DE3920686C2 - Stromschienen-Leiterplatte - Google Patents

Stromschienen-Leiterplatte

Info

Publication number
DE3920686C2
DE3920686C2 DE19893920686 DE3920686A DE3920686C2 DE 3920686 C2 DE3920686 C2 DE 3920686C2 DE 19893920686 DE19893920686 DE 19893920686 DE 3920686 A DE3920686 A DE 3920686A DE 3920686 C2 DE3920686 C2 DE 3920686C2
Authority
DE
Germany
Prior art keywords
circuit board
busbar
flat
insulating
upright
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19893920686
Other languages
German (de)
English (en)
Other versions
DE3920686A1 (de
Inventor
Kazuhiro Watanabe
Makoto Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of DE3920686A1 publication Critical patent/DE3920686A1/de
Application granted granted Critical
Publication of DE3920686C2 publication Critical patent/DE3920686C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Or Junction Boxes (AREA)
  • Multi-Conductor Connections (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE19893920686 1988-06-30 1989-06-23 Stromschienen-Leiterplatte Expired - Fee Related DE3920686C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8571988U JPH0210723U (enrdf_load_stackoverflow) 1988-06-30 1988-06-30

Publications (2)

Publication Number Publication Date
DE3920686A1 DE3920686A1 (de) 1990-01-04
DE3920686C2 true DE3920686C2 (de) 1994-06-01

Family

ID=13866648

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19893920686 Expired - Fee Related DE3920686C2 (de) 1988-06-30 1989-06-23 Stromschienen-Leiterplatte

Country Status (3)

Country Link
JP (1) JPH0210723U (enrdf_load_stackoverflow)
DE (1) DE3920686C2 (enrdf_load_stackoverflow)
FR (1) FR2633785B1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19518522A1 (de) * 1995-05-19 1996-11-21 Siemens Ag Steuergerät für ein Kraftfahrzeug
DE10055436B4 (de) * 1999-11-11 2005-06-23 Yazaki Corp. Kühlverguss für ein elektrisches Bauteil

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087777Y2 (ja) * 1989-08-14 1996-03-04 古河電気工業株式会社 電気接続箱
FR2803113B1 (fr) * 1999-12-22 2002-05-17 Valeo Securite Habitacle Module electrique de serrure de vehicule automobile, et procede pour sa fabrication
JP2002374607A (ja) * 2001-06-14 2002-12-26 Sumitomo Wiring Syst Ltd 電気接続箱におけるバスバーの配線構造
JP3867525B2 (ja) * 2001-07-09 2007-01-10 住友電装株式会社 電気接続箱
KR20130126985A (ko) * 2011-04-19 2013-11-21 가부시키가이샤 도요다 지도숏키 배선 기판
JP2014220925A (ja) * 2013-05-09 2014-11-20 住友電装株式会社 リレーユニット

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729816A (en) * 1971-12-02 1973-05-01 Western Electric Co Method of forming a circuit
US4215361A (en) * 1978-09-12 1980-07-29 Aavid Engineering, Inc. Winged self-fastened heat sinks for semiconductor devices
DE3123201A1 (de) * 1981-06-11 1983-01-05 Siemens AG, 1000 Berlin und 8000 München Gehaeuseloses, senkrecht steckbares single-in-line-schaltungsmodul
DE3048451C2 (de) * 1980-12-22 1985-05-15 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Zentralelektrik für Kraftfahrzeuge
JPS5926752U (ja) * 1982-08-10 1984-02-18 ライオン株式会社 容器とキヤツプとの嵌合構造
JPS59214125A (ja) * 1983-05-20 1984-12-04 日本電気株式会社 電磁継電器
US4689718A (en) * 1986-04-04 1987-08-25 United Technologies Automotive, Inc. Programmable junction box
JPS63144710A (ja) * 1986-12-04 1988-06-16 矢崎総業株式会社 自動車の機能組込型配線装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19518522A1 (de) * 1995-05-19 1996-11-21 Siemens Ag Steuergerät für ein Kraftfahrzeug
DE10055436B4 (de) * 1999-11-11 2005-06-23 Yazaki Corp. Kühlverguss für ein elektrisches Bauteil

Also Published As

Publication number Publication date
FR2633785A1 (fr) 1990-01-05
JPH0210723U (enrdf_load_stackoverflow) 1990-01-23
DE3920686A1 (de) 1990-01-04
FR2633785B1 (fr) 1993-03-05

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee