DE59807643D1 - Verfahren zur selektiven Abscheidung einer Metallschicht - Google Patents
Verfahren zur selektiven Abscheidung einer MetallschichtInfo
- Publication number
- DE59807643D1 DE59807643D1 DE59807643T DE59807643T DE59807643D1 DE 59807643 D1 DE59807643 D1 DE 59807643D1 DE 59807643 T DE59807643 T DE 59807643T DE 59807643 T DE59807643 T DE 59807643T DE 59807643 D1 DE59807643 D1 DE 59807643D1
- Authority
- DE
- Germany
- Prior art keywords
- metal layer
- selective deposition
- selective
- deposition
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19748888 | 1997-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59807643D1 true DE59807643D1 (de) | 2003-04-30 |
Family
ID=7847699
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19851101A Ceased DE19851101A1 (de) | 1997-11-05 | 1998-11-05 | Verfahren zur selektiven Abscheidung einer Metallschicht |
DE59807643T Expired - Fee Related DE59807643D1 (de) | 1997-11-05 | 1998-11-05 | Verfahren zur selektiven Abscheidung einer Metallschicht |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19851101A Ceased DE19851101A1 (de) | 1997-11-05 | 1998-11-05 | Verfahren zur selektiven Abscheidung einer Metallschicht |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0926262B1 (de) |
DE (2) | DE19851101A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002004705A1 (fr) * | 1999-01-20 | 2002-01-17 | National Institute Of Advanced Industrial Science And Technology | Procede de traitement preliminaire d'un materiau devant etre soumis a un depot autocatalytique |
DE19957130A1 (de) | 1999-11-26 | 2001-05-31 | Infineon Technologies Ag | Metallisierungsverfahren für Dielektrika |
DE10015214C1 (de) | 2000-03-27 | 2002-03-21 | Infineon Technologies Ag | Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums |
DE10015213C1 (de) * | 2000-03-27 | 2001-09-27 | Infineon Technologies Ag | Verfahren zur Metallisierung zumindest einer Isolierschicht eines Bauelements |
DE102004017440A1 (de) * | 2004-04-08 | 2005-11-03 | Enthone Inc., West Haven | Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen |
EP2581469B1 (de) * | 2011-10-10 | 2015-04-15 | Enthone, Inc. | Wässrige Aktivierungslösung und Verfahren zur stromlosen Kupferabscheidung auf direkt laserstrukturierten Substraten |
DE102013216745B4 (de) | 2013-08-23 | 2015-10-22 | Schaeffler Technologies AG & Co. KG | Wälzlagerkäfig |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD228835A1 (de) * | 1984-09-14 | 1985-10-23 | Mittweida Ing Hochschule | Laseraktivierung von dielektrischen oberflaechen zur partiellen chemischreduktiven metallabscheidung |
US4615907A (en) * | 1984-11-23 | 1986-10-07 | Phillips Petroleum Company | Plating poly(arylene sulfide) surfaces |
-
1998
- 1998-11-05 EP EP98121020A patent/EP0926262B1/de not_active Expired - Lifetime
- 1998-11-05 DE DE19851101A patent/DE19851101A1/de not_active Ceased
- 1998-11-05 DE DE59807643T patent/DE59807643D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE19851101A1 (de) | 1999-05-06 |
EP0926262A1 (de) | 1999-06-30 |
EP0926262B1 (de) | 2003-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |