DE4103834C2 - - Google Patents
Info
- Publication number
- DE4103834C2 DE4103834C2 DE19914103834 DE4103834A DE4103834C2 DE 4103834 C2 DE4103834 C2 DE 4103834C2 DE 19914103834 DE19914103834 DE 19914103834 DE 4103834 A DE4103834 A DE 4103834A DE 4103834 C2 DE4103834 C2 DE 4103834C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- copper
- structuring
- etching
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 20
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 239000004020 conductor Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 9
- 238000002955 isolation Methods 0.000 description 4
- 239000004922 lacquer Substances 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19914103834 DE4103834A1 (de) | 1991-02-08 | 1991-02-08 | Verfahren zur herstellung von leiterplatten |
| JP4051915A JPH05291730A (ja) | 1991-02-08 | 1992-03-10 | プリント回路板製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19914103834 DE4103834A1 (de) | 1991-02-08 | 1991-02-08 | Verfahren zur herstellung von leiterplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE4103834A1 DE4103834A1 (de) | 1992-08-13 |
| DE4103834C2 true DE4103834C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-11-12 |
Family
ID=6424646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19914103834 Granted DE4103834A1 (de) | 1991-02-08 | 1991-02-08 | Verfahren zur herstellung von leiterplatten |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH05291730A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| DE (1) | DE4103834A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5580466A (en) * | 1993-04-14 | 1996-12-03 | Hitachi Construction Machinery Co., Ltd. | Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device |
| DE4417245A1 (de) * | 1994-04-23 | 1995-10-26 | Lpkf Cad Cam Systeme Gmbh | Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten |
| EP0727925A1 (de) * | 1995-02-14 | 1996-08-21 | Lpkf Cad/Cam Systeme Gmbh | Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten |
| WO1998015159A1 (de) * | 1996-09-30 | 1998-04-09 | Siemens S.A. | Verfahren zur bildung von mindestens zwei verdrahtungsebenen auf elektrisch isolierenden unterlagen |
| DE19913367C1 (de) * | 1999-03-24 | 2000-12-14 | Siemens Ag | Verfahren zur Herstellung einer elektrischen Schaltung |
| JP4759172B2 (ja) * | 2001-07-05 | 2011-08-31 | リコーマイクロエレクトロニクス株式会社 | 基板製造方法 |
| US6822332B2 (en) | 2002-09-23 | 2004-11-23 | International Business Machines Corporation | Fine line circuitization |
| DE102006010942B4 (de) * | 2006-03-09 | 2017-02-09 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung mindestens einer elektrisch leitenden Struktur sowie elektrisch leitende Struktur |
| JP2008016507A (ja) * | 2006-07-03 | 2008-01-24 | Toshiba Tec Corp | 電気配線の製造方法 |
| WO2012148332A1 (en) * | 2011-04-29 | 2012-11-01 | Telefonaktiebolaget L M Ericsson (Publ) | Manufacturing method for printed circuit boards |
| CN102974937B (zh) * | 2012-11-12 | 2015-04-15 | 中国科学院半导体研究所 | 基于超声定位的激光加工装置及加工方法 |
| CN103203541B (zh) * | 2013-02-04 | 2015-05-13 | 张立国 | 一种激光加工装置 |
| CN103353709A (zh) * | 2013-08-01 | 2013-10-16 | 北京弘浩千瑞科技有限公司 | 一种用于印刷线路板生产的掩膜光刻机 |
| DE102016103047A1 (de) * | 2016-02-22 | 2017-08-24 | Itz Innovations- Und Technologiezentrum Gmbh | Herstellungsverfahren für eine Leuchtenkomponente und mit dem Verfahren hergestellte Leuchtenkomponente |
| JP2020136638A (ja) * | 2019-02-26 | 2020-08-31 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
| CN115348741A (zh) * | 2022-08-31 | 2022-11-15 | 陈旭东 | 减成法细线路电路板制造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3113855A1 (de) * | 1981-04-06 | 1982-10-21 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Verfahren zur herstellung von leiterplatten |
| NO894656L (no) * | 1989-02-07 | 1990-08-08 | Autodisplay As | Fremgangsmaate for fremstilling av et elektrodemoenster paa et substrat. |
| US4909895A (en) * | 1989-04-11 | 1990-03-20 | Pacific Bell | System and method for providing a conductive circuit pattern utilizing thermal oxidation |
-
1991
- 1991-02-08 DE DE19914103834 patent/DE4103834A1/de active Granted
-
1992
- 1992-03-10 JP JP4051915A patent/JPH05291730A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE4103834A1 (de) | 1992-08-13 |
| JPH05291730A (ja) | 1993-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |