DE59812650D1 - Hydrophobes Epoxidharzsystem - Google Patents

Hydrophobes Epoxidharzsystem

Info

Publication number
DE59812650D1
DE59812650D1 DE59812650T DE59812650T DE59812650D1 DE 59812650 D1 DE59812650 D1 DE 59812650D1 DE 59812650 T DE59812650 T DE 59812650T DE 59812650 T DE59812650 T DE 59812650T DE 59812650 D1 DE59812650 D1 DE 59812650D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin system
hydrophobic epoxy
hydrophobic
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59812650T
Other languages
German (de)
English (en)
Inventor
Christian Beisele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Huntsman Advanced Materials Switzerland GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Switzerland GmbH filed Critical Huntsman Advanced Materials Switzerland GmbH
Application granted granted Critical
Publication of DE59812650D1 publication Critical patent/DE59812650D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
DE59812650T 1997-08-27 1998-08-18 Hydrophobes Epoxidharzsystem Expired - Lifetime DE59812650D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH199797 1997-08-27

Publications (1)

Publication Number Publication Date
DE59812650D1 true DE59812650D1 (de) 2005-04-21

Family

ID=4223487

Family Applications (1)

Application Number Title Priority Date Filing Date
DE59812650T Expired - Lifetime DE59812650D1 (de) 1997-08-27 1998-08-18 Hydrophobes Epoxidharzsystem

Country Status (6)

Country Link
US (1) US6048946A (https=)
EP (1) EP0899304B1 (https=)
JP (1) JP4196365B2 (https=)
CA (1) CA2245469A1 (https=)
DE (1) DE59812650D1 (https=)
ES (1) ES2237832T3 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU767776B2 (en) * 1998-12-09 2003-11-27 Vantico Ag Hydrophobic epoxide resin system
US6764616B1 (en) 1999-11-29 2004-07-20 Huntsman Advanced Materials Americas Inc. Hydrophobic epoxide resin system
US6632892B2 (en) * 2001-08-21 2003-10-14 General Electric Company Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst
DE10144871A1 (de) * 2001-09-12 2003-03-27 Bosch Gmbh Robert Vergußmasse mit hoher thermischer Stabilität
EP1354916A1 (de) * 2002-04-17 2003-10-22 Abb Research Ltd. Selbstheilende Epoxidharze für die Herstellung von elektrischen Isolierungen
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
US7989704B2 (en) * 2005-07-20 2011-08-02 Areva T&D Sa Electric insulator and a method for the production thereof
CN100462384C (zh) * 2006-06-22 2009-02-18 上海交通大学 一种环氧真空压力浸渍树脂的制备方法
US7879944B2 (en) * 2006-09-20 2011-02-01 E.I. Du Pont De Nemours And Company Paintable thermoplastic compositions
CN101440268B (zh) * 2008-12-30 2012-06-27 黑龙江省科学院石油化学研究院 低温固化耐高温无机/有机杂化环氧胶粘剂及其制备方法
AU2012301382B2 (en) 2011-08-31 2016-06-09 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Use of hydrophobic epoxide resin system for encapsulation of a instrument transformer
PL2797980T3 (pl) 2011-12-30 2017-07-31 Dow Global Technologies Llc Kompozycje epoksydowe kompatybilizowane funkcjonalnym silanem do zastosowań do izolacji
EP3484939B1 (en) * 2016-07-12 2021-06-02 ABB Power Grids Switzerland AG Use of an epoxy resin composition and power product with epoxy resin composition
JP6897041B2 (ja) * 2016-09-23 2021-06-30 昭和電工マテリアルズ株式会社 配線板用樹脂組成物、プリプレグ、積層板及び配線板
BR112020018692B1 (pt) 2018-03-16 2024-04-30 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Composições de resina estável em armazenamento e de resina curável, processo para obter uma composição de resina estável em armazenamento e de resina curável, artigo curado, e, usos de um artigo curado e de uma composição de resina curável

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926885A (en) * 1974-12-23 1975-12-16 Dow Corning Siloxane-modified epoxy resin compositions
US4332923A (en) * 1980-10-23 1982-06-01 Dow Corning Corporation Composition for coating heat sensitive substrates
JP2927817B2 (ja) * 1989-05-19 1999-07-28 日東電工株式会社 半導体装置
JPH03277654A (ja) * 1990-03-27 1991-12-09 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH0433914A (ja) * 1990-05-30 1992-02-05 Sunstar Eng Inc 液状エポキシ樹脂組成物
US5523374A (en) * 1992-12-03 1996-06-04 Hercules Incorporated Curable and cured organosilicon compositions
JP3923542B2 (ja) * 1994-04-08 2007-06-06 株式会社東芝 樹脂モールド品及びそれを用いた重電機器

Also Published As

Publication number Publication date
EP0899304A3 (de) 2001-09-19
US6048946A (en) 2000-04-11
JP4196365B2 (ja) 2008-12-17
EP0899304B1 (de) 2005-03-16
ES2237832T3 (es) 2005-08-01
JPH11147942A (ja) 1999-06-02
EP0899304A2 (de) 1999-03-03
CA2245469A1 (en) 1999-02-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PFENNING MEINIG & PARTNER GBR, 80339 MUENCHEN

8328 Change in the person/name/address of the agent

Representative=s name: MAIWALD PATENTANWALTSGESELLSCHAFT MBH, 80335 MUENC