DE4136075C2 - - Google Patents

Info

Publication number
DE4136075C2
DE4136075C2 DE4136075A DE4136075A DE4136075C2 DE 4136075 C2 DE4136075 C2 DE 4136075C2 DE 4136075 A DE4136075 A DE 4136075A DE 4136075 A DE4136075 A DE 4136075A DE 4136075 C2 DE4136075 C2 DE 4136075C2
Authority
DE
Germany
Prior art keywords
shaped
conductive body
sandwich
heating plates
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4136075A
Other languages
German (de)
English (en)
Other versions
DE4136075A1 (de
DE4136075C3 (de
Inventor
Wolfgang 1000 Berlin De Funck
Frank Dr. 1000 Berlin De Arndt
Helmut Dr. 1000 Berlin De Schlaak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE4136075A priority Critical patent/DE4136075C3/de
Publication of DE4136075A1 publication Critical patent/DE4136075A1/de
Publication of DE4136075C2 publication Critical patent/DE4136075C2/de
Application granted granted Critical
Publication of DE4136075C3 publication Critical patent/DE4136075C3/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques

Landscapes

  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Products (AREA)
  • Surface Heating Bodies (AREA)
DE4136075A 1991-10-30 1991-10-30 Verfahren zum Verbinden eines scheibenförmigen Isolierkörpers mit einem scheibenförmigen, leitfähigen Körper Expired - Fee Related DE4136075C3 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4136075A DE4136075C3 (de) 1991-10-30 1991-10-30 Verfahren zum Verbinden eines scheibenförmigen Isolierkörpers mit einem scheibenförmigen, leitfähigen Körper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4136075A DE4136075C3 (de) 1991-10-30 1991-10-30 Verfahren zum Verbinden eines scheibenförmigen Isolierkörpers mit einem scheibenförmigen, leitfähigen Körper

Publications (3)

Publication Number Publication Date
DE4136075A1 DE4136075A1 (de) 1993-05-06
DE4136075C2 true DE4136075C2 (enExample) 1993-08-12
DE4136075C3 DE4136075C3 (de) 1999-05-20

Family

ID=6443915

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4136075A Expired - Fee Related DE4136075C3 (de) 1991-10-30 1991-10-30 Verfahren zum Verbinden eines scheibenförmigen Isolierkörpers mit einem scheibenförmigen, leitfähigen Körper

Country Status (1)

Country Link
DE (1) DE4136075C3 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475326B2 (en) 2000-12-13 2002-11-05 Applied Materials, Inc. Anodic bonding of a stack of conductive and glass layers
EP1460037A1 (en) * 2003-03-18 2004-09-22 SensoNor asa A multi-layer device and method for producing the same
JP4380264B2 (ja) 2003-08-25 2009-12-09 カシオ計算機株式会社 接合基板及び基板の接合方法
KR100821413B1 (ko) 2004-03-23 2008-04-11 가시오게산키 가부시키가이샤 적층구조 및 그 제조방법
JP2005270727A (ja) * 2004-03-23 2005-10-06 Casio Comput Co Ltd スタック構造の製造方法及びスタック構造

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) * 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
US3615946A (en) * 1967-12-01 1971-10-26 Gen Electric Method of embedding semiconductor chip within a dielectric layer flush with surface
JPS5516228A (en) * 1978-07-21 1980-02-04 Hitachi Ltd Capacity type sensor
US4424713A (en) * 1982-06-11 1984-01-10 General Signal Corporation Silicon diaphragm capacitive pressure transducer
DE3436001A1 (de) * 1984-10-01 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Elektrostatisches glasloeten von halbleiterbauteilen

Also Published As

Publication number Publication date
DE4136075A1 (de) 1993-05-06
DE4136075C3 (de) 1999-05-20

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
D4 Patent maintained restricted
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee