003-12-08 信越化学工業株式会社 硬化性組成物及びゲル硬化物

Also Published As

Publication number Publication date
JP3640337B2 (ja) 2005-04-20
EP1091201A2 (de) 2001-04-11
EP1091201B1 (de) 2003-08-13
US6425294B1 (en) 2002-07-30
DE60004454T2 (de) 2004-04-15
JP2001099737A (ja) 2001-04-13
EP1091201A3 (de) 2001-06-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: LINDNER BLAUMEIER PATENT- UND RECHTSANWAELTE, 9040